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Description: Wanbang technology relies on 20 years of precision manufacturing of aluminum products, military supporting projects, customized cooling modules, Haier, Midea's cold-conducting heat transfer project development, vacuum phase change all-aluminum uniform temperature plate and other
- Device: Passive Heat Sink
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Supplier: CoorsTek
Description: , industrial equipment, and consumer appliances. HEAT SINKS CoorsTek ThermTile™ ceramic heat sinks and electrical insulators are an optimum choice when thermal management is important — combining the benefits of strong ceramic tiles, good thermal conductivity, and
- Device: Passive Heat Sink
- Material: Other Materials
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Supplier: Accuris
Description: PHASE CHANGE MATERIAL-BASED HEAT SINKS: A MULTI-OBJECTIVE PERSPECTIVE
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE TCF 2000 AF, Phase Change, Thermal Management LOCTITE® TCF 2000 AF phase-change thermal interface material is suitable for use between a heat sink and a variety of heat generating components. This product is supplied as a dry compound coated onto an
- Features: Phase Change
- Use Temperature: 302 F
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material BERGQUIST® HI FLOW® THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. BERGQUIST HI FLOW THF 1000F-AC consists of a soft,
- Features: Phase Change
- Thermal Conductivity: 1 W/m-K
- Use Temperature: 248 F
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Supplier: Henkel Corporation - Industrial
Description: interface material between a computer processor and a heat sink. Above the phase change temperature, BERGQUIST HI FLOW THF 1600G wets-out the thermal interface surfaces and flows to produce low thermal impedance. The material requires pressure of the assembly to cause
- Features: Phase Change
- Thermal Conductivity: 1.6 W/m-K
- Use Temperature: 212 F
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Supplier: Henkel Corporation - Industrial
Description: handling associated with grease. BERGQUIST HI FLOW THF 900 is tack-free and scratch resistant at room temperature and does not require a protective liner in shipment when attached to a heat sink. At 65°C (phase change temperature), BERGQUIST HI FLOW THF 900 changes
- Features: Phase Change
- Thermal Conductivity: 0.9000 W/m-K
- Use Temperature: 266 F
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Supplier: Henkel Corporation - Electronics
Description: (Known as LOCTITE Thermstrate 2000 Phase Change ) LOCTITE TCF 1000 AL is a phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. It is supplied as a dry compound coated onto an
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Allied Electronics, Inc.
Description: Aavid's Ultrastick is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free, paraffin-based thermal compound changes phase at 60°C, with a concurrent volumetric expansion that fills gaps
- Material Type: Grease / Paste
- Use Temperature: -40 to 392 F
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Supplier: RS Components, Ltd.
Description: Aluminium heatsink solution with plastic clips, and phase change thermal interface material for heat removal on BGA packages and similar heat sources. Low profile. Base thickness 1.7mm. Black anodised finish. Plastic clip for simple attachment to BGA. High performance
- Height: 10 mm
- Length: 19 mm
- Mounting: Clips, Other
- Thermal Resistance: 5.2 °C / W
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Supplier: RS Components, Ltd.
Description: Aluminium heatsink solution with plastic clips, and phase change thermal interface material for heat removal on BGA packages and similar heat sources. Low profile. Base thickness 1.7mm. Black anodised finish. Plastic clip for simple attachment to BGA. High performance
- Height: 10 mm
- Length: 25 mm
- Mounting: Clips, Other
- Thermal Resistance: 4.4 °C / W
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Supplier: RS Components, Ltd.
Description: Aluminium heatsink solution with plastic clips, and phase change thermal interface material for heat removal on BGA packages and similar heat sources. Low profile. Base thickness 1.7mm. Black anodised finish. Plastic clip for simple attachment to BGA. High performance
- Height: 10 mm
- Length: 37.5 mm
- Mounting: Clips, Other
- Thermal Resistance: 2.9 °C / W
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Supplier: Xoxide
Description: Mounting Mechanism - Easy Installation w/o Use of Tools S.P.S. (Pipe Slant Structure) - Curved Shape Allows Direct Heat Transfer F.P.S. (Fast-Phase Structure) - Allows Additional Heat Dissipation Optimize Overall PC Performance Specifications:
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Supplier: OMEGA Engineering, Inc.
