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Microelectronic Tape

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Products/Services for Microelectronic Tape

  • Semiconducting Materials-Image
    Semiconducting Materials - (235 companies)
    Semiconductors (metalloids) or semiconductor materials are used to fabricate microelectronic and optoelectronic devices such as transistors, photodetectors or solar cells. Semiconductors and semiconductor materials are used to fabricate... Learn More
  • Electrical and Electronic Resins-Image
    Electrical and Electronic Resins - (451 companies)
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor... Search by Specification | Learn More
  • No Image Available
    Insulating Varnishes and Impregnating Resins - (22 companies)
    Insulating varnishes and impregnating resins are designed for applications that require a low-viscosity resin or varnish for coil impregnation or magnet wire coating insulation. The resin may infiltrate the coil or electrical device through dipping, trick Search by Specification | Learn More
  • Encapsulants and Potting Compounds-Image
    Encapsulants and Potting Compounds - (221 companies)
    ...insulation and other specialized characteristics. Encapsulants and potting compounds belong to a broader category of electrical resins and electronic compounds that includes adhesives, greases, gels, pads, stock shapes, gaskets, tapes, and thermal... Search by Specification | Learn More
  • Thermal Compounds and Thermal Interface Materials-Image
    Thermal Compounds and Thermal Interface Materials - (147 companies)
    ...either between components or within a finished product. Thermally conductive resins, tapes, adhesives, greases, and compounds are often used between a heat-generating electrical device and a heat sink to improve heat dissipation. Two-part... Search by Specification | Learn More
  • Electrical Insulation and Dielectric Materials - (530 companies)
    ...rock stock, rope or cordage, roving or yarn, sleeves or warps, sputtering targets, tapes, tiles, varnishes, wafers, webbing, and woven products. Electrical insulation and dielectric materials are used in a variety of applications and industries... Search by Specification | Learn More
  • Field-Programmable Gate Arrays (FPGA) - (113 companies)
    ...package (QFP), single in-line package (SIP), and dual in-line package (DIP). Many packaging variants are available. For example, BGA variants include plastic-ball grid array (PBGA) and tape-ball grid array (TBGA). QFP variants include low-profile quad... Search by Specification | Learn More
  • DRAM and SDRAM Memory Chips - (207 companies)
    ...array (BGA), quad flat package (QFP), single in-line package (SIP), and dual in-line package (DIP). Many packaging variants are available. For example, BGA variants include plastic-ball grid array (PBGA) and tape-ball grid array (TBGA). QFP variants... Learn More
  • Tape Dispensers and Tape Dispensing Machines - (229 companies)
    Tape dispensers and tape dispensing machines hold and supply tape for assembly or packaging applications. Dispensing machines can be handheld devices or highly automated robotic systems. Tape dispensers and tape dispensing machines hold and supply... Search by Specification | Learn More
  • Power MOSFET - (144 companies)
    MOSFET include TO types, SO types, SOT types, and DPAK, MPAK, MFPAK, CMPAK, CMFPAK, LDPAK, RFPAK, SPAK, and UPAK. The packaging method can be tape reel, rail, bulk pack, tube, and tray. Material choices include silicon, germanium, GaAs, and SiGe. Choices... Search by Specification | Learn More
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Parts by Number for Microelectronic Tape

Part # Distributor Manufacturer Product Category Description
BZX85C15 tape ASAP Semiconductor ST MICROELECTRONICS Not Provided Not Provided
PC123P51 TAPE/REEL ASAP Semiconductor SHARP MICROELECTRONICS Not Provided Not Provided
74LCX86T TAPE&REEL ASAP Semiconductor ST MICROELECTRONICS Not Provided Not Provided
74LCX00T TAPE&REEL ASAP Semiconductor ST MICROELECTRONICS Not Provided Not Provided
1.5KE36CARL (TAPE) ASAP Semiconductor ST MICROELECTRONICS Not Provided Not Provided
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Conduct Research

