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Find parts, products, suppliers, datasheets, and more for:
Optoelectronic Package Materials
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Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Supplier: Kinetics Metal Injection MoldingDescription: or packages used to protect electronic or optical devices in aerospace, automotive, optical, optoelectronic, and telecommunication industries. Nominal Material Composition Fe Ni Co Mn (Max) Si (Max) C (Max) Al (Max) Mg (Max) Zr (Max) Ti (Max) Cu (Max) Cr (Max) Mo (Max) Balance 29 17 0.5 0.2
- Metal / Alloy Types: Other / Miscellaneous Ferrous Alloy (UNS K)
- Shape / Form: Fabricated Parts / Shapes
- Applications: Aerospace / Aircraft (AQ), Automotive / Vehicular, Electronics / RF-Microwave, Other
- Features: Powdered Metal (Compacted)
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Supplier: Epoxy TechnologyDescription: A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.
- Compound Type: Thermal Compound / Thermally Conductive
- Material Form: Casting Resin
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Kinetics Metal Injection MoldingDescription: or packages used to protect electronic or optical devices in aerospace, automotive, optical, optoelectronic, and telecommunication industries. Nominal Material Composition Fe Ni Co Mn (Max) Si (Max) C (Max) Al (Max) Mg (Max) Zr (Max) Ti (Max) Cu (Max) Cr (Max) Mo (Max) Balance 29 17 0.5 0.2
- Metal / Alloy Types: Other / Miscellaneous Ferrous Alloy (UNS K)
- Shape / Form: Fabricated Parts / Shapes
- Applications: Aerospace / Aircraft (AQ), Automotive / Vehicular, Electronics / RF-Microwave, Other
- Features: Powdered Metal (Compacted)
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Supplier: Kinetics Metal Injection MoldingDescription: or packages used to protect electronic or optical devices in aerospace, automotive, optical, optoelectronic, and telecommunication industries. Nominal Material Composition Fe Ni Co Mn (Max) Si (Max) C (Max) Al (Max) Mg (Max) Zr (Max) Ti (Max) Cu (Max) Cr (Max) Mo (Max) Balance 29 17 0.5 0.2
- Metal / Alloy Types: Other / Miscellaneous Ferrous Alloy (UNS K)
- Shape / Form: Fabricated Parts / Shapes
- Applications: Aerospace / Aircraft (AQ), Automotive / Vehicular, Electronics / RF-Microwave, Other
- Features: Powdered Metal (Compacted)
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Supplier: Kinetics Metal Injection MoldingDescription: or packages used to protect electronic or optical devices in aerospace, automotive, optical, optoelectronic, and telecommunication industries. Nominal Material Composition Fe Ni Co Mn (Max) Si (Max) C (Max) Al (Max) Mg (Max) Zr (Max) Ti (Max) Cu (Max) Cr (Max) Mo (Max) Balance 29 17 0.5 0.2
- Metal / Alloy Types: Other / Miscellaneous Ferrous Alloy (UNS K)
- Shape / Form: Fabricated Parts / Shapes
- Applications: Aerospace / Aircraft (AQ), Automotive / Vehicular, Electronics / RF-Microwave, Other
- Features: Powdered Metal (Compacted)
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Supplier: Epoxy TechnologyDescription: A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.
- Compound Type: Thermal Compound / Thermally Conductive
- Material Form: Casting Resin
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Epoxy TechnologyDescription: A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.
- Compound Type: Thermal Compound / Thermally Conductive
- Material Form: Casting Resin
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Epoxy TechnologyDescription: A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.
- Compound Type: Thermal Compound / Thermally Conductive
- Material Form: Casting Resin
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Epoxy TechnologyDescription: A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.
- Compound Type: Thermal Compound / Thermally Conductive
- Material Form: Casting Resin
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Epoxy TechnologyDescription: A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.
