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Physical Vapor Deposition Coating Equipment
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Coating equipment is used to apply organic, inorganic or metal coatings onto part surfaces for industrial applications.
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Supplier: Tethis S.r.l.Description: The Pulsed Microplasma Cluster Source (PMCS) is a high-intensity nanoparticle source, for vacuum thin film deposition. Two vacuum chambers compose the deposition system: the expansion chamber for the supersonic beam generation and the deposition chamber for the collection of the nanoparticles over
- Coating Process: Physical Vapor Deposition (PVD)
- PVD Processes: Evaporation - Electron Beam
- Configuration: Outfit / Complete System
- Components / Features: Gas Control / Regulator, Integral Process Controller, Metrology / Film Monitor, Vacuum Pump
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Supplier: Impreglon, Inc.Description: Impreglon, Inc. specializes in PVD (Physical Vapor Deposition) coatings. Over the past decade these coatings have become standards in many industries. From extending the service life of tools, to eliminating tarnishing of brass marine fittings, to preventing scratches on bath hardware, PVD coatings
- Thin Film Processes: Physical Vapor Deposition (PVD), Plasma Etching / Cleaning, Titanium Nitride Coating
- Hard Coating / Treatment: Yes
- Material Selection / Design Assistance: Yes
- Research & Development: Yes
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Description: runs. In addition, our furnaces are used in the production of custom Chemical Vapor Infiltration (CVI) of pyrolytic carbon into carbon-carbon composites and special pyrolytic graphite coatings, Chemical Vapor Deposition (CVD), on graphite substrates. Our machine shop is fully equipped to finish every
- Coating Process: Abrasives / Superabrasives, Ceramic Coating, Chemical Finish / Conversion, Dry Lubricant Coating, Hardfacing, Painting, Thin Film Coating
- Functional / Performance: Conductive, Corrosion / Rust Preventive, Heat Resistant / High Temperature, Wear / Erosion Resistant
- Materials: Carbide, Ceramic, Composites
- Finishing / Surface Treatment: Mirror Finishing, Sanding / Grinding, Other
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Description: runs. In addition, our furnaces are used in the production of custom Chemical Vapor Infiltration (CVI) of pyrolytic carbon into carbon-carbon composites and special pyrolytic graphite coatings, Chemical Vapor Deposition (CVD), on graphite substrates. Our machine shop is fully equipped to finish every
- Thin Film Processes: Chemical Vapor Deposition (CVD), Other
- Hard Coating / Treatment: Yes
- Research & Development: Yes
- Material / Substrate Capabilities: Carbide, Ceramic, Composites
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Supplier: Oerlikon Leybold Vacuum USA Inc.Description: The UNIVEX multi-purpose experimentation systems were developed by LEYBOLD for applications in research and development, as well as for setting up pilot production systems. The range of applications for these systems covers primarily vacuum coating as well as experiments in vacuum process
- Coating Process: Physical Vapor Deposition (PVD), Specialty / Other
- PVD Processes: Evaporation - Electron Beam, Evaporation - Resistance, Sputtering - DC, Sputtering - RF
- Configuration: Outfit / Complete System
- Components / Features: Gas Control / Regulator, Integral Process Controller, Metrology / Film Monitor, Multiple Sources, Vacuum Pump
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Supplier: Sputtering Components, Inc.Description: E-cathode can be equipped with SC, MC, SM, or MM type cathode
- Coating Process: Physical Vapor Deposition (PVD)
- PVD Processes: Sputtering - DC Pulsed, Sputtering -Magnetron, Sputtering - RF, Other
- Configuration: Outfit / Complete System
- Components / Features: Integral Process Controller
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Supplier: Leica Microsystems, Inc.Description: The Leica EM MED020 is a precision high vacuum coating system for sputtering, carbon thread, carbon rod, top down and bottom up thermal resistance and dual electron beam evaporation. Available for all applications is a quartz crystal film thickness monitor which ensures highest reproducibility
- Coating System Type: Laboratory / Benchtop
- Technology / Process: Physical Vapor Deposition (PVD)
- PVD Processes: Evaporation - Electron Beam, Other
- Applications & Materials Processed: Semiconductor Manufacturing, Optical Coatings, Research / Surface Analysis
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Supplier: Oerlikon Leybold Vacuum USA Inc.Description: For special applications we can also supply cluster systems based on the UNIVEX concept. These clusters are equipped according to customers requirements and incorporate separate processing and load lock and transfer chambers.
