Microelectronics Testing Tool

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• Examining scale-up and computer simulation in tool design for 300-mm wafer processing
  and testing of prototypes that may cost hundreds of thousands of dollars. Dimensionless groups can again be used as a guide for scale-up. For the flow problem at hand, the two most important dimensionless groups are the Reynolds number (Re) and the Grashof number (Gr). It has been suggested...
• University of Waterloo Skip to the content of the web site.
  to coming up with the most thermally effective (or cost effective) heat transfer path. This sometimes means building and testing numerous prototypes, or running many thermal simulations. A software simulation tool developed by the UW lab, called META, has a number of advantages over most other...
• MICRO:Conference Programs (March 2001)
  Understanding of Performance Metrics John Matthews and Kristin Butler, IBM Microelectronics Balancing Mask and Photolithography Costs Jeffrey P. Bonn, Sharon Sisler, and Pat Tivnan, IBM Microelectronics Determining the Capacity Components of Different Classes of Multi-Chamber Tools Chairs: Winfried Meier...
• MICRO:Defect Inspection Equipment, by Thomas Reuter (Oct '99)
  Technologies (formerly Siemens Microelectronics Center, or SIMEC) in Dresden, Germany, in July 1998. Fully integrated into the production line, the tool is used in both memory and logic applications across the entire process flow. This article focuses on an investigation that was conducted...
• MICRO:Industry News:Lead (Nov/Dec '98)
  it is absolutely perfectly placed, would be of less concern to a MEMS device. TESTING: Danelle Tanner of Sandia National Laboratories tests MEMS reliability using the SHiMMeR, a tool developed at the lab. Images at right show MEMS pin joint holes in unstressed and stressed conditions. Photo by Randy...
• Fundamentals of Microsystems Packaging
  Fundamentals of Microsystems Packaging. Written by Rao Tummala, the field s leading author, this rigorous, thorough introduction to electronic packaging technologies provides a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and much more...
• MICRO:Industry News: World Beat (July '99)
  Microelectronics Center in Linkoping, Sweden, has bought a sputtering system from KDF Electronic and Vacuum Services to use for research into multichip modules and high-density interconnect prototypes. The 844GT sputtering tool was purchased "for the low-end MCM market," says Kurt Flechsig, president...
• INDUSTRY NEWS World Beat
  to provide services for clients in the Pacific Rim. The Houston-based firm provides engineering, construction, testing, and support services for the microelectronics industry. It recently completed several large projects in the region. The Pacific Rim regional manager is Mike Manning. MRC has new...
• MICRO: Industry News: 300mm (January 2001)
  009;Trecenti Technologies, a joint venture between Japan's Hitachi and Taiwan's United Microelectronics, has produced the first chips in its 300-mm fab--two months ahead of schedule. The company claims that it has used 0.18-um technology to produce the world's first functional 4- and 8-Mb SRAMs...
• Special Report
  Although it's sometimes overlooked as a semiconductor and advanced microelectronics hub, the Minneapolis/St. Paul area is home to a significant concentration of manufacturers, suppliers, and research institutions. Seagate, 3M, Honeywell, Medtronics, Cypress Semiconductor, VTC, FSI International...

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