Description: The SCR19-H and SCR39-H power controllers are designed to proportion electric power to resistive loads only, such as ovens, furnaces, heat sealers, etc. The controllers consist of power semi-conductors (SCRs), properly sized heat sinks, trigger circuitry, and fuses supplied on
- Command Signal: Analog Current (e.g. 4-20 mA)
- Control Feedback: Output Current Control
- Diagnostic Indicators: Yes
- Maximum Current: 125 to 250 amps
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Supplier: Vincotech (Germany) GmbH
Description: There is a new standard brake resistor resistor S30814-Q992-A in thick film on ceramic technology. It is used as a component that can handle high energy pulse. Engineered for mounting on a heat sink with pre-applied thermal interface material (“Phase Change
- Category / Application: Other
- Configuration: Single Resistor
- Power Rating: 100 watts
- Resistance Range: 400 ohms
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Supplier: Henkel Corporation - Electronics
Description: Hi-Flow 300G consists of a thermally conductive 55°C phase change compound coated on a fiberglass web. Hi-Flow 300G is designed as a thermal interface material between a computer processor and a heat sink. Above the phase change temperature, Hi-Flow 300G
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: Loctite Silverstrate is an electrically conductive phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a dry compound coated onto an aluminum substrate. The compound
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE ISOSTRATE 2000 electrically conductive isolating phase change thermal interface material is suitable for use between a heat sink and a variety of heat dissipating components. It is supplied as a dry compound coated onto KAPTON™ MT substrate. It offers high
- Industry: Electronics
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Supplier: Richardson RFPD
Description: mounting on a heat sink with pre-applied thermal interface material, the Q992-A provides an economic and easy assembly with excellent performance. Features Ultra low profile thick-film on ceramic 2 kW peak power Easy spring fixing heatsink mountable Ideal
- Power Rating: 2000 watts
- Resistance Range: 400 ohms
- Technology / Construction: Thick Film
- Tolerance: 20 +/- %
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Supplier: RS Components, Ltd.
Description: Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance
- Chemical / Polymer System Type: Specialty / Other
- Thermal Conductivity: 1 W/m-K
- Use Temperature: 248 F
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Supplier: ValueTronics International, Inc.
Description: % of full scale + 1 count Max. Voltage Differential from Output to Safety Ground: 3 kW: 150 VDC Remote Start/Stop and Interlock: TTL compatible input or 12-250 VAC (12-130 VDC) or a contact closure Cooling: Internal fan, overtemperature shutdown at internal heat sink
- DC Output Power: 3000 watts
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Supplier: ValueTronics International, Inc.
Description: . Additional Features: DC Output Range: Volts: -36 to +36; Amps: -1.5 to +1.5 Current Sink: ± 0.3 A Ripple and Noise: <0.01% of max. power or 3 mV RMS Gain: >35,000V per volt Output Impedance: 0.005 W AC Input: 105 to 125 VAC or 210
- DC Output Power: 54 watts
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forced ventilation and hence require a supply voltage. The new 48 AAC rated 3-phase relay uses a larger, natural convection heat sink that eliminates the need for additional supply voltage if system monitoring is not required. The device can be panel-mounted inside of an electrical enclosure, or if a (read more)
Browse Solid State Relays Datasheets for CARLO GAVAZZI Automation Components -
CARLO GAVAZZI's newest addition to its RGC Series Solid State Contactor platform - single-phase zero-crossing relays, features an integral heat sink. They offer the best in the class current rating of up to 37 AAC at 40°C or 43 AAC at (read more)
Browse Solid State Relays Datasheets for CARLO GAVAZZI Automation Components -
380Vac or 480Vac 3-phase sources are also available on request. The HTH 1K-F6W is typically used to power industrial applications such as DC motor control, battery charging, DC bus voltage for distributed systems and power servos. Cooling by conduction via a heat-sinking (read more)
Browse Power Supplies Datasheets for ABSOPULSE Electronics Ltd. -
IP54 enclosure which provides protection from dust, metallic dust and water spray. Cooling is by convection via heat-sink fins on two sides of the unit. The potting of the internal modules ensures effective heat transfer to the fins. The HVI 3KP-V9 operates over a 0°C to +50°C (read more)
Browse Power Supplies Datasheets for ABSOPULSE Electronics Ltd. -