- Substrate / Material Compatibility: Metal, Plastic
- Industry: Electronics, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
Featured Products for Optoelectronic Package Materials Top
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DDL performs a wide variety of testing services from thermal package testing to consumer product testing. If you have any question regarding whether or not DDL can perform your specific test, please contact us today. Our experts are here to consult with you and offer any advice you need about your testing. If we're unable to perform your specific test, we will try to recommend someone in the industry who can. Have a question? Please contact us or Ask our Package Testing Expert about your next... (read more) -
AdTech Ceramics has an experienced employee base with a manufacturing capability for multilayer co-fired electronic packages. Our available products include Optical Packages. Processes revolve around 30 plus years of experience in material science, engineering, design, tooling and manufacturing of multilayer ceramics. Materials include Alumina (HTCC), Aluminum Nitride (AlN), BeO and LTCC. Chemical Milling services available (step lids, leads, seal rings) in Kovar, Alloy 42, Spring Steel... (read more)
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Indium9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life ( >8 hours), and can be used on devices down to 0.4 mm pitch. Package-on-Package (PoP) and System-in-Package(SiP) are an exciting new technology that allows standard SMT assembly techniques to be used to manufacture combinations... (read more)
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provide laser lidding and component insertion services for a complete package solution. Material Expertise. Thunderline-Z's expertise includes working with Kovar, aluminum, alumina alloys, brass, cold rolled steel (CRS), stainless steel, and Inconel. Our experienced engineers calculate hole sizes, oven profiling, and solder selection to help create a superior package design for direct sealing Kovar or soldering into aluminum. We are also the industry leader in the use of Au/Sn solder... (read more)
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A "package" TURBO-DRYER® shipped completely assembled 24 shelves. Diameter: 6 ft. (1.8m). This unit, operating at 300°F (150°C), will dry approximately 150 lbs/hr (68kg/hr) of free-drying product from 30% moisture content to 0.5 %. Package unit sizes start at approx. 4 ft. diam. X 5 ft. high (1.2x1.5m) to 12 ft. diam. X 16 ft. high (3.6 x 4.8m). Even, thorough and rapid drying. Wyssmont TURBO-DRYER® delivers very uniformly dried product because material is intermittently redistributed... (read more)
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high density packages that are ideal for medical, military, optoelectronic or any application with requiring attention to frequency, reliability and temperature. AdTech Ceramics' experienced employee base has a 100+ year legacy of ceramic expertise, including material science, engineering, design, tooling and manufacturing of multilayer ceramics, as well as chemically milled metal components and injection molded products. For more information, please visit www.adtechceramics.com or e-mail... (read more)
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ASME fabrication shop for code and non-code vessels. Vessel welded up to 13' diameter and 40' long. Accommodate internal lining and special paint requests. (read more)
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Use PIP to call boundary-scan tests and ISP applications with ease from any of several different working environments. Choose PIP/LV if your testing is currently controlled by a National Instruments LabVIEW program. Or go with PIP/LW for a LabWindows program, PIP/TS for TestStand, PIP/DLL for any C/C++ executive, PIP EXE or PIP/VB for Visual Basic. Regardless of the approach you take, all of your boundary-scan steps will be integrated perfectly within your production sequence. (read more)
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FLSmidth's 75+ years experience in Pneumatic Conveying equates to a reliable air source sizing program customized for your specific requirements. Pressure or vacuum packages are designed with the accessories you require, quality constructed at a competitive price. Specifications: Pressure. Roots / Sutorbilt* Positive Displacement Blowers. Name brand AC motors to suit. V-belt or direct drive. OSHA steel guard. Structural steel base (non-elev.). Inlet filter / silencer. Discharge silencer. Relief... (read more)
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FLSmidth AirslideTM Aeration Unit Packages are supplied for installation as aeration units on the sloped conical bottoms of bins and silos to aid in the withdrawal of dry, relatively free-flowing material. Slope angles should be no less than 45° from the horizontal with silo diameters up to 21 feet (6.4 m). Units can be applied to other storage configurations. Each Airslide Aeration Unit Package consists of standard FLSmidth 8-inch (200 mm) open-type Airslide conveyor units in lengths of 5... (read more)
Parts by Number for Optoelectronic Package Materials Top
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 7378041 | RS Components, Ltd. | OSI Optoelectronics | Photodiode | Mounting:Through Hole; Photo Sensitivity:0.65A/W; Peak Wavelength:970nm; Maximum Dark Current:0.15nA; Photodiode Material:Si; Polarity:Reverse; Supplier Package:TO-18; Pin Count:2; Product Width:5.33mm; Product Length:5.33mm |
| 7378029 | RS Components, Ltd. | OSI Optoelectronics | Photodiode | Mounting:Through Hole; Photo Sensitivity:0.54A/W; Peak Wavelength:900nm; Maximum Dark Current:3nA; Photodiode Material:Si; Polarity:Reverse; Supplier Package:TO-18; Pin Count:2; Product Height:5.08mm; Product Width:5.33mm |
| 7378035 | RS Components, Ltd. | OSI Optoelectronics | Photodiode | Mounting:Through Hole; Photo Sensitivity:0.21A/W; Peak Wavelength:436nm; Maximum Dark Current:0.002nA; Photodiode Material:Si; Polarity:Forward; Supplier Package:TO-5; Pin Count:2; Maximum Rise Time:9000ns; Type:Module |
| 7378066 | RS Components, Ltd. | OSI Optoelectronics | Photodiode | Mounting:Through Hole; Photo Sensitivity:0.65A/W; Peak Wavelength:970nm; Maximum Dark Current:3nA; Photodiode Material:Si; Polarity:Reverse; Supplier Package:TO-5; Pin Count:3; Maximum Rise Time:12ns; Type:Module |
| 7378048 | RS Components, Ltd. | OSI Optoelectronics | Photodiode | Mounting:Through Hole; Photo Sensitivity:0.65A/W; Peak Wavelength:970nm; Maximum Dark Current:2nA; Photodiode Material:Si; Polarity:Reverse; Supplier Package:TO-18; Pin Count:2; Product Length:5.33mm; Minimum Operating Temperature:-40C |
Conduct Research Top
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Eliminating Flux Residue in OPTO-Electronic Packages (.pdf)
With the advent of opto-electronic hermetic packages, it has become necessary to significantly reduce, if not eliminate, foreign materials that can cause reliability problems on the optical components inside the package. One material that has been identified as a possible source for unwanted...
