Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low outgassing approval. It will cure at room temperature or more rapidly
- Use: Conformal Coating, Encapsulant / Potting Compound, Gap Filling Compound
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Semiconductors / IC Packaging, Electronics, Electrical Power / HV
Supplier: TIGER Drylac Powder Coatings
Description: Out-gassing forgiving agent suitable for powder coatings applied on gassing substrates. Typical Applications Hot dipped galvanized steel. Railings. Steel pipes. Steel cylinders. Galvanized constructions. Features Powdery agent for post-mixing. Reduces substrate related out-gassing. Good
Supplier: Real Seal Company
Description: Engineered Thermoset Rubber Components Rubber has its own unique array of available materials and associated properties, and can be produced in almost any conceivable configuration, including bonding to metal components. Rubber materials possess some physical properties that are superior to many
Standards and Technical Documents - Standard Test Method for Determining the Outgassing Potential of Sealant Backing -- ASTM C1253 -93(2005)Supplier: Adhesives.org
Description: This test method provides a procedure for determining the outgassing potential of a sealant backing when it is punctured during or after installation, with the puncture occurring before the sealant cures.
Supplier: Garlock Helicoflex
Description: Exceptionally low permeability and outgassing
- Seal Type: Spring-Energized
- Shape: Round
- Cryogenic Application: Yes
- Application / Industry: Chemical & Processing
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Featured Products for Outgassing Top
EPO-TEK® Low Outgassing Adhesives
Epoxy Technology announces its newly updated Low Outgassing Adhesives brochure. This technical piece has been revised to include several new products that now meet the NASA ASTM E595, MIL-STD 883/5011 and Telcordia GR-1221 Standards. These newly recognized products include: EPO-TEK 301 & 301-2 for NASA ASTM E595 Low Outgassing Requirements. EPO-TEK H20E-MP & EK1000-MP for MIL-STD 883/5011 Low Outgassing Requirements. EPO-TEK 323LP, 383ND, OG116-31 & OG198-54 for Telcordia GR-1221... (read more)
Browse Epoxy Adhesives Datasheets for Epoxy Technology
Master Bond, Inc.
Tough Epoxy Meets NASA Low Outgassing Requirements
It meets NASA low outgassing specifications and has superior durability and dimensional stability. It is formulated to cure at elevated temperatures between 250°F and 300°F for 1 hour, and produces exceptional bonds for service over the wide temperature range of 4K to 400° F. These tough bonds are remarkably resistant to severe thermal cycling and many chemicals, including water, oil and various fuels. The hardened adhesive is a superb thermal conductor with a thermal conductivity of 9-10 BTU... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc.
BEI Kimco Magnetics
Voice Coil Actuator Has Near Zero Outgassing
BEI Kimco Magnetics' Voice Coil Actuator Solves Challenging Application Requirements for Near Zero Outgassing Capabilities. BEI Kimco Magnetics, a company of Custom Sensors & Technologies (CST), Inc., recently met the challenging voice coil actuator (VCA) requirements utilized in an optical positioning control application. High quality optical devices demand low outgassing levels to minimize contamination. The devices also require high precision actuation for exact motion control... (read more)
Browse Voice Coil Actuators and Motors Datasheets for BEI Kimco Magnetics
Master Bond, Inc.
UV Curable Epoxy Is NASA Low Outgassing Approved
This unique formulation is easy to apply and has an advantageous high viscosity. It is not oxygen inhibited and cures rapidly at room temperature when exposed to UV light. Maximum UV absorption takes place in the 320-365nm range. It can be used in a wide array of optical, electro-optical and vacuum applications that until now have been off limits for UV curable compounds. To optimize low outgassing properties, UV10TKLO-2 should be preheated to 50°C for 15 minutes prior to use and then allowed... (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc.
Conduct Research Top
Outgassing of Silicone Heater Compound
Basics of silicone outgassing.
AN0026 Outgassing Test Results for FlexiCap TM Capacitors (.pdf)
Results for ECSS-Q-70-02A outgassing tests on FlexiCap TM capacitors. ��. Syfer Technology Limited, Old Stoke Road,. Arminghall, Norwich, Norfolk, NR14 8SQ,. United Kingdom. Tel: +44 (0) 1603 723300. Tel. (Sales): 01603 723310. Fax: +44 (0) 1603 723301. Email: firstname.lastname@example.org. Web: www.syfer.com
Outgassing of Silicone Elastomers
is volatile component outgassing. While outgassing is a valid concern for a number of sensitive applications, there is a broad lack of understanding about silicone outgassing, as well as much misperception and confusion. As a result, silicone is often excluded from designs. This paper broadly
Understanding Low Outgassing Adhesives
Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. What's more, most bonding, potting, encapsulation
Outgassing Species in Optoelectronic Packages
The microelectronics community has long been plagued with the problem of moisture formation and outgassing of various fixed and organic gaseous species into the device cavity. It is now very apparent that the optoelectronic packaging community is having the same problems only made more complex
Low Outgassing Accelerometers and Cables for Thermal Vacuum and Vibration Test Environments
Exposure to the high vacuum level of a space environment induces material outgassing in. ordinary accelerometers and cables. Any substance subjected to a vacuum has the potential to. release trapped gasses. Contaminants from outgassing can condense onto nearby surfaces such as. photo-optic devices
Large stainless weldment used in semiconductor chip fabrication. Part needed clean, chromium rich surfaces.
. In addition, they wanted to. improve the microfinish to eliminate outgassing. ./3cd759ee-2053-4b0b-b050-b87abc78fed0 #1085 — Brite Ultracleaning/Brite Microfinishing. Industry: Electronics/Communication. 32”. Mfg/Method: Machining and welding. Alloy: 304 stainless steel. ProbleM: This component
Thermal Pad Design and Process for Voiding Control at QFN Assembly (.pdf)
of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. Thermal Pad Design and Process for Voiding Control at QFN Assembly Indium Corporation Tech Paper. Thermal Pad