service, and engineering support. Our manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 200mm. We offer a variety of processes, including Photolithography, Lift-Off, Plasma Etch, Wet Etch, Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon Carbide, Thermal
Oxidation, Chlorinated
Oxidation, N2/H2 Annealing, Evaporated Metals, and a variety of PVD films to satisfy our customers' needs...
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