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
Word - imaps2003final3.doc Epoxies for OptoElectronic Packaging; Applications and Material Properties. Michael J. Hodgin. Epoxy Technology, Inc. 14 Fortune Drive. Billerica, MA. 01821. ph : 978-667-3805; fax: 978-663-9782; email: mhodgin@epotek.com. Abstract. Epoxies are used in the packaging...
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Outgassing Species in Optoelectronic Packages
by the use of inadequate test methods, unproven materials and misconceptions in the supply and user industries. A test protocol is provided that addresses these issues, which allows the optoelectronic community to improve device quality and reliability. A complete quantitative analysis of the internal...
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Smart Packages for CPV Cell Devices
of. flat-plate (typically Silicon) photovoltaic. be manufactured by using. the solar energy. The conventional, single. systems, these solar cells utilise the light. semiconductor, solar cells only convert the. optoelectronic semiconductor. assembly techniques (wire. bonding, dicing, pick and place...
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Medical Device Link .
Epoxy material for small electronic packages. A specialty material suited for small optoelectronic-package designs is available from Rogers Corp. (Rogers, CT; 860/774-9605). The white epoxy molding material is formulated to endure high solder temperatures while retaining the necessary optical...
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Ultra-thin mirror for high-performance optics
. Chang-Hasnain, director of UC Berkeley's Center for Optoelectronic Nanostructured Semiconductor Technologies and her graduate students, Michael Huang and Ye Zhou. HCG mirrors also function in a considerably wider light frequency spectrum and will be easier to manufacture, says Chang-Hasnain who is also...
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Process Optimization to Prevent the Graping Effect
as the volume of the solder Figure 2. A schematic showing the definition of. in electronics and optoelectronic. paste deposit divided by the volume of the area ratio for a circular stencil. packaging and assembly. He has. the aperture. authored or edited five books and. numerous technical papers...
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Large Optical Fiber Array Assembly and Method
precisely and reliably to semiconductor laser and detector arrays on a chip. Already, various groups throughout the world have demonstrated feasibility of high speed optoelectronic VLSI switching and two dimensional fiberoptic arrays for an optical crossbar switch. In 1996, reports were published...
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Visible LEDs Application Notes
Engineering & Design Engineering and Design Overivew Optoelectronic Testing Services PCB Design & Layout Services Custom LED Design Assembly Prototyping Inquiry Forms Reliability & Quality Control Technical Articles Application Notes Constant Current LED Drivers Glossary/Terms...
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Reliability and Degradation of Organic Light Emitting Devices (.pdf)
,a) L. S. Sapochak,b) D. M. McCarty,b) and. M. E. Thompsonb). Advanced Technology Center for Photonic and Optoelectronic Materials, Princeton University, Princeton,. New Jersey 08544. Received 19 July 1994; accepted for publication 3 October 1994. We present a simple encapsulation technique for organic...
Engineering Web Search: Optoelectronic Package Materials Top
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Light-emitting diode - Wikipedia, the free encyclopedia Passive, optoelectronic Working principle 3 Colors and materials 3.1 Ultraviolet and blue LEDs |
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Heat sink - Wikipedia, the free encyclopedia electronic components such as high-power semiconductor devices, and optoelectronic devices such as higher-power lasers and light emitting diodes |
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Vishay - IrDA® Transceivers View Our Optoelectronic Videos and Webinars See Vishay Intertechnology, Inc. Information |
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Vishay Semiconductors The Constituents of Semiconductor... ) No. 85 "Rules for Hazardous Materials", to be replaced as soon as a technically suitable alternative material is available ***) Traces of cadmium See Vishay Intertechnology, Inc. Information |
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IEEE - Which Journal Would Be Right for My Research? modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability. |
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Design, fabrication, and reliability testing of embedded... system-on-a-package monolithic integration optoelectronic interconnections embedded optical interconnects interconnects on package optoelectronic |
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[No Title] See Honeywell Sensing and Control Profile & Catalog |
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Canon U.S.A. : Consumer & Home Office : EOS Rebel T3 See Canon USA Information |
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Canon U.S.A. : Consumer & Home Office : VIXIA HF M4 See Canon USA Information |
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Untitled Page Package Dynamics & Materials Characterization Industrial Materials Group KODAK EXPRESS Digital Solutions |
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