- Coating Process: Physical Vapor Deposition (PVD), Specialty / Other
- PVD Processes: Evaporation - Electron Beam, Evaporation - Resistance, Sputtering - DC, Sputtering - RF
- Configuration: Outfit / Complete System
- Components / Features: Gas Control / Regulator, Integral Process Controller, Metrology / Film Monitor, Multiple Sources, Vacuum Pump
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Supplier: Edwards VacuumDescription: The BJD-2000 & FC-2000 are our latest PVD tools for small production or R&D. These flexible evaporation systems accept a multitude of accessories to meet almost any requirement. The BJD-2000 is identical to the FC-2000 but without the load lock feature. Engineered for efficient operation,
- Coating System Type: Batch System (Single Chamber / Multiple Wafers)
- Technology / Process: Physical Vapor Deposition (PVD)
- PVD Processes: Evaporation - Electron Beam
- Applications & Materials Processed: Research / Surface Analysis
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Supplier: Leica Microsystems, Inc.Description: The Leica EM CED030 is a compact bench-top single and multiple carbon thread evaporation device for producing conductive carbon films on specimens for X-ray microanalysis (EDX, WDX) and carbon reinforcement films on collodium or formvar coated specimen support grids for TEM.
- Coating System Type: Laboratory / Benchtop
- Technology / Process: Physical Vapor Deposition (PVD)
- PVD Processes: Other
- Applications & Materials Processed: Semiconductor Manufacturing, Research / Surface Analysis
Featured Products for Physical Vapor Deposition Coating Equipment Top
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Export, PA, Spring 2012 - Oerlikon Leybold Vacuum USA manufacturers the UNIVEX line of universal experimentation PVD vacuum coating systems for use in research & development and pilot production applications. A highly successful and well known PVD deposition system marketed and installed throughout Europe for many years and more recently in the USA. Available in configurations of varying chamber capacities utilizing bell jars, stainless steel box chambers and cluster tool configurations... (read more)Browse Coating Equipment Datasheets for Oerlikon Leybold Vacuum USA Inc. -
Evaporated Metals: Gold (Au), Silver (Ag), Platinum (Pt), Chrome (Cr), Titanium (Ti), Nickel (Ni), Copper (Cu), Aluminum (Al), Tin (Sn). Rogue Valley Microdevices also has the following metal and dielectric/semiconductor films available in Physical Vapor Deposition (PVD): PVD Metals: Tantalum (Ta), Titanium (Ti), Aluminum (Al), Aluminum/Copper0.5% (AlCu0.5%), Nickel (Ni), Tungsten (W), Chrome (Cr), Copper (Cu). PVD Dielectrics/Semiconductors: Silicon Nitride (SiN), Silicon (Si). If you do... (read more)Browse Thin Film Coating Services Datasheets for Rogue Valley Microdevices, Inc.
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Export, PA, Spring 2012 - Oerlikon Leybold Vacuum USA manufacturers the UNIVEX line of universal experimentation PVD vacuum coating systems for use in research & development and pilot production applications. A highly successful and well known PVD deposition system marketed and installed throughout Europe for many years and more recently in the USA. Available in configurations of varying chamber capacities utilizing bell jars, stainless steel box chambers and cluster tool configurations... (read more)Browse Coating Equipment Datasheets for Oerlikon Leybold Vacuum USA Inc.
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Evaporated Metals: Gold (Au), Silver (Ag), Platinum (Pt), Chrome (Cr), Titanium (Ti), Nickel (Ni), Copper (Cu), Aluminum (Al), Tin (Sn). Rogue Valley Microdevices also has the following metal and dielectric/semiconductor films available in Physical Vapor Deposition (PVD): PVD Metals: Tantalum (Ta), Titanium (Ti), Aluminum (Al), Aluminum/Copper0.5% (AlCu0.5%), Nickel (Ni), Tungsten (W), Chrome (Cr), Copper (Cu). PVD Dielectrics/Semiconductors: Silicon Nitride (SiN), Silicon (Si). If you do... (read more)Browse Thin Film Coating Services Datasheets for Rogue Valley Microdevices, Inc.
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100HE ™ Plasma Spray System. The 100HE ™ is a major improvement in plasma torch design. Our patented arc root stabilization technology and efficient use of ternary gas mixtures (Ar, N² & H² or He) produce a high performance plasma coating process with remarkable capabilities. Able to apply plasma spray powders in either axial, radial, or external injection modes, the 100HE ™ produces superior plasma coatings applied at higher spray rates and significantly higher deposition... (read more)Browse Thermal Spray Equipment Datasheets for Progressive Surface
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January 2012 - The UNIVEX 350 high vacuum deposition system is the ideal tool for R &D or small scale production. Its modular and flexible design allows it to be easily upgraded as needs or technology requirements change. The UNIVEX is ideally suited for research in: Materials Science. Semiconductors. Nanotechnology. Superconductors. Sensor Technology. Opto-Electronics. Solar Cells. The UNIVEX 350 configured for thermal resistance evaporation starts at $74,995 and includes: Oerlikon Leybold... (read more)Browse Thin Film Equipment Datasheets for Oerlikon Leybold Vacuum USA Inc.
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qualified to verify materials against requirements and issue a certified test report. We offer a broad range of physical property and flammability testing services in our onsite testing laboratories, which include an FAA-approved burn-test facility. In addition, all equipment is calibrated and traceable to NIST standards. (read more)Browse Flammability and Fire Testing Services Datasheets for General Plastics Manufacturing Co.
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Inductotherm brings the world's most advanced induction technology to the coating line. It supplies the steel industry with inductively heated coreless, channel and premelt pots for galvanizing, galvannealing, Galfan® and Galvalume® product lines. It also manufactures strip heaters, boost heaters and tin reflow, as well as systems for paint drying and polymerization of coatings. (read more)Browse Coating Equipment Datasheets for Inductotherm Group
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and increases through-put. Dip coating eliminates the need for complicated material handling systems, multiple operators, and avoids the high maintenance of spray coating equipment. End users are attracted to the idea of dip coating their boards, as compared to spray coating because dip coating reduces the overall cost of manufacturing. Very little coating is wasted and specified coating thicknesses required to protect the boards against the end-use environment in which they are designed to operate can... (read more)Browse Process Dryers Datasheets for Glenro Inc.
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under various conditions including uniform heat under vacuum for PECVD and other deposition and subsequent lamination equipment. (read more)Browse Radiant Flat Panel Heaters Datasheets for Tyco Thermal Controls
Conduct Research Top
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HumiSeal(R) 1B31S (.pdf)
1B31S with HumiSeal Thinner 503 in order to obtain a uniform film. Once optimum. viscosity is determined, a controlled rate of immersion and withdrawal (2 to 6" per minute) will further insure even. deposition of the coating and ultimately a uniform film. During the application, evaporation of solvent
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HumiSeal(R) 1B31 (.pdf)
) will further insure. even deposition of the coating and ultimately a uniform film. During the application, evaporation of solvent causes. an increase in viscosity that should be adjusted by adding small amounts of Thinner 503. Viscosity in the dip tank. should be regularly checked by the use
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Chipmakers move to Second-Generation Copper
patterned and etched for interconnections. The interconnection etch stops at the second SiNx layer. Once holes for vias and trenches for connections have been etched, the process next deposits a thin film of tantalum nitride through physical vapor deposition (PVD), or sputtering. This acts
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HumiSeal(R) 1B73 (.pdf)
and withdrawal (2 to 6" per minute) will further insure even. deposition of the coating and ultimately a uniform film. During the application, evaporation of solvent causes an. increase in viscosity that should be adjusted by adding small amounts of Thinner 73. Viscosity in the dip tank should
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HumiSeal(R) 1B66 (.pdf)
rate of immersion and withdrawal (2 to 6" per minute) will further insure even. deposition of the coating and ultimately a uniform film. During the application, evaporation of solvent causes an. increase in viscosity that should be adjusted by adding small amounts of Thinner 503. Viscosity in the dip
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Examining scale-up and computer simulation in tool design for 300-mm wafer processing
flows are encountered in LPCVD, high-plasma-density/low-gas-pressure reactors, physical vapor deposition (PVD), molecular beam epitaxy (MBE), and high-vacuum processes. For such high numbers, direct simulation Monte Carlo (DSMC) and other kinetic simulations become necessary.2 The actual flow field
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MICRO: Archive: 2002 Back Issues
e-manufacturing in the semiconductor industry. TECHNICAL ARTICLES. Taking Control: Improving equipment productivity through on-product etch-process monitoring. Facilities Technology: Reducing water consumption in semiconductor fabs. BEOL Equipment: Using atomic layer deposition to. prepare future-generation
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MICRO:Archives of 1997 Back Issues
enters Millennium; Vitesse promotes Mikkelson; Duffin takes ESH slot at Sematech Foreign chip industries apply themselves to eclipsing U.S. Deposition breakthrough brings consortium to dawn of the Copper Age Flanders flips for chips; Triant inks software pact; Air Liquide signs contract with AMD; ASM
Engineering Web Search: Physical Vapor Deposition Coating Equipment Top
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Physical vapor deposition - Wikipedia, the free encyclopedia
Physical vapor deposition (PVD) is a variety of vacuum deposition and is a general term used to describe any of a variety of methods to deposit thin
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Optical fiber - Wikipedia, the free encyclopedia
caused by impurities that could be removed, rather than by fundamental physical effects such as scattering.
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PVD Coating Thin Film Deposition Magnetron Sputtering Systems,...
Magnetron Sputtering PVD Coating Systems Thin Film Deposition Thermal Evaporation Sputtering Equipment Vacuum Engineering
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Tanury Industries electroplating gold jewelry plating pvd...
jewelry plating electroplating gold plating pvd physical vapor deposition Electroplating Coating Physical Vapor Deposition (PVD)
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Deposition Equipment: Used, Surplus, Refurbished...
Physical Vapor Deposition Equipment - Other in Physical Vapor Deposition Equipment 1
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Used Semiconductor and Scientific Equipment for Science and...
Chemical Vapor Deposition Clean Room Equipment Evaporators-Electron Beam Evaporators-Resistance Diffusion Furnaces LPCVD Furnaces PECVD Furnaces
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PVD Sputtering Equipment with AJA International, Inc.
Inc. has continued to develop many highly successful physical vapor deposition (PVD) tools including the compact ATC ORION Series Sputtering Systems,
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Medical Device Link . On GlobalSpec
processes such chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, electrochemical deposition (ECD), plasma etching,
