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Passivation Glasses

 

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Glass materials have a random, liquid-like (non-crystalline) molecular structure. They are excellent thermal insulators and electrical insulators, and have high dielectric strength. At ordinary temperatures, glass materials are relatively strong, inert, biologically inactive, and corrosion resistant. 
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  • Technical & Commercial Glass Application Guide (.pdf)
    . . . . . . . . . . . . . . . . . . . . . 26. 7.5 Intermediate sealing glasses . . . . . . . . . . . . . . 27. 8. Solder Glasses. 28. 9. Passivation Glasses. 31. 10 Glass Ceramics. 33. Glass Types. 35. Literature. 39. 3. 99120_Techn_Gl_US.qxd 18.01.2008 13:39 Uhr Seite 4. Fig. 1. Ingredients for the production of special glasses
  • Specialized Glass Physical & Technical Properties (.pdf)
    Intermediate sealing glasses . . . . . . . . . . . . . . 27. 8. Solder Glasses. 28. 9. Passivation Glasses. 31. 10 Glass Ceramics. 33. Glass Types. 35. Literature. 39. 3. 99120_Techn_Gl_US.qxd 18.01.2008 13:39 Uhr Seite 4. Fig. 1. Ingredients for the production of special glasses. 4. 99120_Techn_Gl
  • Design Guidelines - Thick Film Resistors and Patterned Substrates
    resistors. on one side of chip. yes, parameter dependent. ·TCR. 100. ppm. typ.,. 200. max. ·Typical. tolerance. (value). 1%,. 2%,. 5%,. 10%. Passivation Glass Coating. ·Minimum. chip. size. 0.050. X0.050. ·Minimum. overlap. 0.003. Vias (filled or plugged through holes). ·diameter (min, max). 0.007, 0.020
  • MICRO:Product Technology News (June '99)
    within a single chamber. The system's process portfolio includes all dual-damascene structures, contacts, vias, spacers, and passivation etch in doped and undoped oxides and low-k dielectrics. Throughput can exceed 70 wafers/hr in some critical applications. The system also includes closed-loop
  • MICRO: Special Apps
    in the circuit area will probably be covered with various passivation layers. By the end of processing, the particle may appear as a small dot. Meanwhile, the particle in the sensor area will be covered by thick spacer oxide and sensor poly, resulting in a much larger, bubblelike defect. Although both
  • Crystalline Silicon Solar Cell Manufacturing (.pdf)
    . Solar cell manufacturing typically involves a number of steps. Passivation/. that are performed under vacuum to maintain cleanliness or to. antireflection. create appropriate processing conditions. Similar to the needs of. semiconductor facilities in the 1980s, new, larger solar cell manufac- n-type Si
  • Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)
    protection of memory die, passivation isolation of. redistributed bond pads, and perimeter edge sealing of. glass windows or lids over opto-IC's. PROCESSING EQUIPMENT USED. The screen printer used for these experimental projects is. an MPM-SPM with a custom vacuum platen for holding. wafers up to 300mm
  • MICRO:Top 40 - Page 2 (Nov '99)
    and organic ARC etching, and photoresist stripping are performed in situ within a single chamber. The system's process portfolio includes all dual-damascene structures, contacts, vias, spacers, and passivation etch in doped and undoped oxides and low-k dielectrics. Throughput can exceed 70 wafers

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