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  • Description: Master Bond MasterSil 705S is an easy-to-use, one component, non-corrosive, electrically conductive, silver filled, silicone for bonding and sealing. The material is a gray colored paste. It cures readily at ambient temperatures when exposed to atmospheric moisture. MasterSil 705S features

    • Industry: Electronics
    • Chemical / Polymer System Type: Silicone
    • Filled / Reinforced: Yes
    • Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System

  • Description: BETASEAL™ 1580 adhesive delivers 30 minutes safe drive away even for cars with twin airbags and in temperatures between -5°C and +45°C. It offers high-modulus, non-conductive performance, and does not need to be heated.

    • Substrate / Material Compatibility: Ceramic / Glass
    • Industry: Automotive
    • Chemical / Polymer System Type: Polyurethane (PU, PUR)

  • Description: be maintained. The flowability enables its usage for electronic potting and encapsulation. A non drip version for application on vertical surfaces is available.

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Building / Construction, Tooling / Mold Material, Other
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: and is a non-corrosive type silicone. MasterSil 705TC features good thermal conductivity and is uniquely suited for applications that require flexibility and high temperature resistance. It is also ideal for those thermally conductive applications where reworkability is a desirable feature.

    • Chemical / Polymer System Type: Silicone
    • Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
    • Features: Thermal Compound / Interface (Thermally Conductive), Conformal Coating, Grease / Paste, Non-corrosive Cure
    • Use Temperature: -75 to 400 F

  • Description: Master Bond Polymer Adhesive EP21ND-2 is a two component epoxy adhesive for general purpose bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Porous Surfaces, Wood / Wood Product, Other
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Other
    • Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)

  • Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant

    • Industry: Electronics
    • Cure Type / Technology: Two Component System
    • Features: Electrically Conductive Compound, Leveling / Filling Compound

  • Description: The Quantum® group of HERNON® cyanoacrylates offers specialized performance attributes. This range of grades has been engineered to provide solutions to specific cyanoacrylate challenges. Three categories are offered: surface insensitive, toughened, and low odor-low blooming.

    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Other
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Building / Construction
    • Chemical / Polymer System Type: Cyanoacrylate, Specialty / Other

  • Description: No Description Provided

    • Industry: Electronics
    • Chemical / Polymer System Type: Silicone
    • Filled / Reinforced: Yes
    • Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System

  • Description: Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. Tuffbond epoxies

    • Substrate / Material Compatibility: Composites, Metal
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Marine, Military / Government (MIL-SPEC / GG)
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and glass. Upon

    • Substrate / Material Compatibility: Ceramic / Glass, Metal
    • Industry: Automotive, OEM / Industrial, Other
    • Chemical / Polymer System Type: Ceramic / Inorganic Cement
    • Water Based / Latex Dispersion: Yes

  • Description: One-part, white, moisture cure RTV, non-flowing, fast tack free, controlled volatility, thermally conductive, UL V-0. Recommended Applicator Documentation: Dow Corning MSDS/TDS

    • Compound Type: Thermal Compound / Heat Conductive
    • Cure Type / Technology: Single Component System, RTV / Room Temperature Curing, Reactive / Moisture Cured
    • Features: Non-corrosive Cure
    • Industry: Electronics, OEM / Industrial

  • Description: SEMICOSIL® 972 TC is a non-slump, addition-curing, two component silicone rubber that cures at room temperature to a soft rubber with excellent thermal conductivity. Special characteristics Two-component High thermal conductivity Almost constant properties between – 50 °C

    • Compound Type: Thermal Compound / Heat Conductive
    • Cure Type / Technology: Two Component System, RTV / Room Temperature Curing
    • Features: Electrical Insulation / Dielectric Material
    • Industry: Electronics

  • Description: White, non-flowing, highly filled compound with good thermal conductivity. Sold as a pack (2/pk). Documentation: Dow Corning MSDS/TDS

    • Chemical / Polymer System Type: Specialty / Other
    • Features: Thermal Compound / Interface (Thermally Conductive)
    • Thermal Conductivity: 0.8000 W/m-K
    • Dielectric Strength: 8.27E6 V/m

  • Description: replacements and delivers one-hour, safe drive away in temperatures as low as 0ºF (-17.8ºC) for standard and high-modulus, non-conductive (HMNC) applications. The product is easy to use and does not require heating. Product Benefits: Delivers fast, safe one-hour drive away in temperatures

    • Substrate / Material Compatibility: Ceramic / Glass
    • Cure Type / Technology: Single Component System, Room Temperature Curing
    • Industry: Automotive
    • Tensile Strength (Break): 700 psi

  • Description: Master Bond MasterSil 705S is an easy-to-use, one component, non-corrosive, electrically conductive, silver filled, silicone for bonding and sealing. The material is a gray colored paste. It cures readily at ambient temperatures when exposed to atmospheric moisture. MasterSil 705S features

    • Gasket Type: Formed-in-Place (FIP)
    • Material: Silicone Rubber
    • Operating Temperature: -75 to 400 F

  • Description: one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure quickly at moderate

    • Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Semiconductors / IC Packaging, Marine, Military / Government (MIL-SPEC / GG), Other
    • Cure Type / Technology: Thermoplastic / Hot Melt, Room Temp. Cure / Vulcanizing, Two Component System

  • Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant

  • Description: The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible polyurethane potting system

    • Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
    • Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
    • Features: Electrical Insulation / Dielectric Material, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening
    • Industry: Electronics

  • Description: Same as 3M Pad 5516 but with a polymeric permanent film on one side to be used as a non-tacky surface for ease of reworking an assembly. Thermal Conductivity and Impedance slightly changes with addition of the film. Dielectric strength is improved.

    • Compound Type: Thermal Compound / Heat Conductive
    • Substrate / Material Compatibility: Metal
    • Cure Type / Technology: Contact / Pressure Sensitive (PSA)
    • Features: UL Approved

  • Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature resistance

    • Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
    • Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
    • Features: Electrically Conductive, Flexible / Dampening

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