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Ohm [O ]

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Parts by Number for Ohm [O ] Top

Part # Distributor Manufacturer Product Category Description
330 OHM 1W 5 ASAP Semiconductor RES SANN-OHM Not Provided 330 ohm 1w 5% MF Flameproof (M/O), Sann-Ohm
SPH 120 OHM 5%(O) ASAP Semiconductor WELWYN Not Provided Not Provided
EBMS160808A101 100 O ASAP Semiconductor MAX ECHO Not Provided EBMS160808A101 100 OHM
ACMS321611A250 (25 O ASAP Semiconductor MAX ECHO Not Provided ACMS321611A250 (25 OHM)
EBMS160808B601 600 O ASAP Semiconductor MAX ECHO Not Provided EBMS160808B601 600 OHM
1W MO .75 OHM 5% T O ASAP Semiconductor ASJ Not Provided Not Provided
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Conduct Research Top

  • Application: Testing IC's Using Reed Relays
    - 2011_0203_ReedrelaysAKeyComponentWhentestingIntergratedCircuits.doc Re. R e. e d. e. d Re. R l. e ay. a s. y. s Ar. A e. r. e a. a Ke. K y. e. y Co. C m. o p. m o. p n. o e. n n. e t. n. t in. n Te. T s. e t. s itng. n. g In. I t. n e. t g. e r. g a. r t. a e. t d. e. d. Ci. C rc. r u. c i. u ts. t. s. RE. R ED. D RE. R LA. L YS. Y RE. R ED. D SE. S NS
  • Application: RF Reed Relays Used in Integrated Circuits Performance PCBs
    excellent isolation. Microsoft Word - IC_Performance_PCB_Use_Reed_Relays.doc Re. R e. e d. e. d Re. R l. e ay. a s. y. s Ca. C r. a r. r y. r. y Ou. O t. u t Sw. S i. w tc. t h. c i. h ng. n. g Fu. F n. u c. n t. c iton. o s. n. s in Pe. P r. e f. r o. f r. o m. r a. m n. a c. n e. c. e. Bo
  • Complementary LED Drive
    Light Emitting Diodes, or LED's, are discrete components able to produce light when a current passes through them. Most microcontroller designs use one or more LED's. This application highlights the utility of driving multiple LED's with a minimum number of I/O pins. Typically, each I/O drives
  • Trimming The Output Voltage Of DC/DC Converters
    to a few ohms). O. Solving for I, we get: Keep in mind the current I provided by the current. source must generate a current going through RX, such that: V. (R +RF) - V *R. I*RX V . REF. I =. REF. IN. O. IN. Eq.4. R *RF. IN. EXAMPLE 2: Given RX=100 and RA=20k, calcu-. late the V Max and I*RX needed
  • Factors in the Selection of MIL-STD-1553 Couplers, Connectors and Harnesses
    without splices at a relatively smal cost in weight. Couplers, 1 stub 16 16 x 65 gms = 1040 gms 16 x 8 gms = 128 gms. and calculated MTBF. Spares requirements can be reduced. Mating Conn. 46 46 x 16 gms = 736 gms o gms. if several of the segments can be made identical. Multi-stub. Terminators. 2 2 x
  • AN721: Impedance Matching Networks Applied to RF Power Transistors, Courtesy of Motorola
    . f. f. 1. o. o. X1 Xint. The normalized current absolute value is equal to: R. X. 1. Xint. Xext. ext = Xin - X1. I2. 2 n. =. Io. f. 4. f. 2. (n ­ 1)2. ­ 2. + (n + 1)2. f. Figure 6. Termination Reactance Compensation. o. fo. 4.1.1.1 Use of transmission lines and inductors. nE. where Io
  • Sensorless BLDC Motor Control Using dsPIC30F2010
    the dsPIC30F2010 device to the hardware and software described in AN901, which uses the dsPIC30F6010 device and dsPICDEMTM MC1 Motor Control Development Board. The 80-pin dsPIC30F6010 has 144 Kbytes of Flash Program Memory, 8 Kbytes of RAM available and abundant I/O. The 28-pin dsPIC30F2010, on the other
  • Recommended Usage of Microchip Microwire Serial EEPROM Devices
    The majority of embedded control systems require nonvolatile memory. Because of their small footprint, byte level flexibility, low I/O pin requirement, low-power consumption, and low cost, serial EEPROMs are a popular choice for nonvolatile storage. Microchip Technology has addressed this need

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