Products & Services

See also: Categories | Featured Products | Technical Articles
Page: 1 2 Next

Conduct Research Top

  • Stack-up and the Basics of Multi-Layer Construction (.pdf)
    The Stack-Up is the specific call out of material thickness and copper weights required to produce a particular multi-layered printed circuit board. The description of the stack-up can be found on the PCB fabrication drawing-a drawn cross-section depicting the material and copper thickness of each
  • BBG Tech Tip #12: Stack-Ups & the Basics of Multi-Layer Circuit Board Construction
    The Stack-Up is the specific call out of material thickness and copper weights required to produce a particular multilayered. printed circuit board. The description of the stack-up can be found on the PCB fabrication drawing-a drawn. cross-section depicting the material and copper thickness of each
  • PCB in the Design Should Rake into Account Various Factors
    pad, in fact, this is their own library neglected to add the device "layer" concept, did not draw the letters themselves loaded pads feature is defined as "multi-layer (Mulii a Layer) sake. to remind that, once the selected number of layers used in printed boards, be sure to turn off the layer
  • Application Guidelines for Non-Isolated Converters: PWB Layout Considerations (.pdf)
    Non-Isolated POL dc-dc converters are switching buck regulators which require careful layout considerations when designing on to a printed wiring board (PWB). Many applications using these non-isolated dc-dc converters utilize high-density multi-layer circuit boards, and proper component placement
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    in fabricating multi-layer integrated circuit interconnect that combines copper metal lines with a low-k porous film insulation, the company reported. Over-the-phone electronic-commerce applications should be easier to develop with a new release of the flagship software suite from SpeechWorks International
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    with Circuits-Multi-Projets to gain access to leading-edge process technology from STMicroelectronics. SIG updates Bluetooth cores roadmap The Bluetooth Special Interest Group is set to update its roadmap out to the third quarter of 2007, emphasizing interoperability with UWB media-access control (MAC) layers