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  • eASIC reduces multi-level package design times with CST MICROWAVE STUDIO
    When designing a chip for a high-speed application, it's not only. the behavior of the IC itself that counts. The whole channel, including. the package and the printed circuit board (PCB), affects the performance. Find out how eASIC reduced multi-level package design times with the help of CST.
  • How to Improve Opening Easiness of Package
    Abstract: in review of container package and flexible package, this article introduces some important indexes of opening easiness as well as the relating test methods. It also briefs on the importance of these tests. Opening easiness of package, which is designed mainly in relation to small package
  • System-in-Package RF Design and Applications
    System-in-Package RF Design and Applications. Offering a solid grasp of RF components together with state-of-the-art packaging strategies, this practical guide will help you meet today s increasingly demanding requirements for reliability, manufacturability, RF performance, size, and cost.
  • Package Performance Testing Conundrum: Solved!
    of sterility, product breakage, etc.) for the package system design performance validation must be established prior to testing.
  • Testing Medical Devices and Package Integrity
    When a manufacturing firm produces a product designated for use in the medical field, the company must supply one element regardless of part design: assurance. Through the use of in-line product testing and final package testing, a manufacturer can document the steps taken to assure the end user
  • Strength and Integrity: The Basics of Medical Package Testing
    The release of a terminally sterilized medical device or product to the marketplace is the culmination of monumental design and development effort. Efficient, effective and safe usage characteristics are critical. Once the product has met its own design criteria, the package in which it is enclosed
  • FOUR WAYS TO REDUCE VOIDS IN BGA/CSP PACKAGE
    influences on the amount of voiding one can expect in an assembly. This paper will discuss how print volume (stencil design), peak reflow temperature, paste flux chemistry and alloy selection affect the level of voiding to be expected when BGA/CSP packages are assembled in a lead free process.
  • Industrial Design: Thinking Outside of the Packaging
    it comes to consumer goods, style and innovation in packaging are important, but shelf presence is everything. Hence, in changing a package design, it is important to keep the original feel of the product, especially for legacy brands. Consumers know what products they like. Should packages change

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