Description: . Dimensional stability is retained after extended aging in various environments. Adhesion to both
metallic and
nonmetallic substrates including aluminum, steel, copper, glass, ceramics, wood and most plastics is excellent. Although highly flexible, it's chemical resistance profile is vastly superior
- Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
- Dissimilar Substrates: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Semiconductors / IC Packaging, Marine, Military / Government (MIL-SPEC / GG), Other
- Cure Type / Technology: Thermoplastic / Hot Melt, Room Temp. Cure / Vulcanizing, Two Component System