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Welcome to GlobalSpec!
Find parts, products, suppliers, datasheets, and more for:
Microelectronic Packaging Materials
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Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Supplier: Terra Universal, Inc.Description: shipping (with proper packaging material) Foot-pedal ensures simple, hands-free operation This compact, quiet vacuum sealer can be used with or without vacuum and gas purging to provide safe packaging of sensitive microelectronic components. It features adjustable dwell time for heat and cool
- Machine Type: Sealing Machines
- Goods: Consumer Packaging
- Packaging: Bag / Pouch
- Closing Method: Heat Seal
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Supplier: Epoxy TechnologyDescription: A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a lower viscosity version of EPO-TEK® H61.
- Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Master Bond, Inc.Description: is particularly desirable for aerospace and defense applications as well as microelectronic assemblies. It is formulated to cure at room temperature or more rapidly at elevated temperatures and has a ten-to-one (10:1) mix ratio by weight. Other attractive properties include superb dimensional
- Material Form: Adhesive, Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors, Electrical Power / HV
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Supplier: JIT Global Enterprises, Inc.Description: of an inch. We can stamp a wide range of material types including: bronze, phos bronze, copper, brass, stainless steel, and precious metals. The ability to maintain close tolerances allows us to do work in the aerospace, medical, military and microelectronic fields. Our fully outfitted, in-house
- Main Capabilities: Blanking / Piercing, Fine Blanking, Progressive Dies
- Additional Capabilities: Drilling / Tapping, EDM Cutting, Grinding, Painting / Powder Coating, Tool Making, CNC Machining, Water / Abrasive Jet Cutting, Welding
- Materials: Ferrous Metals, Nonferrous Metals, Exotic Metals and Alloys, Precious Metals
- Services: Assembly Services, Engineering / Design Assistance, Prototype / Short Run, High Volume Production, Specialty Packaging
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Supplier: ABX Engineering, Inc.Description: • Complete Turnkey and/or Consignment • Quick-turn, NPI (new product introduction) Prototype, Low to High Volume Manufacturing • ICT, Analog, RF and Digital Functional Test • Mechanical Engineering Design, DFM and DFT ABX Technology Solutions Materials - Extensive
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services
- Testing Services: Automated Optical Inspection, Functional Testing, In-circuit Testing, X-Ray Testing
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Chip On Board, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling, Other
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Supplier: STACIDescription: services, including final testing and retail packaging. Utilizing production facilities in the United States and Asia, STACI can work with customers to service them from the optimal location depending upon the customer’s need for turn-around time, volume and proximity. STACI can also work
- Testing Services: Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Chip On Board, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn
- Material Acquisition: Customer Supplied, Vendor Supplied
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Supplier: Small Parts, Inc.Description: also offer excellent resistance to snags and punctures, abrasions and cuts for a thin polymer glove. Ideal applications: electronics assembly, handling sensitive parts and materials, pharmaceutical manufacturing, product protection in handling: cosmetics packaging , optical goods , microelectronic
- Clothing Type: Gloves
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Supplier: Terra Universal, Inc.Description: shipping (with proper packaging material) Foot-pedal ensures simple, hands-free operation This compact, quiet vacuum sealer can be used with or without vacuum and gas purging to provide safe packaging of sensitive microelectronic components. It features adjustable dwell time for heat and cool
- Machine Type: Sealing Machines
- Goods: Consumer Packaging
- Packaging: Bag / Pouch
- Closing Method: Heat Seal
-
Supplier: Terra Universal, Inc.Description: shipping (with proper packaging material) Foot-pedal ensures simple, hands-free operation This compact, quiet vacuum sealer can be used with or without vacuum and gas purging to provide safe packaging of sensitive microelectronic components. It features adjustable dwell time for heat and cool
- Machine Type: Sealing Machines
- Goods: Consumer Packaging
- Packaging: Bag / Pouch
- Closing Method: Heat Seal
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Supplier: Epoxy TechnologyDescription: A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a lower viscosity version of EPO-TEK® H61.
- Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
Featured Products for Microelectronic Packaging Materials Top
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To compliment DDL's Medical Device Packaging Testing, DDL's Product and Materials Testing Division can take your package design and packaging testing to a deeper level by testing the materials that make up the package itself. From plastic films to adhesives, foams to metals we can assist with your testing needs and help you better understand your options in packaging materials. The effects of aging, different sterilization treatments and different material sources can all be explored through... (read more) -
When the job has been completed, the entire package is disposed of: no clean up or physical contact with the resin. Cost savings are achieved by reducing labor and material waste. Reliability is increased with accurate compound ratios, complete mixing and proper application techniques. Three types of kits are available: Barrier, Injection and Barrier/Injection types. Barrier Type. For compounds with a volumetric ratio greater than 10 parts per 100. The catalyst and base are separated... (read more) -
Indium Corporation manufactures custom semiconductor assembly materials and semiconductor packaging materials to match your specifications. (read more) -
You will see throughout our website and in our catalogs that we specify our stock tubing in standard lengths and packaging. Our "J-Bags" typically hold 50 or 100 feet. Our "A-Reels" typically hold 500-2000 feet of tubing. We can customize this for you to meet your specific needs. Need a different length? Do you have a package requirement? Just ask us. It's all about us being your Worry-Free source for plastic tubing. (read more) -
a success. We offer many types of materials that we make retail packaging from in our thermoforming process, they include HIPS, PET, PETG and PLA to name a few. Click on "New Part Request!." Link above to start your idea for a retail product package and make it a retail package that will have your customers wanting more product. Our retail packaging expertise focuses on the following segments: Sporting Goods packaging. Do-it-yourself product packaging. Home & Hardware product packaging. Cosmetic... (read more) -
. The process typically follows this pattern: 1. Application Analysis. 2. Manufacturing and Packaging Environment Analysis. 3. Material and Equipment Selection. 4. Qualification. 5. Installation. 6. Validation. Materials Available. Bubble Pack. Linear Low Density Polyethylene (LLDPE)Co-Extrusion. Low Density Polyethylene (LDPE)Conductive. High Strength/Barrier Films & Laminates. Custom Laminates. Photo Black. Composition Materials. Static Dissipative. Flexible Foam. Static Shielding... (read more) -
LINDAR is a manufacturer of various food packaging items. We offer a wide range of food packaging; some containers specifically developed for products and applications and other food items that can be used for many different products and applications. At LINDAR our food packaging containers can be made of various plastics such as PET, PLA, PP or HIPS to mention a few of the plastics that we form. We work with different plastics materials because many of our customers have different and specific... (read more) -
of Ellsworth, Kitpackers guarantees that Ellsworth can respond to the needs of our customers immediately if necessary. The many advantages to our specialized custom packaging include: Single Component, Multi-Component Reactive Resin Systems In-house Chemists and Quality Control Programs All Types of Packaging Available. Single Component Squeeze Bottles Mono Paks Foil Tubes Cartridges Syringes. Multi-Component Barrier Kits Injection Kits Twin Paks Dual Syringes Dual Cartridges Premixed and Frozen... (read more) -
SCHOTT designs and develops glass and ceramic-to-metal seals (GTMS, CerTMS), special glasses and other types of electronic packaging and housing technologies for the defense and security industries. SCHOTT's decades of military business experience and superior technological know-how ensure that these technologies provide exceptional levels of functional safety and protection to sensitive electronic devices and with critical power and instrument line penetrations. SCHOTT's hermetic housing... (read more) -
PROTECTIVE FOAM FOR PACKAGING. Are you looking for a packaging solution? Not sure what you need? You're not alone! The world of high-volume packaging is filled with a diverse range of products and materials. So, how do you determine the best choice for your needs? It's not an easy decision to make, but it may well be a critical component of your bottom-line success. - The right packaging ensures that your product safely reaches its destination. Poor packaging choices result in broken products... (read more)
Parts by Number for Microelectronic Packaging Materials Top
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 12A763 | Grainger Industrial Supply | BERNARD WELDING | MIG Gun Consumables | Screw, Type Set Screw, Style Ball Point, Size H=.5625,W=.535,D=.5625, Material Brass, For Use With Q-Guns, Package Quantity 1 |
| 13F303 | Grainger Industrial Supply | CARLISLE SANITARY MAINTENANCE PROD | Food Storage, Inserts, and Covers | StorPlus Round Container, Capacity (Qt.) 8, Overall Height (In.) 10.75, Outside Dia. (In.) 10.12, Color Clear, Material Polycarbonate, Package Quantity 12 |
Conduct Research Top
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
and assembly of three opto-electronic devices, including Fiber Optics, LEDs,. and LCDss. In fiber optics, you need epoxy for the cable and for the opto-packaging. The fiber optic components. are usually packaged in hybrid technology, which mean several micro-electronic grade joining materials...
