Photolithography For Wafer Fabrication

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• Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)
  the pattern resolution and mechanical. Wafer fabrication has long been dominated by concern. resistance of screen-printed polymers versus spin-on. for particulate control in order to achieve the minimum. methods. Optical microscopy of screen-printed coatings. feature sizes necessary for state-of-art...
• Using an automated cleanroom monitoring system to maximize contamination control Continuous multisensor data collection and real-time displays are among the capabilities of a microcomputer-based monitoring system installed in a Motorola wafer fab.
  their carriers before being loaded into a tool. The monitored bays contain such wafer-processing equipment as diffusion furnaces, etch stations, photolithography systems, ion implanters, deposition systems, and wet processing tools. Wafer inspection stations are also monitored. There is a separate...
• MICRO:The 300-mm Imperative, by Gary Gallagher, p.81 (July '99)
  Gary Gallagher and Michael Wright, The creation of an optimal wafer environment throughout all stages of IC fabrication poses a constant challenge to the semiconductor industry. Regardless of whether this challenge has been felt at the macro level in the cleanroom or at the micro level in a process...
• MICRO: Rebuilding Copperopolis - Biolsi (July 2000)
  by manufacturing tools and actual processes. Improvements in cleanroom design have greatly reduced airborne particles, and advances in cleanroom procedures and wafer-handling techniques have resulted in fewer particle sources. But particle generation caused by wafer fabrication tools and their related...
• MICRO:Industry News:Expansions & Acquisitions (Jan '99)
  method to reduce both fab start-up time and time to market for next-generation microchips. EPIC houses all of Applied's copper-based technologies, which have been combined to demonstrate a multilevel copper interconnect process. Nearby buildings contain a deep-UV photolithography cell for wafer...
• MICRO:Behind the Mask
  and tool-installation activities. Presumably that tendency affects both mask and IC cleanrooms. Effects of AMC. To understand the effects of AMC on maskmaking applications, it is useful to review the experience of the semiconductor fabrication industry. Leading-edge IC wafer production takes place at 130 nm...
• MICRO:Product Technology News (April '99)
  The KA250 wafer carrier is molded of PEEK and a polycarbonate to ensure low-particulate operation and dimensional stability. The carrier's wafer and equipment contacts are made of Stat-Pro 3000, a static-dissipative PEEK material, while a polycarbonate is used in the frame and end wall. The design...
• MICRO: Products
  The Tactras wafer-handling platform supports both polysilicon etch and dielectric etch chambers. Suitable for advanced 300-mm fabs, the platform builds on the success of the company's previous vacuum-based cluster tools. It has an advanced robotic system that offers high-speed and efficient wafer...
• MICRO: Product Technology News (September 2000)
  009;A chemical-mechanical planarization (CMP) system combines rotational and orbital technologies, providing the stability of an advanced solid polishing platen with the flexibility of orbital system architecture. Designed for logic and ASIC applications, the Momentum dry-in/dry-out wafer...
• MICRO:Process Equipment-Lithography, by Zhou Lin (Feb 99)
  . A Model S8820 SEM (Hitachi Scientific Instruments; Mountain View, CA) was used to measure linewidth and an XL40 (Philips Analytical; Mahwah, NJ) for cross-section SEM. In both cases, 350-nm horizontal group lines were measured. During the photolithography process, both the control wafer and the test...

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