Microelectronics Measuring Tool

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• Avoiding Electrostatic Discharge on the Manufacturing Floor
  voltages of as little. as 1.5 Volts and chip-set traces measuring only 400 angstroms in width, the risk of ESD damage is greater than ever. Any lapses in preventing its occurrence can affect production yields, manufacturing costs, product quality, product reliability, reputation and profitability...
• MICRO:Product Technology News (Jan '2000)
  -to-die comparisons also enable users to carry out rapid defect review. The BX-10 advanced implant monitor is a fully automated in-line metrology system for measuring ultrashallow junctions of 0.18-um and smaller devices. The automated laser-based tool enables the development and control of ultra-low...
• MICRO: Yield Analysis
  and therefore reaches beyond the realm of accounting. A manufacturer develops cost targets during planning cycles by projecting productivity and yield. Measuring COY validates and audits the planning process, and large COY variances compel managers to question how fab profits are being generated. Moreover...
• MICRO:Product Technology News (Oct. '98, p.110)
  and incorporate Gore-tex filter media to ensure low levels of molecular outgassing and particle shedding. Filter face velocity is 40 90 ft/min, and the filter removes 99.9999999% of all particles measuring >=0.07 um. Options include integrated lighting and automatic balancing pressure controls. Mass...
• INDUSTRY NEWS The Tech museum gets ready for a high-tech barn raising
  will house an improved cleanroom exhibit measuring 1200 sq ft, three times larger than the current one. Dubbed Miniature Revolution, the exhibit may bring grateful tears to the eyes of any. MICRO:Archive: July 97:IndNews:Lead Story. MICRO Advertiser and Product Information Buyers Guide. Chip Shots...
• MICRO:Industry News:Lead (Nov/Dec '98)
  in Phoenix, has installed its new wafer bonder at NJIT's Microelectronics Research Center. MRC is investigating ultrathin-wafer bonding of single-crystal silicon wafers measuring 4 in. with thicknessess between 2 and 200 um. The technology "will open up a new class of MEMS possibilities which...
• MICRO: Expansions & Acquisitions
  on the emerging market for copper and low-k processes. Philips Advanced Metrology Systems (AMS) will specialize in tools for measuring the thickness of interconnect metal films during on-line process monitoring. As part of the launch, Philips says it has boosted investment in the SurfaceWave...
• MICRO:Top 25 (November/December 2002)
  is available in wafer sizes of 300, 200, and 150 mm. A large calibration area of 800 800 um extends product lifetime, since the user is not limited to measuring in the same spot continuously. A UPW boron analyzer measures parts-per-trillion levels of boron in DI- and ultrapure-water applications...
• MICRO:Archives of 1997 Back Issues
  /Kansai; builders association honors Hodess; Japanese display magazines translated Order Desk: Wafer maker receives Applied 300-mm tool; cavern site to get coating tools; Mosel Vitelic buys Therma-Wave metrology gear TECHNICAL ARTICLES ULTRAPURE FLUIDS: Measuring and removing dissolved...
• MICRO: Classifying defects for copper CMP process modules
  and postprocessing software for automated defect classification (ADC) are incorporated into the tool. There is no prevailing best practice within the industry for performing defect detection and control because methodologies vary from fab to fab. Although many fabs monitor their processes by measuring...

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