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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. Containing over 80 tables and 120 figures which provide a wealth of data on properties, performance, and reliability, this comprehensive book covers all aspects of adhesive technology for microelectronic devices...
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MICRO: Special Apps
in microelectronic device fabrication. Manufacturers choose which material to use for specific applications based on the many different electrical and mechanical properties that must be optimized to fabricate conductor layers or to perform interconnect tasks. These essential properties include film electrical...
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Using MEMS to Control Blending at AstraZeneca
that the now-bulky optical/mechanical part of a spectrometer can be miniaturized to match the microelectronic solutions that are currently available. This combination produces a combined microoptic-micromechanical-microelectronic system. Advantages of MEMS-based NIR spectrometers are their small size...
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MICRO:February 1998:Industry News:World Beat
has entered the Taiwanese semiconductor market. The Ohio-based company established Tosoh SMD Taiwan last October with Tosoh Specialty Materials of Yamagata, Japan. The start-up will begin manufacturing targets this year with the addition of specialists in machining, cleaning, and packaging. General...
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MICRO:June 98:Semicon West Exhibitors - page 2
Cost Associated with CMP Consumables Ara Philipossian, Intel Performance Characteristics of a Low-k ILD CMP Planarization Process David Bang and Steven C. Avanzino, AMD; and Dan Towery, Pepito Galvez, and Michael A. Fury, AlliedSignal Advanced Microelectronic Materials Control and Measurement...
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Semicon West Puts Photovoltaics, Thin-Film Batteries in the Limelight
and short courses. Among the offerings this year are workshops on wire bonding and assembly in microelectronic packaging, waferlevel packaging, high-density packaging, low-cost flip chips, WLCSP, and lead-free technologies. Wafer processing sessions will cover 32 and 22-nm lithography, sustainability...
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Handling of Pyroelectric Detectors (.pdf)
electronic devices of the circuitry. Handle detectors in an ESD Protected Area (EPA). Transport and store detectors in their original packaging, otherwise connect (<10 MOhm) all leads of the. unprocessed detectors during transport and storage. Avoid exposing unassembled detectors to temperature ramps > |1 K...
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SEMICON EUROPA EXHIBITOR LIST
p.m. Wednesday, April 1 10 a.m. 5 p.m. Thursday, April 2 10 a.m. 4 p.m. O OAI (Optical Associates) 493, 1447A Oak Technical 362 Okamoto-Shibayama 947 Okmetic 1309 Olin Microelectronic Materials 1151 Olympus Optical 1414 OnTrak Systems 647 Opmaxx 1350 Optem 232 Optical...
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MICRO:Semicon West '99 (June '99)
..........10030 JMAR Precision Systems..........9710 Johnson Matthey Electronics..........9516 Johnstech International..........11744 JSR Microelectronics..........10732 K&S Packaging Materials..........10016C Kaijo ..........11714B Kanematsu..........11013 Karl Suss..........11214 Keithley...
Engineering Web Search: Microelectronic Packaging Materials Top
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Intel Technology Journal Materials Technology for Environmentally Green Micro-electronic Packaging See Intel Corporation Information |
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Intel Technology Journal Materials Technology for Environmentally Green Micro-electronic Packaging See Intel Corporation Information |
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Microelectronic Materials And Processing | Texas Materials... Microelectronic Materials Topics at Texas Materials Institute |
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Welcome to the Microelectronics Research Center |
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SEMI - Home | SEMI.ORG Materials Market Packaging Market Fab Database Semiconductor Packaging Materials Market to Reach $25.7 Billion by 2015 See Semiconductor Equipment and Materials International (SEMI) Information |
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Sandia MEMS Home Page Distinguishing strengths include materials growth and development, device and product design, fabrication technologies for silicon and compound |
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Microelectromechanical systems - Wikipedia, the free... 1 Materials for MEMS manufacturing 1.1 Silicon |
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Transistor - Wikipedia, the free encyclopedia 6.2 Packaging 7 See also 8 Directory of external websites with datasheets |
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AMETEK Home Page Microelectronic Packaging Plastics Compounding Connectors, Metals & Engineered Systems & Materials See AMETEK, Inc. Information |
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SJSU Catalog : Departments : Chemical and Materials Engineering Department : Courses : MATE 234: Microelectronic Packaging Materials Science |
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