Cleaning Agents and Surface Treatments - Dynaloy Dynasolve 711 Cleaner Blue 1 gal Pail -- DYNASOLVE 711 GALLONSupplier: Ellsworth Adhesives
Description: Used for dissolving cured urethanes, silicones, anhydride-cure epoxies, and photoresist films. Dynasolve 711 is the aluminum-safe version of Dynasolve 750. Dynasolve 750 & 711 are reactive solvents developed as companion products to the Uresolve series. However, Dynasolve 750 & 711 use glycol
- Type: Cleaner / Cleaning Agent
- Solvent / Solvent-based: Yes
Supplier: International Polymer Solutions Inc.
Description: Our IPS Suckback Valves are ideal for acid, solvent, photoresist solutions and other process dispensed chemistries. The IPS Suckback Valve will pull a vacuum and prevent excessive dripping from the dispensing nozzle. The IPS Suckback Valve is constructed of an“all wetted” PTFE media
- Valve Size: 0.1250 to 0.3750 inch
- Pressure Rating: 30 psi
- Media Temperature: 185 F
- Connection: Threaded, Tube Fitting
Supplier: Infinity Fluids Corp.
Description: Photoresist material Semiconductor processing equipment Supercritical fluid heating Solvent replacement Power generation systems Purification • Parts cleaning Biomass extraction Bio reclamation Safely heat Nitrogen systems Most economical and highest quality Measure process temperature
- Heater Type: Air Heater, Circulation Heater, Water Heater
- Applications: Drying, Gases / Vapors, Clean Water Heating, Process Waters, High Purity Waters
- Heating Capacity: 0.2500 to 10 kW
- Phase: Single Phase, Three Phase
Supplier: 3M Electronics Design & Manufacturing
Description: 3M™ Novec™ Electronic Coating EGC-1700 is a clear, low viscosity solution of a fluorochemical acrylate polymer coating carried in a hydrofluoroether solvent. The solvent is nonflammable, has low toxicity and provides acceptable environmental properties for today’s demanding
- Chemistry: Resin Base / Polymer Binder, Other
- Substrate / Surface: Aluminum, Ceramic / Porcelain, Glass, Steel, Other
- Technology: Film Drying / Air Setting
- Wet / Applied Thickness: 3.94E-5 inch
Supplier: JST Manufacturing, Inc.
Description: are then sprayed with a second solvent to make sure all metal stringers that bridge the edge of the photoresist profile to the device are removed. Once this cycle is complete, the wafers are thoroughly rinsed in a clean solvent (IPA or acetone) and then dried in JST's patented CLV Dryer, eliminating
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Compact Disk Cleaning: Cleaning Glass Master Disks - Aqueous Chemistry and Solvent Drying
cleaning could not be achieved. Ultrasonic cleaning lowers the production cost of compact discs, an important factor to the future growth of the CD market. The heavy glass substrate, approximately a foot in diameter, receives an ultrathin layer of adhesive and a photoresist coating. It is then exposed
MICRO: Special apps
- coating efficiency. The efficiency values cited here were derived from tests on 100-mm silicon wafers. The article estimates resist costs only. It does not consider equipment- and maintenance-related costs. Photoresist has two main components: solids and solvent (or aqueous solution, in the case
MICRO: Sutton (April 2001)
as volume, dispense time, and spin speeds as well as the solvent type and the vapor primer were examined and found to be significant. Implementation of the solvent prewet technique for reducing photoresist dispense volumes was accomplished at the AMD fab using existing facilities and equipment
MICRO:Surface Chemistries, by Joseph Zahka, p.85 (March '99)
Joseph Zahka and Roger Blum, ash residue, and bulk photoresist are removed from wafer surfaces using various chemicals. While these chemicals are generally classed as mixtures of solvents, amines, corrosion inhibitors, and suspending agents, the specific formulations are often proprietary and can
MICRO: Special Apps
, they incorporate three-dimensional microstructures. While spin-coating technology is used to perform most photoresist deposition processes in the chipmaking area, it does not perform well on three-dimensional MEMS structures. The severe topography of MEMS devices, such as V-grooves, mesas, and etch cavities
MICRO: Critical Materials?Chemicals
Wafer processing requires the use of proper amounts of chemicals during photoresist, etch, planarization, and cleaning steps. Manufacturing steps demand that appropriate combinations of chemicals, temperature, and time be repeated for every process cycle. Abnormal flow conditions can create process
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Entrenched Metal Liftoff Using A Novel Bilayer Process
The modified photoresist solutions are prepared by dissolving enough cyclic phosphonitrilic chloride trimer, PNCT, in commercially available photoresist solutions to achieve phosphorus concentrations of 10 to 12 weight percent in the resulting films.
MEMS Materials and Processes Handbook
In some cases, the photoresist can be more difficult to remove, such as after successive baking steps or etching steps, and for these cases the photoresist manufacturers provide specific photoresist solvents , usually called “strippers,�? or “resist removers.�? .
Novolak Based Thermally Resistant Positive Photoresist: Resin Design and Performance
Photoresist solutions were prepared either in Aspect Systems System 8 -SC solvent or in ethyl lactate, bp.
Chemical analysis of electron beam curing of positive photoresist
Initially the electron beam reaction with the photoactive compound, like the UV reaction, makes the photoresist soluble in developers.
Solvent development processing of chemically amplified resists: chemistry, physics, and polymer science considerations
As a developer it is very selective and generally needs fluorinated photoresists or the presence of silicone to render a photoresist soluble in scCO2.
Trace metal removal from microlithography process chemicals: Part I. photoresist solvents
Trace metal removal from microlithography process chemicals: Part I. photoresist solvents .
Mathematical modeling and experimental study on photoresist whirl-coating in
convex-surface laser lithography
A mathematical model of the photoresist thickness distribution on a convex-surface substrate with respect to various experimental parameters such as the type of photoresist, the viscosity of the photoresist solution , the rotation speed of the spinner, the geometrical dimension of the...
Spray coating of photoresist for pattern transfer on high topography surfaces
Among them, the most important parameters are (1) Photoresist solution composition, i.e. the solids content of the spray solution and the solvent.
Photoresist as a sacrificial layer by dissolution in acetone
For this reason it is unlikely that a liquid in which photoresist and photoresist solvents are insoluble would be able to displace the solvent by wetting.
"Dry" lithography using liquid and supercritical carbon dioxide based chemistries and processes
Photoresist solutions for spin casting were prepared by dissolving 20 wt% of PFOMA- -THPMA in liquid CO .