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Plasma Evaporation
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Coating equipment is used to apply organic, inorganic or metal coatings onto part surfaces for industrial applications.
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Supplier: Oerlikon Leybold Vacuum USA Inc.Description: The UNIVEX multi-purpose experimentation systems were developed by LEYBOLD for applications in research and development, as well as for setting up pilot production systems. The range of applications for these systems covers primarily vacuum coating as well as experiments in vacuum process
- Coating Process: Physical Vapor Deposition (PVD), Specialty / Other
- PVD Processes: Evaporation - Electron Beam, Evaporation - Resistance, Sputtering - DC, Sputtering - RF
- Configuration: Outfit / Complete System
- Components / Features: Gas Control / Regulator, Integral Process Controller, Metrology / Film Monitor, Multiple Sources, Vacuum Pump
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Supplier: ULVAC Technologies, Inc.Description: VEP Series models are systems for deposition of various organic and inorganic materials by methods including evaporation, sputtering, plasma metallization and evaporation metallization. Process chambers can be freely selected to match the application.
- Coating Process: Physical Vapor Deposition (PVD)
- PVD Processes: Other
- Configuration: Outfit / Complete System
- Components / Features: Multiple Sources, Vacuum Pump
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Supplier: Zak, Inc.Description: Water cooled copper contains reactive molten metals without contamination
- Crucible Products: Crucible - Conical / Tapered, Crucible - Cylindrical (Straight wall), Crucible - Skull Melting / Water Cooled, Crucible Liner, Evaporation Crucible
- Bottom Type / Pour Method: Flat Bottom, Round Bottom, Pouring / Metering Hole, Pouring Spout
- Material Types: Copper (Water Cooled)
- Application / Industry: Nickel Base / Superalloys, Precious / Red Metals, Titanium / Reactive Metals
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Supplier: Oerlikon Leybold Vacuum USA Inc.Description: The UNIVEX multi-purpose experimentation systems were developed by LEYBOLD for applications in research and development, as well as for setting up pilot production systems. The range of applications for these systems covers primarily vacuum coating as well as experiments in vacuum process
- Coating Process: Physical Vapor Deposition (PVD), Specialty / Other
- PVD Processes: Evaporation - Electron Beam, Evaporation - Resistance, Sputtering - DC, Sputtering - RF
- Configuration: Outfit / Complete System
- Components / Features: Gas Control / Regulator, Integral Process Controller, Metrology / Film Monitor, Multiple Sources, Vacuum Pump
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Supplier: Oerlikon Leybold Vacuum USA Inc.Description: The UNIVEX multi-purpose experimentation systems were developed by LEYBOLD for applications in research and development, as well as for setting up pilot production systems. The range of applications for these systems covers primarily vacuum coating as well as experiments in vacuum process
- Coating Process: Physical Vapor Deposition (PVD), Specialty / Other
- PVD Processes: Evaporation - Electron Beam, Evaporation - Resistance, Sputtering - DC, Sputtering - RF
- Configuration: Outfit / Complete System
- Components / Features: Gas Control / Regulator, Integral Process Controller, Metrology / Film Monitor, Multiple Sources, Vacuum Pump
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Supplier: Oerlikon Leybold Vacuum USA Inc.Description: For special applications we can also supply cluster systems based on the UNIVEX concept. These clusters are equipped according to customers requirements and incorporate separate processing and load lock and transfer chambers.
- Technology / Process: Physical Vapor Deposition (PVD), Plasma Etching / Cleaning, Rapid Thermal Processing (RTP), Vacuum Annealing, Combined / Multiple Processes, Other
- PVD Processes: Evaporation - Electron Beam, Evaporation - Resistance, Sputtering - DC, Sputtering - RF
- Materials Processed (Deposit or Substrate): Metal, Dielectric / Ceramic, Aluminum, Silicon, Polymer / Organic
- Vacuum / Pressure Range: High Vacuum (< 10-3, >10-8 torr), Ultra-high Vacuum (< 10-8 torr)
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Supplier: ULVAC Technologies, Inc.Description: VEP Series models are systems for deposition of various organic and inorganic materials by methods including evaporation, sputtering, plasma metallization and evaporation metallization. Process chambers can be freely selected to match the application.
- Coating Process: Physical Vapor Deposition (PVD)
- PVD Processes: Other
- Configuration: Outfit / Complete System
- Components / Features: Multiple Sources, Vacuum Pump
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Supplier: ULVAC Technologies, Inc.Description: Evaporation sensor
- Form Factor: Sensor / Sensing Element
- Mounting / Loading: In-situ / System Mounted
- Applications: Semiconductor Wafers, CVD / PVD Films, Flat Panel Displays, Optical Components
- Measurement Capability: Deposition Rate, Endpoint Detection / Plasma Diagnostics, Thickness - Film / Layer
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Supplier: ULVAC Technologies, Inc.Description: Evaporation sensor
- Form Factor: Sensor / Sensing Element
- Mounting / Loading: In-situ / System Mounted
- Applications: Semiconductor Wafers, CVD / PVD Films, Flat Panel Displays, Optical Components
- Measurement Capability: Deposition Rate, Endpoint Detection / Plasma Diagnostics, Thickness - Film / Layer
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Supplier: Zak, Inc.Description: Water cooled copper contains reactive molten metals without contamination
- Crucible Products: Crucible - Conical / Tapered, Crucible - Cylindrical (Straight wall), Crucible - Skull Melting / Water Cooled, Crucible Liner, Evaporation Crucible
- Bottom Type / Pour Method: Flat Bottom, Round Bottom, Pouring / Metering Hole, Pouring Spout
- Material Types: Copper (Water Cooled)
- Application / Industry: Nickel Base / Superalloys, Precious / Red Metals, Titanium / Reactive Metals
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Featured Products for Plasma Evaporation Top
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ourselves as one of the premier Thin Films Foundries in the United States by providing our customers with great quality, customer service, and engineering support. Our manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 300mm. We offer a variety of processes including Photolithography, Resist Coat, