Sites:

Welcome to GlobalSpec!
Find parts, products, suppliers, datasheets, and more for:

Mm Wave Board

Products & Services

See also: Categories | Featured Products | Parts by Number | Technical Articles | Engineering Web Results
Page: 1 2 3 Next

Find Suppliers by Category Top


Parts by Number for Mm Wave Board Top

Part # Distributor Manufacturer Product Category Description
1737187 PHOENIX CONTACT USA Not Provided Printed-circuit board connector - 1737187 Header, Nominal current: 8 A, Rated voltage (III/2): 250 V, Number of positions: 19, Pitch: 3.5 mm, Color: Black, Contact surface: Tin, Assembly: Soldering, The maximum current depends on the plug used. The lower of the two current values apply for plug and pin strip. The pin strip is made...
1737200 PHOENIX CONTACT USA Not Provided Printed-circuit board connector - 1737200 Header, Nominal current: 8 A, Rated voltage (III/2): 250 V, Number of positions: 21, Pitch: 3.5 mm, Color: Black, Contact surface: Tin, Assembly: Soldering, The maximum current depends on the plug used. The lower of the two current values apply for plug and pin strip. The pin strip is made...
1737213 PHOENIX CONTACT USA Not Provided Printed-circuit board connector - 1737213 Header, Nominal current: 8 A, Rated voltage (III/2): 250 V, Number of positions: 22, Pitch: 3.5 mm, Color: Black, Contact surface: Tin, Assembly: Soldering, The maximum current depends on the plug used. The lower of the two current values apply for plug and pin strip. The pin strip is made...

Conduct Research Top

  • Multilayer Lamination Methods for PTFE-Based PCBs
    Circuits. TacLamPLUS, mm Wave, module, MMIC, laser via. Read Abstract Download PDF. The Impact of Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip and Stripline Transmission Lines. Rrms, ED copper, RA copper, reverse treated copper, microstrip, stripline, conductor loss
  • Pin-in-Paste Application Note (.pdf)
    by hand or wave methods * Reduction in manufacturing floor space * Reduction in manufacturing equipment - consequently in investment cost * Compatible with the existing processes * Use of no-clean soldering process possible * Higher reliability at PC board level due to fewer soldering processes
  • Proper Stack-Up in a Multilayer PCB to Reduce Noise Coupling and Improve EMI
    is copper with conductivity. ployed to calculate S. s. 21 between A1. c. attenuated with respect to the original. and B1 on the same test board and the. = 5.5×107 S/m and the thickness of all. wave on PWR1 and this value is cer-. the PWR/GND planes is 0.018 mm. calculated results are compared with. tainly
  • DC/DC CONVERTER Modules Assembly Tips
    - Pins Trimming. 6- Drying. 7- Module Soldering Process. 7.1 Soldering Alloys. 7.2 Reflow Process. 7.3 Manual assembly. 7.4 Wave soldering Assembly. 7.4.1 Board Orientation. 7.4.2 Flux Application. 7.4.3 Pre-Heating. 7.4.4 Solder Wave. 8- Post Solder Cleaning. 9- Inspection. 10- Rework and repair
  • Effect of Permittivity and Permeability of a Flexible Magnetic Composite Material on the Performance and Miniaturization Capability of Planar Antennas for RFID and Wearable Wireless Applications
    System full wave electromagnetic software. A prototype of the antenna on the magnetic composite was. fabricated, and good agreement between the simulated and. measured results was found. Comparison of the antennas on the. magnetic composite versus the pure silicone substrate showed. miniaturization
  • How to Specify RF & Microwave Filters (.pdf)
    filter designs and. characteristics, this white paper has been created to provide a simple, thumbnail sketch of the most. popular filter types (LC, ceramic, cavity, Surface Acoustic Wave (SAW), crystal, and helical) along. with the advantages and disadvantages of each in various applications. Armed
  • Emissivity Measurements of Common Construction Materials
    Planck's Law Constant = 1.1870 x 10^8 Btu*mm4/ (h*ft2). C2 = second Planck's Law Constant = 2.5896 x 10^4 mm°R. l = wave length, ft. T = temperature (degrees Rankin). e is the spectral hemispherical emissivity. The relationship between. and. is given by. l. e. el. W = T 4 = W W d =. W d. b. 0. 0
  • Intra-Vascular Ultrasound with a CompuScope 8500
    and return to the transducer is: D t = 2x/v. The velocity of sound, v, in the blood vessel wall can be approximated as the velocity of sound in water, which is roughly v H2O = 1.5 km/sec = 1.5 mm/ m s. A reflection from an interface 3 m m from the transducer, therefore, requires D t = 2x(3 m m) / (1.5 mm

Engineering Web Search: Mm Wave Board Top