  • MICRO:Archive:Back Issue TOC
    first; FOUP sales set record; Genus sells first ALD tool Seiko Epson inks SOI pact; Partners offer software; Ibis ups wafer capacity; Brooks buys SEMY; Lambda opens service center; Semtech exiting foundry biz; Chem vendors expands to Asia SCP Global Technology, SPIE's Symposium on Microelectronic...
  • Application of Ultrasonic Cleaning
    components) Computer disk drive and head components Fire restoration Glass substrates Glassware cleaning (laboratory glassware) Hybrid microelectronic circuits (thin and thick film circuits) Hypodermic needle stock (cannulae) Jewelry cleaning (new manufacture) Lenses, ophthalmic, precision Maintenance...
  • power'. applications. Spectral and optical properties of these fibers are presented along with how they allow improved low loss. coupling of optical components in photonic and microelectronic systems. 1. INTRODUCTION. Laser based applications in micro-packaging, microelectronics, and optoelectronic...
  • Basics of ICP, IEPE, and PE Type Signal Conditioning
    sensors with built-in microelectronic amplifiers. (ICP is a registered trademark of PCB Group) Powered by constant current signal conditioners, the result is an easy-to-operate, low impedance, 2-wire system as shown in Figure 5. Figure 5: Typical ICP® Sensor Systems. In addition to ease-of-use...
  • MICRO: 2001 Back Issues
    ; Extraction focuseson contamination; Mattson to sell CVD unit; Ibis, MEMC form wafer team; TEL buys software vendor. Whats going on: Clean Tech 2001, SPIE Microelectronic and MEMS Symposium, and more. Round the Circuit: Axcelis touts implant advance; NIST develops optics device; University of Arkansas...
  • MICRO:Semicon Southwest '98 (Oct. '98, p.127)
    Keyence ..... 1021a Keytek..... 1031-1 Kimberly-Clark ..... 2438 Kimmon International ..... 1838 Kinetek ..... 1907 Kinetic Systems ..... 918 KIP..... 2310-9 Knights Technology ..... 1833 Koch Microelectronic Service..... 2439 Koch Speciality Chemicals..... 1236-2 Koganei..... 2310-4 Kostat...
  • Introduction to Ultrasonic Cleaning
    substrates Glassware cleaning (laboratory glassware) Hybrid microelectronic circuits (thin and thick film circuits) Hypodermic needle stock (cannulae) Jewelry cleaning (new manufacture) Lenses, ophthalmic, precision Maintenance - cleaning of electronic assemblies Maintenance - cleaning mechanical...
  • Seven major concerns related to successful ultrasonic cleaning
    and components Bearings Blind cleaning (window blinds) Carbide cutting tools Cathode ray tube components (TV picture tube components) Computer disk drive and head components Fire restoration Glass substrates Glassware cleaning (laboratory glassware) Hybrid microelectronic circuits (thin and thick film...
  • Explanation of Ultrasonics
    Glassware cleaning (laboratory glassware) Hybrid microelectronic circuits (thin and thick film circuits) Hypodermic needle stock (cannulae) Jewelry cleaning (new manufacture) Lenses, ophthalmic, precision Maintenance - cleaning of electronic assemblies Maintenance - cleaning mechanical assemblies...
  • MICRO:Semicon West '99 (June '99)
    Kinetek ..........2951 Kinetico-Eng. Water Treatment Div...........1200A Kinetics Group..........1216A KIP..........1526N KLA-Tencor..........426 Koch Microelectronic Service..........3033 Koganei..........1526O Kurt J. Lesker..........1118 Kyocera Industrial Ceramics..........124 Lam Research...

Engineering Web Search: Microelectronic Tape

Central processing unit - Wikipedia, the free encyclopedia
before EDVAC, also utilized a stored-program design using punched paper tape rather than electronic memory.
Insulator (electricity) - Wikipedia, the free encyclopedia
In microelectronic components such as transistors and ICs, the silicon material is normally a conductor because of doping, but it can easily be
Grain Size Effect on LTCC Tape Performance as Substrate for...
Grain Size Effect on LTCC Tape Performance as Substrate for Microelectronic Devices
Reliability investigations of fluxless flip-chip...
Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates
Home | AI Technology, Inc.
Dicing & Grinding Tape FAQs AIT Solar Solutions: Solar Panel Manufacturing Materials Thermal Tape Adhesives and Thermal Epoxies
See AI Technology, Inc. Information
Home Page
UltraTape - Cleanroom Tape TouchMark - Medical Pad Printing Microelectronic Packaging & Assembly Solutions
See Delphon Industries, LLC Information
Standards & Documents Search: Tape | JEDEC
Standards & Documents Search: Tape 2 results A new non-destructive tape test method is introduced to quickly determine marking integrity.
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Data Sheet No. PD10061 revF Series PVT212PbF Microelectronic Power IC HEXFET?? Power MOSFET Photovoltaic Relay Single Pole, Normally Open, 0-150V,
See Newark / element14 Profile & Catalog
International Rectifier - Die Products
Sawn wafer on sticky tape supported by a metal frame
See International Rectifier Information
em4102 datasheet and Application Note, Data Sheet, Circuit,...
EM Microelectronic 125KHz, 64 bit read only CID for direct coil connection EM Microelectronic Read Only Contactless Identification Device

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