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Optoelectronic Encapsulants
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Supplier: Henkel Corporation - ElectronicsDescription: Good moisture resistance and thermal shock resistance
- Coating Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Industry Applications: Electronics (PCB / SMT Assembly), Optoelectronics / Photonics, Optical Grade / Material
- Composition: Filled
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Supplier: Epoxy TechnologyDescription: Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries. EPO-TEK® OG116-31 Advantages & Application Notes
- Substrate / Material Compatibility: Ceramic / Glass
- Industry: Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Encapsulanting / Potting
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Supplier: Epoxy TechnologyDescription: Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries. EPO-TEK® OG116-31 Advantages & Application Notes
- Substrate / Material Compatibility: Ceramic / Glass
- Industry: Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Encapsulanting / Potting
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Supplier: Epoxy TechnologyDescription: ; it can block out light in opto-electronic devices. • Semiconductor encapsulant for COB packaged die. It may be used as a glob top DAM around the chip. • SMD “staking” material or Surface Mount Adhesive (SMA). The SMA may be used for double-sided PCB bonding of components
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Epoxy TechnologyDescription: ; it can block out light in opto-electronic devices. • Semiconductor encapsulant for COB packaged die. It may be used as a glob top DAM around the chip. • SMD “staking” material or Surface Mount Adhesive (SMA). The SMA may be used for double-sided PCB bonding of components
- Chemical / Polymer System Type: Epoxy
- Resins & Compounds: Liquid
- Compound Type: Casting Resin
- Features: Thermally Conductive
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Supplier: Epoxy TechnologyDescription: ; it can block out light in opto-electronic devices. • Semiconductor encapsulant for COB packaged die. It may be used as a glob top DAM around the chip. • SMD “staking” material or Surface Mount Adhesive (SMA). The SMA may be used for double-sided PCB bonding of components
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.Description: it of value for various electronic and optoelectronic potting/encapsulation applications. This performance characteristic is due to its uniquely effective catalyst system. Master Bond Polymer System UV15X-2 can be cured in very short time periods depending upon type of UV lamp, distance of the lamp
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
- Dissimilar Substrates: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging, Other
- Cure Type / Technology: Single Component System, UV / Radiation Cured (also EB, Light)
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Supplier: Master Bond, Inc.Description: it of value for various electronic and optoelectronic potting/encapsulation applications. This performance characteristic is due to its uniquely effective catalyst system. Master Bond Polymer System UV14X2 can be cured in very short time periods depending upon type of UV lamp, distance of the lamp form
- Compound Type: Electrical Insulation / Dielectric Material, Optical Grade / Material, Thermal / Heat Insulating
- Material Form: Conformal Coating, Encapsulant / Potting Compound, Gap Filling Compound
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Optoelectronics / Photonics, Semiconductors / IC Packaging
- Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
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Supplier: Epoxy TechnologyDescription: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased electrical insulation. It is also more viscous and thixotropic. Can be used
- Substrate / Material Compatibility: Ceramic / Glass
- Industry: Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Encapsulating / Potting
Featured Products for Optoelectronic Encapsulants Top
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or sensor devices; adhesive/seal/encapsulant used for fiber packaging and components; transmission of IR up to 2500 nm; terminating fibers into ferrules; fiber coupling and splicing. Opto-electronic: LCD/LED adhesive for laminating glass layers; adhesion to PET plastic; general potting, encapsulation, and protection; spectral transmission in VIS and IR light; adhesive / encapsulant for VCSEL's packaged devices; resisting yellowing per ASTM D1925; adhesive for precision optics including lens, prism... (read more)Browse Epoxy Adhesives Datasheets for Epoxy Technology
Conduct Research Top
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
Epoxies are used in the packaging and assembly of three opto-electronic devices, including Fiber Optics, LEDs, and LCDss. In fiber optics, you need epoxy for the cable and for the opto-packaging. The fiber optic components are usually packaged in hybrid technology, which mean several
Engineering Web Search: Optoelectronic Encapsulants Top
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Light-emitting diode - Wikipedia, the free encyclopedia
Passive, optoelectronic Working principle
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A characterization of UV effects on optical silicones used in...
Opto-electronic devices such as LEDs, optical sensors, LCDs and color filters have the need for optically transparent encapsulants or adhesives.
- Prof. Chennupati Jagadish : SPIE.org Profile
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Performance of epoxy encapsulants for optoelectronic packaging
Performance of epoxy encapsulants for optoelectronic packaging
- 1994 Proceedings. 44th Electronic Components and Technology...
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Encapsulants and Potting Compounds Suppliers in California:...
GlobalSpec Electronics > Materials > Encapsulants and Potting Compounds > California Encapsulants and Potting Compounds Suppliers in California
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Encapsulants and Potting Compounds Suppliers in Massachusetts:...
GlobalSpec Electronics > Materials > Encapsulants and Potting Compounds > Massachusetts
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Aptek Laboratories, Inc. - Custom Material Formulators -...
Encapsulants & Potting Compounds Films & Pads
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Assembly Instructions Vishay Semiconductors Assembly...
maximum permissible heat that may be applied to - Mass of component encapsulants rather than by the maximum permissible junction temperature.
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Materials for Electronics - Polyimides - Dow Corning
Die Encapsulants Electrically Conductive Materials Encapsulants Gels Lighting Materials Patternable Silicones for Electronics
