• Description: in thickness while maintaining its surface uniformity and parallelism. It is recommended for use in polishing hard materials such as ceramic, optical glass, and crystals. This pad was designed to provide rapid stock removal while achieving superb surface finishes. Recommended for use on most abrasive types

  • Description: This product is a fixed abrasive consisting of diamond agglomerates in an organic binder on a film backing. The abrasive product is designed for edge finishing of raw and patterned silicon wafers. This product may also be used for hard substrates like AlTiC ceramics, optical glass, and some

    • Type: Sheets / Rolls, Other
    • Abrasive Grain / Material Type: Diamond
    • Applications: Polishing / Lapping (Very Fine Grits), Toolroom / Sharpening
    • Products / Materials Abraded: Ceramics / Glass, Metalworking, Ophthalmic / Optical, Specialty / Other

  • Description: The Lapmaster LSP line of dual face lapping machines feature 3 and 4-way, planetary models with sophisticated control systems.

    • Type: Lapping Machine
    • Mounting: Floor Mounted / Stationary (Machine Tools)
    • Motor Voltage and Phase: 460 / 480 V 60 Hz, 50 Hz / International Power, Three-Phase, Other
    • Applications / Materials Abraded: Biotech / Medical Devices, Ceramics / Glass, Metals / Metalworking, Ophthalmic / Optical, Plastics / Composites, Semiconductors / Electronics, Wet Grinding / Finishing

  • Description: Protomatic provides CNC precision machining machining and custom components manufacturing for lab equipment, surgical tools, and operating equipment within the medical industry as well as many additional components for the optical and dental fields. Protomatic primary focus of our precision

    • Machining Capabilities: Drilling, Milling, Turning, Jig Boring, Broaching, Deep Hole Drilling, Gun Drilling, Surface Grinding, Honing
    • Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding, Other
    • Specialty Machining: Casting Machining, CNC Machining, Forging Machining, Extrusion Machining, Jigs and Fixtures, Thread Rolling, Tool & Die Manufacturing
    • Materials: Aluminum, Brass, Bronze, Carbide, Cast Iron, Ceramics, Composites, Copper, Hardened Metals, Magnesium, Nickel / Nickel Alloys, Plastics, Precious Metals, Rubber, Stainless Steel, Steel / Steel Alloys, Titanium, Ultra-hard Materials, Other

  • Description: Engineering Support MATERIALS Stainless Steels Titanium Alloys Copper Alloys Polymers Cobalt Chrome CAD SYSTEMS Mastercam Autocad Solid Works INDUSTRIES SERVED Orthopedic/Instrumentation Dental Optical Electronics

    • Capabilities: Drilling, Milling, Turning, Broaching, Deep Hole Drilling, Honing, Laser Machining, Electrode EDM, Wire EDM, Water / Abrasive Jet Machining
    • Number of Axes: 2-axis Machining, 3-axis Machining, 4-axis Machining, 5-axis Machining
    • Specialty Machining: Jigs and Fixtures, Casting Machining, Forging Machining, Tool & Die Manufacturing
    • Micro Machining: Yes

  • Description: Heavy duty tubular steel frame, operator control panel, multiple range

    • Type: Disc Finishing, Lapping Machine, Polisher / Polishing Lathe
    • Mounting: Floor Mounted / Stationary (Machine Tools)
    • Driver Technology: Electric Motor / Vibrator
    • Motor Voltage and Phase: 115 / 120 V 60 Hz, 208 - 230 / 240 V 60 Hz, 460 / 480 V 60 Hz, 50 Hz / International Power, Three-Phase

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  • High Density, Angled Optical Fiber Array and Method
    in a fixture secured to a frame, schematically shown at F in the figure, so that the optical axis of the array and each fiber is fixed in a predetermined direction. Lapping tool 30 is oriented with surface 36 facing mask 20. Tool 30 is advanced so that surfaces 36 engage all fiber tips or the epoxy covering
  • TA022: Benefits and Challenges in Decreasing GaAs through Substrate via Size and Die Thickness
    a. mechanical lapping in order to meet high volume. sheet resistance of less than 0.5 /sq near the front-side. requirements.12, 20, 26, 27 The older single spindle, multi-. metal pad. Also, long throw or collimated sputtering can. wafer grinding systems can easily achieve a 100+10 µm. be used to achieve
  • Programmable Crystal Oscillators with Sub-ps Jitter and Multiple Frequency Capability
    . Customer. Order. · Cutting. · Cleaning. · Die Attach. · Vacuum Bake. Ship. · Lapping. · X-Ray. · Wirebond. · Seal. · Polishing. · Plating. · Fine Tune. · Final Test. Frequency. 4-5 Weeks. 2-3 Weeks. Figure 2. Hybrid Quartz Crystal Oscillator Production Steps. One only needs to tour a typical
  • Optimally Transferred
    faces, but also the subsequent inspection by means of the profile method or an optical measuring method. At DEUBLIN, all surfaces of sealing rings whether hardened tool steel, graphite, ceramics or silicon carbide are lapped and then inspected regarding smoothness and roughness. In this optical
  • Non-Contact Thickness Measurement of Semiconductor Wafers
    the target surface rather than through the target to ground. The individual output signals are summed by the amplifier producing a single 0 to 10 VDC output. System Design. Processing of semiconductor wafers (slicing, lapping, polishing) introduces bow and warp to the wafer profile. True thickness

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