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Non-metallic Mix Tanks

 

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Storage tanks and process tanks are bulk containers of varying size and configuration.
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  • Description: , does not contain any solvents or diluents and cures with minimal shrinkage. It readily develops a high bonding strength of more than 2500 psi at room temperature to both metallic and many non-metallic substrates which unlike that of many other epoxy resin compounds, is relatively insensitive
    • Substrate / Surface: Ceramic / Porcelain, Glass, Metal, Plastic, Wood
    • Chemistry: Epoxy, Resin Base / Polymer Binder
    • Technology: Multicomponent, Other
    • Form: Paste
  • Description: , does not contain any solvents or diluents and cures with minimal shrinkage. It readily develops a high bonding strength of more than 2500 psi at room temperature to both metallic and many non-metallic substrates which unlike that of many other epoxy resin compounds, is relatively insensitive
    • Coating Type: Electrical Insulation / Dielectric
    • Cure Type / Technology: Two Component System, Specialty / Other
    • Industry Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Other
    • Chemical / Polymer System Type: Epoxy (EP)
  • Description: any solvents or diluents and cures with minimal shrinkage to a tough thermoset plastic. It readily develops a high bonding strength of more than 2500 psi at room temperature to both metallic and non-metallic substrates which unlike that of many other epoxy resin compounds, is relatively insensitive
    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Wood / Wood Product, Other
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Building / Construction, Other
    • Chemical / Polymer System Type: Epoxy (EP)
  • Description: any solvents or diluents and cures with minimal shrinkage to a tough thermoset plastic. It readily develops a high bonding strength of more than 2500 psi at room temperature to both metallic and non-metallic substrates which unlike that of many other epoxy resin compounds, is relatively insensitive
    • Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Semiconductors / IC Packaging, Building / Construction, Other
    • Features: Electrically Insulating / Dielectric
  • Description: any solvents or diluents and cures with minimal shrinkage to a tough thermoset plastic. It readily develops a high bonding strength of more than 2500 psi at room temperature to both metallic and non-metallic substrates which unlike that of many other epoxy resin compounds, is relatively insensitive
    • Substrate / Surface: Ceramic / Porcelain, Concrete / Masonry, Glass, Metal, Plastic, Wood
    • Type: Coating
    • Technology: Multicomponent
    • Chemistry: Epoxy, Resin Base / Polymer Binder
  • Description: . Dimensional stability is retained after extended aging in various environments. Adhesion to both metallic and nonmetallic substrates including aluminum, steel, copper, glass, ceramics, wood and most plastics is excellent. Although highly flexible, it's chemical resistance profile is vastly superior
    • Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Semiconductors / IC Packaging, Marine, Military / Government (MIL-SPEC / GG), Other
    • Cure Type / Technology: Thermoplastic / Hot Melt, Room Temp. Cure / Vulcanizing, Two Component System

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