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  • Description: Master Bond MasterSil 705S is an easy-to-use, one component, non-corrosive, electrically conductive, silver filled, silicone for bonding and sealing. The material is a gray colored paste. It cures readily at ambient temperatures when exposed to atmospheric moisture. MasterSil 705S features

    • Industry: Electronics
    • Chemical / Polymer System Type: Silicone
    • Filled / Reinforced: Yes
    • Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System

  • Description: BETASEAL™ 1580 adhesive delivers 30 minutes safe drive away even for cars with twin airbags and in temperatures between -5°C and +45°C. It offers high-modulus, non-conductive performance, and does not need to be heated.

    • Substrate / Material Compatibility: Ceramic / Glass
    • Industry: Automotive
    • Chemical / Polymer System Type: Polyurethane (PU, PUR)

  • Description: Master Bond Polymer Adhesive EP30ND is a high viscosity, two component epoxy adhesive for general purpose bonding and repair formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight or volume. This adhesive is 100% reactive and

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Optical Grade / Material, Semiconductors / IC Packaging, Building / Construction, Tooling / Mold Material, Other
    • Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)

  • Description: and is a non-corrosive type silicone. MasterSil 705TC features good thermal conductivity and is uniquely suited for applications that require flexibility and high temperature resistance. It is also ideal for those thermally conductive applications where reworkability is a desirable feature.

    • Chemical / Polymer System Type: Silicone
    • Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
    • Features: Thermal Compound / Interface (Thermally Conductive), Conformal Coating, Grease / Paste, Non-corrosive Cure
    • Use Temperature: -75 to 400 F

  • Description: No Description Provided

    • Industry: Electronics
    • Chemical / Polymer System Type: Silicone
    • Filled / Reinforced: Yes
    • Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

  • Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant

    • Industry: Electronics
    • Cure Type / Technology: Two Component System
    • Features: Electrically Conductive Compound, Leveling / Filling Compound

  • Description: Classic cyanoacrylates are represented by the ethyl and methyl chemistries. Generally, the methyls offer better bond strengths on metals, the ethyls providing better strengths on everything else. Substrate selection and bond line configuration directly influence adhesive performance.

    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Building / Construction
    • Chemical / Polymer System Type: Cyanoacrylate, Specialty / Other

  • Description: Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. Tuffbond epoxies

    • Substrate / Material Compatibility: Composites, Metal
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Marine, Military / Government (MIL-SPEC / GG)
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and glass. Upon

    • Substrate / Material Compatibility: Ceramic / Glass, Metal
    • Industry: Automotive, OEM / Industrial, Other
    • Chemical / Polymer System Type: Ceramic / Inorganic Cement
    • Water Based / Latex Dispersion: Yes

  • Description: ECCOBOND 59 C is a one component, solvent containing, silver filled, electrically conductive, pressure sensitive silicone adhesive, it has high flexibility, high tack and its bonds can be opened and resealed. 3 gram vial. *Usually Ships within 1 Week. This item is NON RETURNABLE. > Sold

    • Cure Type / Technology: Single Component System
    • Features: Electrically Conductive, Filled
    • Industry: OEM / Industrial
    • Use Temperature: -67 to 500 F

  • Description: SEMICOSIL® 972 TC is a non-slump, addition-curing, two component silicone rubber that cures at room temperature to a soft rubber with excellent thermal conductivity. Special characteristics Two-component High thermal conductivity Almost constant properties between – 50 °C

    • Compound Type: Thermal Compound / Heat Conductive
    • Cure Type / Technology: Two Component System, RTV / Room Temperature Curing
    • Features: Electrical Insulation / Dielectric Material
    • Industry: Electronics

  • Description: White, non-flowing, highly filled compound with good thermal conductivity. Sold as a pack (2/pk). Documentation: Dow Corning MSDS/TDS

    • Chemical / Polymer System Type: Specialty / Other
    • Features: Thermal Compound / Interface (Thermally Conductive)
    • Thermal Conductivity: 0.8000 W/m-K
    • Dielectric Strength: 8.27E6 V/m

  • Description: replacements and delivers one-hour, safe drive away in temperatures as low as 0ºF (-17.8ºC) for standard and high-modulus, non-conductive (HMNC) applications. The product is easy to use and does not require heating. Product Benefits: Delivers fast, safe one-hour drive away in temperatures

    • Substrate / Material Compatibility: Ceramic / Glass
    • Cure Type / Technology: Single Component System, Room Temperature Curing
    • Industry: Automotive
    • Tensile Strength (Break): 700 psi

  • Description: Master Bond MasterSil 705S is an easy-to-use, one component, non-corrosive, electrically conductive, silver filled, silicone for bonding and sealing. The material is a gray colored paste. It cures readily at ambient temperatures when exposed to atmospheric moisture. MasterSil 705S features

    • Gasket Type: Formed-in-Place (FIP)
    • Material: Silicone Rubber
    • Operating Temperature: -75 to 400 F

  • Description: one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure quickly at moderate

    • Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Semiconductors / IC Packaging, Marine, Military / Government (MIL-SPEC / GG), Other
    • Cure Type / Technology: Thermoplastic / Hot Melt, Room Temp. Cure / Vulcanizing, Two Component System

  • Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant

  • Description: The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible polyurethane potting system

    • Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
    • Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
    • Features: Electrical Insulation / Dielectric Material, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening
    • Industry: Electronics

  • Description: Same as 3M Pad 5519 but with a polymeric permanent film on one side to be used as a non-tacky surface for ease of reworking an assembly. Thermal Conductivity and Impedance slightly changes with addition of the film. Dielectric strength is improved.

    • Compound Type: Thermal Compound / Heat Conductive
    • Substrate / Material Compatibility: Metal
    • Cure Type / Technology: Contact / Pressure Sensitive (PSA)
    • Features: UL Approved

  • Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature resistance

    • Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
    • Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
    • Features: Electrically Conductive, Flexible / Dampening

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