Flexible heaters offer very good heat transfer to the heat sink in a very low profile and low mass package. Because they are flexible, they can also conform to, and heat, irregular surfaces that other types of heaters cannot. TCR (Temperature Coefficient of Resistance) of custom heater alloys (read more)
Browse Flexible Heaters Datasheets for Flexible Circuit Technologies, Inc. -
found in HVAC systems, as well as industrial and portable air conditioning; in air cooling for variable frequency drives (VFD), wind power generators and power converters, solar inverters, uninterruptable power supplies (UPS), transformers, heat sinks, fan coils, telecom racks and other industrial (read more)
Browse HVAC Fans and Blowers Datasheets for Rosenberg USA -
increase airflow and pressure output by 2% to 5% depending on the fan model. Features of the GD84 motor include higher efficiency electronics that offer a significant decrease in nominal current. An improved housing design features an integrated, highly efficient heat sink for improved (read more)
Browse HVAC Fans and Blowers Datasheets for Rosenberg USA -
ready-to-use, out-of-the-box solution, mainly targeting Plastics & Rubber, Packaging & Wrapping, HVAC and Food & Beverage markets. Features include: 3-Phase solid state switching devices Integral heat sink with robust metal DIN rail adapters (read more)
Browse Solid State Relays Datasheets for CARLO GAVAZZI Automation Components -
SSR open and short circuit detection LED indication of fault conditions NO and NC transistor output Pluggable spring input and alarm terminals RGC1..M SSR with an integrated heat sink RGS1..M SSR requiring an external heat sink Rated (read more)
Browse Solid State Relays Datasheets for CARLO GAVAZZI Automation Components -
phase). Compact, lightweight, fully encapsulated. Short circuit and overload protected. No heat sinking or forced air required. Input/output isolation. Extensive EMI filtering and shielding. 4.Mini Encapsulated-with screw terminals,SWITCHING REGULATED AC-DC single output(accepts either AC or DC (read more)
Browse Linear Power Supplies Datasheets for Acopian Power Supplies
More Information Top
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Journal of Thermophysics and Heat Transfer > Design of a Dual Latent Heat Sink for Pulsed Electronic Systems
The liquid–vapor latent phase change heat sinks , like heat pipes, always have the limitations of critical heat flux of the working fluid and evaporator dry out at high heat fluxes.
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A novel hybrid heat sink using phase change materials for transient thermal management of electronics
[12] J. Leland and G. Recktenwald, “Optimization of a phase change heat sink for extreme environments,” Proc SEMITHERM’03, pp. 351– 356, 2003.
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Advanced Manufacturing Technology, ICMSE 2012
Keywords: phase change heat sink , thermal analysis, pressure drop analysis.
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Heat Transfer Performance of a Dual Latent Heat Sink for Pulsed Heat Loads
Liquid-vapor latent phase change heat sinks like thermosyphons and heat pipes always have the limitations of critical heat flux of the working fluid and evaporator dry-out at high heat fluxes.
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Analysis, Design, and Control for Robots in
Optimization of a phase change heat sink for extreme environments.
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Low profile heat pipe heat sink and green performance characterization for next generation CPU module thermal designs
In order to meet the next generation CPU thermal requirements with a phase change heat sink , two heat sink technologies and their associated prototypes will be described.
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Forming mechanism of three-dimensional integral fin based on flat surface
Fabrication and testing of phase change heat sink for high power LED [J].
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Optoelectronics Engineering and Information Technologies in Industry
Fabrication and testing of phase change heat sink for high power LED[J].
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Crew Exploration Vehicle Environmental Control and Life Support Development Status
Finally each set of flow legs pass through a set of phase change heat sinks before recombining and entering the pressurized crew module.
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Aalborg Universitet
The studies include discrete models for the temperature distribution of integrated LED light sources [5], microjet based cooling system for LED arrays [6], phase change heat sinks for high power LEDs [7], optimum design of radial heat sink on a LED [8…