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  • Ceramic Electronic and IC Packaging Design Guide
    to its high thermal conductivity. a wide choice of materials, each. and excel ent Coefficient of Thermal. designed to meet specific application. Aluminum Nitride (AlN). (15-85). Expansion (CTE) match to Silicon,. needs. The choices include: Material. Molybdenum Copper Tungsten. Alloy 42. Kovar. Alloy 194
  • Guidelines for Selecting the Right Brazing Alloy
    copper the usual flux may be omitted. Other oxides (such as zinc in brass) are not reduced by phosphorous; therefore, flux is needed to produce satisfactory joints. While especially suitable for joining copper and its alloys, this alloy group may also be used on silver, tungsten and molybdenum
  • Frequently Asked Questions About Stainless Steel
    . Higher levels of chromium and the addition of other alloying elements such as nickel and molybdenum enhance this surface layer and improve the corrosion resistance of the stainless material. See the "Stainless Steel Primer " for more information. 2. What is the difference between 18/8 and 18/10

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