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  • Facing the challenges of reducing PFC emissions in plasma chamber cleans
    Josep Arn o and Joseph D. Sweeney, used in the semiconductor industry for plasma etching and chemical vapor deposition (CVD) chamber clean applications. The global warming potential of these gases has triggered a significant effort to minimize their release into the atmosphere. In December 1997
  • Plastics for plasma etching
    It's a mistake to assume wafer clamp rings have to polyimide. Several other work about as well. Some surprising conclusions came out of clamp-ring material tests, which took place in a plasma-etch equipment from Tek-Vac Industries Inc. Each process chamber (square boxes, left and right) handles
  • Riding mag-beams to Mars
    A new propulsion technology for space vehicles, magnetic plasma beams, is being investigated by Robert Winglee at the University of Washington. Ian Smith works on a plasma chamber which simulates spacelike conditions for testing mag-beam prototypes. A high-power helicon, an electrodeless plasma
  • MICRO: Surface Conditioning/Chemistries - Song (January 2001)
    with a gate oxide of <40 A. In addition, the oxidation reaction that occurs between the etch residue and the oxidizer gas in the plasma chamber during dry ashing creates residue that is difficult to remove in subsequent wet cleans. Traditional wet cleaning processes rely on a mixture of sulfuric
  • MICRO: Guerra (April 2001)
    Inductively coupled plasma ashing experiments demonstrate that lowering the pressure and temperature of the plasma chamber reduces the diffusion of oxygen into the low-k dielectric layer. To fully take advantage of copper interconnects in semiconductor devices, low-k dielectric materials must
  • Medical Device Link .
    Cold gas plasma surface treatment, which is conducted in a vacuum, allows designers to chemically change the surface of a plastic to suit a particular need. Applications include surface cleaning or promoting adhesion. The 600-series plasma system features an ultraclean quartz chamber with no metal
    Applied Materials has added an innovation to its dielectric CVD tools that "virtually eliminates " PFC emissions to the atmosphere, the fab equipment giant announced. The new remote plasma clean process converts source gases to active atoms in a plasma located upstream of the process chamber
  • MICRO: Process Equipment Control - Richardson (April 2000)
    , causing device failures that decrease yields. Contamination can be introduced into an etch chamber during both the plasma process cycle and chamber cleans. Therefore, in its research into ways to minimize contaminants in silicon etch systems, Lam Research (Fremont, CA) has taken a total systems

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