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  • Facing the challenges of reducing PFC emissions in plasma chamber cleans
    Josep Arn o and Joseph D. Sweeney, used in the semiconductor industry for plasma etching and chemical vapor deposition (CVD) chamber clean applications. The global warming potential of these gases has triggered a significant effort to minimize their release into the atmosphere. In December 1997
  • Plastics for plasma etching
    It's a mistake to assume wafer clamp rings have to polyimide. Several other work about as well. Some surprising conclusions came out of clamp-ring material tests, which took place in a plasma-etch equipment from Tek-Vac Industries Inc. Each process chamber (square boxes, left and right) handles
  • Riding mag-beams to Mars
    A new propulsion technology for space vehicles, magnetic plasma beams, is being investigated by Robert Winglee at the University of Washington. Ian Smith works on a plasma chamber which simulates spacelike conditions for testing mag-beam prototypes. A high-power helicon, an electrodeless plasma
  • MICRO: Surface Conditioning/Chemistries - Song (January 2001)
    with a gate oxide of <40 A. In addition, the oxidation reaction that occurs between the etch residue and the oxidizer gas in the plasma chamber during dry ashing creates residue that is difficult to remove in subsequent wet cleans. Traditional wet cleaning processes rely on a mixture of sulfuric
  • MICRO: Guerra (April 2001)
    Inductively coupled plasma ashing experiments demonstrate that lowering the pressure and temperature of the plasma chamber reduces the diffusion of oxygen into the low-k dielectric layer. To fully take advantage of copper interconnects in semiconductor devices, low-k dielectric materials must
  • INDUSTRY NEWS
    Applied Materials has added an innovation to its dielectric CVD tools that "virtually eliminates " PFC emissions to the atmosphere, the fab equipment giant announced. The new remote plasma clean process converts source gases to active atoms in a plasma located upstream of the process chamber
  • Wired 9.01: Zip Drive
    A red light on the engine chamber's nose starts to blink, signaling that the experiment is under way. Suddenly a white cloud of water vapor materializes above the chamber, condensation caused by liquid nitrogen pipes that run across the ceiling and down into the machine to keep the engine's innards
  • MICRO: BEOL Equipment
    Michael Bonner, formerly of Advanced Energy Industries; and Don Nowakowski, IBM Microelectronics igh-density plasma chemical vapor deposition (HDPCVD) process tools are used to deposit intermetal and postmetal dielectric film layers on IC wafers. HDPCVD tools consist of a single wafer chamber

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