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  • Nitride (AIN, BN)
    making these materials useful as substrates, insulators and barrier layers in microelectronics applications.
  • Ion Implantation
    Ion implantation directs a highly accelerated beam of charged atoms (ions) at a surface resulting in the capture of some of these atoms in the surface of the substrate or wafer. In microelectronics, ion implantation is used to implant dopants such as silicon with boron (B), phosphorus (P), arsenic
  • Boron Nitride
    Boron nitride (BN) is based on compounds of boron and nitrogen. It is relatively inert and has good thermal conductivity combined with good electrical insulation, making this material useful in fabricating substrates and insulators in microelectronics applications. Boron nitride is polymorphic
  • Medical Device Link .
    Effective and reliable diagnosis is an essential tool in medical practice. The convergence of new technologies such as biology, materials science, information technology, molecular chemistry and microelectronics has been revolutionising developments in diagnostics. New knowledge and the ability
  • MICRO: Size of wafers isn't only thing that will get bigger
    Myers noted in his presentation at SEMI's recent Microelectronics Materials Strategy Symposium in San Jose. Since then, silicon suppliers have not expanded capacity. Hence, any return to a semblance of profitability for the industry will trigger an increase in wafer prices. "Nobody's been making
  • Dispensing Solder Paste Micro-Deposits to 0.2mm - A Process Solution
    Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    technology and 300-mm substrates from its foundry partner--Taiwan's United Microelectronics Corp. (UMC). TSMC moves 90-nm chip production out to 1H '04 Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) plans to move into "risk production " with its 90-nm process in late Q2 or early Q3 of 2003
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    business in 2002, noting that it has lowered its sales estimates for the major providers--except for Taiwan's United Microelectronics Corp. (UMC). In total, the worldwide foundry industry is expected to hit $8.745 billion in terms of projected sales for 2002, up 28% from $6.839 billion in 2001

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