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  • Description: Design and Manufacturing Services One size does not fit all. Whether it is design assistance, custom products or smaller volumes, clients need flexible solutions instead of rigid excuses. In addition to our standard products, we offer an array of design and manufacturing services. As the leader in

    • Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Inspection / Testing, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Wafer Bonding, Wet / Chemical Etching, Other
    • Location: North America, United States Only, Southwest US Only
    • Materials: Silicon, Ceramic, Glass, Metal / Nickel, Polymer / Organic, Specialty / Other
    • Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other

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  • Description: No Description Provided

    • Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, LIGA, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Wafer Bonding, Wet /
    • Location: North America, United States Only, Southwest US Only
    • Materials: Silicon, Ceramic, Compound Semiconductor, Glass, Metal / Nickel, Quartz, Polymer / Organic, SOI
    • Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other

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  • Description: No Description Provided

    • Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Metallization - PVD Thin Film, Photolithography, Wet / Chemical Etching, Other
    • Location: North America, United States Only, Northeast US Only
    • Materials: Silicon, Ceramic, Compound Semiconductor, Glass, Quartz, SOI, Specialty / Other
    • Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other

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  • Description: No Description Provided

    • Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Screen Printing, Wafer
    • Location: North America, United States Only, Midwest US Only
    • Materials: Silicon, Compound Semiconductor, Glass, Quartz, SOI
    • Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other

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  • Description: Photolithography is the technique underlying all integrated circuit manufacture. To a large extent, the minimum feature size and the performance of ICs is determined by the resolution achievable in this step. Also, the process yield has a strong impact on a Fab's economy. The troubleshooting

    • Continuing Education Credit (CEU): Yes
    • Modality: Off Site (Conference / Seminar), On-site / In Plant
    • Technology / Subject: Nanomaterials / Nanotechnology, Photonics / Optics, Semiconductors / Microelectronics (ICs), Specialty / Other

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  • Description: heterostructure growth using liquid phase epitaxy (LPE) and metalorganic chemical vapor deposition (MOCVD), photolithography, assembling, characteristics testing and producing of related electronic devices. IBSG produces the full line of light emitting diodes, laser diodes and

    • Active Area Diameter or Length: 0.2000 to 2 mm
    • Dark Current: 500 to 500000 nA
    • Operating Temperature: -40 to 50 C
    • PN, PIN, or Avalanche: PIN Photodiode

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Conduct Research Top

  • MICRO: Product In Action (June '2000)
    As chipmakers grapple with the stringent requirements of deep ultraviolet (DUV) photolithography, they confront a wide range of organic contaminants--from amines, halogens, and radicals to chlorine, bromide, and arsine. To remove such contaminants, most fabs have added chemical filters
  • MICRO: Products
    The SpinBall is a single-wafer spin coater/developer specifically for R &D labs and specialty production fabs. Designed for the application of photolithography chemicals, the station provides uniform, precise, and repeatable process results through its advanced aerodynamic cup design. Based
  • MICRO: Product Technology News (April 2001)
    A simulation tool set enables photolithography engineers and IC designers to predict the manufacturability of their products before production. The LithoCruiser helps design and optimize lithography processes. It allows viewing of the lithography process windows based on the simulation of circuit
  • MICRO: Rebuilding Copperopolis - Biolsi (July 2000)
    process steps, or shorts as a result of scratches caused during chemical-mechanical polishing (CMP), an integral but dirty step in copper processing. Defect sources can be classified into four categories: particulate, metallic, organic, and other types. Particles deposited on the wafer can cause
  • MICRO: Sutton (April 2001)
    Chris Lansford, Clint Miller, and Dan Sutton, Monitoring of defect excursions and research into their generation mechanisms can facilitate the integration of a cost-saving prewet step into a photoresist process. As i-line and deep ultraviolet (DUV) photolithography processes have grown more complex
  • Metrigraphics Article in Today's Medical Developments
    for precision manufacturing. Metrigraphics, a division of Dynamics Research Corporation has grown into a worldwide supplier of high precision custom components for designers and builders of medical and analytical instruments and devices - applying their core technologies of electroforming, photolithography

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