Non Conductive Sealant

Description: BETASEAL™ 1580 adhesive delivers 30 minutes safe drive away even for cars with twin airbags and in temperatures between -5°C and +45°C. It offers high-modulus, non-conductive performance, and does not need to be heated.

• Substrate / Material Compatibility: Ceramic / Glass
• Industry: Automotive
• Chemical / Polymer System Type: Polyurethane (PU, PUR)

Description: of performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AO is low viscosity with excellent flow characteristics making it ideal as a thermally conductive potting epoxy

• Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
• Dissimilar Substrates: Yes
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Building / Construction, Tooling / Mold Material, Other
• Chemical / Polymer System Type: Epoxy (EP)

Description: SEMICOSIL® 972 TC is a non-slump, addition-curing, two component silicone rubber that cures at room temperature to a soft rubber with excellent thermal conductivity. Special characteristics Two-component High thermal conductivity Almost constant properties between – 50 °C

• Compound Type: Thermal Compound / Heat Conductive
• Cure Type / Technology: Two Component System, RTV / Room Temperature Curing
• Features: Electrical Insulation / Dielectric Material
• Industry: Electronics

Description: Master Bond MasterSil 705S is an easy-to-use, one component, non-corrosive, electrically conductive, silver filled, silicone for bonding and sealing. The material is a gray colored paste. It cures readily at ambient temperatures when exposed to atmospheric moisture. MasterSil 705S features

• Industry: Electronics
• Chemical / Polymer System Type: Silicone
• Filled / Reinforced: Yes
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System

Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room

• Material Type: Grease / Paste, Gap Filling Compound, Specialty / Other
• Industry: Electronics, Electrical Power / HV, Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
• Features: Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, ESD Control / Anti-static, Flexible / Dampening
• Chemical / Polymer System Type: Polysulfide, Polyurethane (PU, PUR), Epoxy (EP)

Description: One-part, white, moisture cure RTV, non-flowing, fast tack free, controlled volatility, thermally conductive, UL V-0. Recommended Applicator Documentation: Dow Corning MSDS/TDS

• Industry: Electronics, OEM / Industrial
• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
• Features: Thermal / Heat Conductive, Non-corrosive Cure

Description: Master Bond Polymer Adhesive EP30ND is a high viscosity, two component epoxy adhesive for general purpose bonding and repair formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight or volume. This adhesive is 100% reactive and

• Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors, Electrical Power / HV
• Compound Type: Thermally Conductive
• Material Form: Conformal / Encapsulating Coating, Gap Filling Compound

Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant

• Industry: Electronics
• Cure Type / Technology: Two Component System
• Features: Electrically Conductive
• Composition: Two Component System

Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature resistance

• Material Type: Conformal / Encapsulating Coating, Die Bonding Adhesive / Compound
• Industry: Electronics, Electrical Power / HV, Semiconductors / IC Packaging, Automotive, OEM / Industrial
• Features: Electrically Conductive, Flexible / Dampening
• Chemical / Polymer System Type: Silicone

Description: PSH – non-conductive, PTFE lined, fiberglass reinforced innercore, overbraided with 300 series stainless steel. PSHC – conductive (carbon impregnated), PTFE lined, fiberglass reinforced innercore, overbraided with 300 series stainless steel. PDH – .030 wall, non-conductive

• Product Form: Complete Hose Assembly
• Material: Fluoropolymers / Silicone
• Construction Options: Reinforced
• Usage Media: Adhesives / Sealants / Coatings

Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and glass. Upon

• Compound Type: Thermally Conductive
• Material Form: Die Bonding Adhesive / Compound, Grease / Paste
• Cure Type / Technology: Single Component System
• Industry Applications: Automotive, OEM / Industrial, Other

Description: Ease-of-use, thermal conductivity

• Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Features: Electrical Insulation / Dielectric Material, Filled, Non-corrosive Cure
• Industry: Electronics

Description: Same as 3M Pad 5516 but with a polymeric permanent film on one side to be used as a non-tacky surface for ease of reworking an assembly. Thermal Conductivity and Impedance slightly changes with addition of the film. Dielectric strength is improved.

• Chemical / Polymer System Type: Silicone
• Substrate / Material Compatibility: Metal
• Industry / Applications: Electronics
• Features: UL Approved

Description: Whether revitalizing old ESD tiles or protecting a new epoxy floor, ACL’s Staticide® Ultra II Floor Finish will help safeguard your costly investment of specialized flooring. This distinctive anti-static blend is compatible with problematic plasticizers found in conductive and dissipative

Description: White, non-flowing, highly filled compound with good thermal conductivity. Sold as a pack (2/pk). Documentation: Dow Corning MSDS/TDS

• Chemical / Polymer System Type: Specialty / Other
• Features: Thermal Compound / Interface (Thermally Conductive)
• Compound Type: Thermally Conductive