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Product Announcements
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Wafer & Substrate Bumping with Solder Paste
Indium Corporation Custom Solutions for Advanced Sensing Applications Marktech Optoelectronics Custom Semiconductor Assembly & Packaging Material Indium Corporation Kynar wire Kendu International Inc. SMD Common Mode Choke Kendu International Inc. Package-on-Package Solder Paste Indium Corporation |
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| BZX85C15 tape | ASAP Semiconductor | ST MICROELECTRONICS | Not Provided | Not Provided |
| PC123P51 TAPE/REEL | ASAP Semiconductor | SHARP MICROELECTRONICS | Not Provided | Not Provided |
| 74LCX86T TAPE&REEL | ASAP Semiconductor | ST MICROELECTRONICS | Not Provided | Not Provided |
| 74LCX00T TAPE&REEL | ASAP Semiconductor | ST MICROELECTRONICS | Not Provided | Not Provided |
| 1.5KE36CARL (TAPE) | ASAP Semiconductor | ST MICROELECTRONICS | Not Provided | Not Provided |
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Central processing unit - Wikipedia, the free encyclopedia before EDVAC, also utilized a stored-program design using punched paper tape rather than electronic memory. |
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Insulator (electricity) - Wikipedia, the free encyclopedia In microelectronic components such as transistors and ICs, the silicon material is normally a conductor because of doping, but it can easily be |
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Grain Size Effect on LTCC Tape Performance as Substrate for... Grain Size Effect on LTCC Tape Performance as Substrate for Microelectronic Devices |
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Reliability investigations of fluxless flip-chip... Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates |
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Home | AI Technology, Inc. Dicing & Grinding Tape FAQs AIT Solar Solutions: Solar Panel Manufacturing Materials Thermal Tape Adhesives and Thermal Epoxies See AI Technology, Inc. Information |
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Home Page UltraTape - Cleanroom Tape TouchMark - Medical Pad Printing Microelectronic Packaging & Assembly Solutions See Delphon Industries, LLC Information |
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Standards & Documents Search: Tape | JEDEC Standards & Documents Search: Tape 2 results A new non-destructive tape test method is introduced to quickly determine marking integrity. |
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./null Data Sheet No. PD10061 revF Series PVT212PbF Microelectronic Power IC HEXFET?? Power MOSFET Photovoltaic Relay Single Pole, Normally Open, 0-150V, See Newark / element14 Profile & Catalog |
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International Rectifier - Die Products Sawn wafer on sticky tape supported by a metal frame See International Rectifier Information |
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em4102 datasheet and Application Note, Data Sheet, Circuit,... EM Microelectronic 125KHz, 64 bit read only CID for direct coil connection EM Microelectronic Read Only Contactless Identification Device |