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Part # Distributor Manufacturer Product Category Description
AD590LH MIL-STD-883 ASAP Semiconductor ANALOG DEVICES Not Provided Not Provided
LM239J3/883B ASAP Semiconductor RAY/NS Not Provided MIL-M-STD-883B
MIL-STD883 National Microchip Not Provided Not Provided Not Provided

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  • Medical Device Link . Electrical Testing and Environmental Screening of Hybrid Microelectronic Devices
    Medical Device & Diagnostic Industry Hybrid devices require unique testing to ensure reliability for medical applications. Generic test and environmental requirements for hybrid microelectronics are defined in MIL-PRF-38534 and MIL-STD-883. While these two specifications outline the requirements
  • AN3018: Known Good Die Delivery Specification
    , screening, or packaging. All die are functionally tested to the product test plan. Carrier and shipper will be marked per Table 2. Barcode format is code 39 using data identifiers per Table 3. All die will be inspected using an automated vision system. Die will be compliant with MIL-STD-883, Method
  • SP720, SP721 and SP723 Turn-On and Turn-Off Characteristics (.pdf)
    -. per MIL-STD-883D, Method 3015.7. This circuit discharges a. FORWARD SCR. On and. 100pF capacitor through 1500Ω to a device under test. PROTECTION CELL. INPUT. (ON). (DUT). The waveform Turn-ON characteristic for current vs. Turn-. time of an SP72/1 when activated by a +2kV ESD pulse is. Off
  • ESD and Transient Protection using the SP720 (.pdf)
    ; also referred to as the Human Body. Model. FIGURE 1. ESD TEST FOR AN ON-CHIP PROTECTION. The recognized need for improved ESD protection was rst. CIRCUIT USING THE MIL-STD-883, METHOD. precipitated under harsh handling conditions; particularly in. 3015.7 (HUMAN BODY MODEL). applications
  • IEC 1000-4-2 ESD Immunity and Transient Current Capability for the SP72X Series Protection Arrays (.pdf)
    , the actual results for ESD tests on. CURRENT. IPEAK. the SP720 and SP721 are as follows: 100%. 1. Human Body Model using a modi ed version of the. 90%. MIL-STD-883, Method 3015.7; with V+ and V- grounded. and ESD discharge applied to each individual IN. pin - Passed all test levels from ±9kV to ±16kV (1kV
  • Multi-lead Organic Air-Cavity Package for High Power High Frequency RFICs
    . Ceramic package technology has set the accuracy. The LCP material has a nearly matched coefficient. standards for reliability. A major component of reliability is. of thermal expansion (CTE) to the metal piece parts. the integrity of the package, and the ability of the package to. maintain MIL-STD-883
  • Medical Device Link .
    in the solder joint, a change in circuit resistance, and damage within the package structure. IPC-9701 was developed to replace the somewhat dated MIL-STD-883. This industry specification establishes specific thermal-stress test conditions to create in evaluating board assembly–level product performance

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