Supplier: USHIO America, Inc.
Description: Medium pressure, metal-halide lamps used in a variety of industries including uv curing, printed circuit board and photolithography exposure and industrial graphic arts processing applications. PRODUCT FEATURES & BENEFITS For Blacklight Special Effects Only use in UV Protective Housing Average
Supplier: USHIO America, Inc.
Description: MHL Metal Halide Medium pressure, metal-halide lamps used in a variety of industries including uv curing, printed circuit board and photolithography exposure and industrial graphic arts processing applications. Single Ended Metal Halide - G12 Base Product Features & Benefits For Blacklight
- High Intensity Discharge (HID) Lamp Type: Metal Halide Lamps
- Lamp Power: 150 watts
- Rated Average Life: 500 hours
- Maximum Overall Length: 3.9 inch
Supplier: Omega Optical, Inc.
Description: Description / Specifications: Offers improved exposures, and sharper, straighter feature walls of the SU-8 photoresist. With a nominal cut-on wavelength of 360nm, blocking shorter wavelengths and transmitting the longer wavelengths including the useful 365, 405 & 436nm mercury lines.
- Filter Type: Other
- Application Specific: Ultra-Violet (UV)
- Thickness: 0.0787 inch
Supplier: KLA-Tencor Corporation
Description: The MPX Focus/Exposure Line Monitor provides an innovative methodology to monitor photo excursions of focus and exposure on production wafers. An option on the Archer series advanced overlay metrology systems, MPX improves overlay tool cost of ownership (CoO) as a single solution that monitors all
- Form Factor: Monitor / Instrument
- Mounting / Loading: Autoloading / In-line
- Applications: Photolithography / Patterning
- Measurement Capability: Other
Supplier: Edmund Optics Inc.
Description: surface of the target, as does the Fused Silica Negative Target (clear pattern, chrome background).The Fluorescent Fused Silica Targets are ideal for applications involving fluorescence and confocal microscopy, nanotechnology, photolithography, and other UV-based imaging systems. The Fluorescent Fused
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Medical Device Link .
Micro-optical Technology Applied to Joint Implants A transatlantic partnership may provide balm for some weary bones. Empa Swiss Federal Laboratories for (Thun, Switzerland) will use a photolithography system developed in the United States to fabricate implantable devices. Among the anticipated
MICRO: Product Technology News (April 2001)
A simulation tool set enables photolithography engineers and IC designers to predict the manufacturability of their products before production. The LithoCruiser helps design and optimize lithography processes. It allows viewing of the lithography process windows based on the simulation of circuit
MICRO:Process Equipment-Lithography, by Zhou Lin (Feb 99)
to shrink, this phenomenon and its effects on defect density and product yield have become an increasingly important concern. In response, both manufacturers and users of photolithography equipment must implement procedures that will help ensure that the process chamber remains free of molecular
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Study on advanced nanoscale near�?field photolithography
To calculate the density of energy absorbed by the photoresist surface during point photo- lithography exposure , Lin and Yang (2006) used the exposure energy density formula of a static fixed point as follows: EPððxP; yP; h ¼ 0Þ; tÞ ¼ IPðxP; yP...
Product Design and Manufacture
To calculate the density of energy absorbed by the photoresist surface during point photolithography exposure , Lin and Yangutilized the exposure energy density formula of a static fixed point as follows: .
On-Chip Biological Analysis using Magnetic Beads
Photolithography Exposure through mask1 for ≈ 10 s.
Inverse model of fiber probe aperture size using a non�?destructive method
To calculate the density of energy absorbed by the photoresist surface during point photo- lithography exposure , Lin and Yang (2006) utilized the exposure energy density formula of a static fixed point as follows: EPððxP; yP; h ¼ 0Þ; tÞ ¼ IPðxP; yP...
Three-dimensional photolithography technology for a fiber substrate using a microfabricated exposure module
A 1 mm thick quartz wafer was used in this work for the fabrication of the 3D photolithography exposure module.
Micromanufacturing and Nanotechnology
The procedure for producing a micromirror OVD involves two main phases – production of an image specific mask by electron beam lithography and the use of that mask within a photolithography exposure system to produce the required micromirror surface relief structure within...
Low-voltage electron-beam lithography linked to photolithography
silicon substrate) for the c-beam and for the photolithography exposures .
Formation of polysilicon nanowires as transducer for biosensor using plasma trimming process
The G-line and I-line are the most commonly used for photolithography exposure processes .
Equipment log analysis to improve photolithography cluster productivity
The majority of photolithography exposure systems in use today are configured in a linked mode of operation with a resist coater/resist developer track.
Study of critical modulation transfer function by UV-vis spectroscopy
2.3 Photolithography Exposure using the Mask Aligner .
Study of improvement of imaging quality in project photolithography with amplitude phase compound filtering
Finally, some contrast experiments for photolithography exposure with .
Organic Thin Film Transistor Integration
imperfections in the OTFT devices (e.g., large VT, leakage current, poor subthreshold slope, parasitic leakage, parasitic capacitances), and process-induced mismatches between devices (e.g., material non-uniformity, offset in mask alignment during photolithography exposure ).
Partnership for a rapid yield enhancement solution in a manufacturing environment on a 0.65 μm triple level metal device
1) gate polysilicon photolithography exposure time variation and (2) P-channel lightly doped drain (P-LDD) implant dose variation.