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...cleaning could not be achieved. Ultrasonic cleaning lowers the production cost of compact discs, an important factor to the future growth of the CD market. The heavy glass substrate, approximately a foot in diameter, receives an ultrathin layer of adhesive and a photoresist coating. It is then exposed...

...of. processing. being: Photoresist stencil on metal. • positive- or negative-working (Figure 4). Etching. • natural product- or synthetic polymer-based. • applied as a liquid (including electrophoretic. Etched metal. deposition) or dry film. • organic solvent- or aqueous-based formulations...

...tracks,. MEMS, ink jet print cartridges and various components in hard disk drives. The low surface. energy film repels liquids such as lubricating oils, silicones, and photoresist solutions used. in the manufacturing of semiconductors. Novec coating EGC-1700 will form a clear, nearly invisible, uniform...

- coating efficiency. The efficiency values cited here were derived from tests on 100-mm silicon wafers. The article estimates resist costs only. It does not consider equipment- and maintenance-related costs. Photoresist has two main components: solids and solvent (or aqueous solution, in the case...

...as volume, dispense time, and spin speeds as well as the solvent type and the vapor primer were examined and found to be significant. Implementation of the solvent prewet technique for reducing photoresist dispense volumes was accomplished at the AMD fab using existing facilities and equipment...

Joseph Zahka and Roger Blum, ash residue, and bulk photoresist are removed from wafer surfaces using various chemicals. While these chemicals are generally classed as mixtures of solvents, amines, corrosion inhibitors, and suspending agents, the specific formulations are often proprietary and can...

...they incorporate three-dimensional microstructures. While spin-coating technology is used to perform most photoresist deposition processes in the chipmaking area, it does not perform well on three-dimensional MEMS structures. The severe topography of MEMS devices, such as V-grooves, mesas, and etch cavities...

Wafer processing requires the use of proper amounts of chemicals during photoresist, etch, planarization, and cleaning steps. Manufacturing steps demand that appropriate combinations of chemicals, temperature, and time be repeated for every process cycle. Abnormal flow conditions can create process...

A bump fusion flux differs from a. photoresist material when spin-coating, even though they have. similar viscosities. For the bump fusion flux, lower rotational. times and speeds are needed to achieve a consistent coating,. due to the lower viscosity and solvent evaporation rate. Figure 8. Flux...

...by a one-photon process, the. excitation beam is usually greatly attenuated by linear. Two-photon polymerization principles. absorption before reaching the focal point. Consequently,. The excited state of a molecule can be reached by the. only the first layer of the photoresist (photosensitive. absorption...

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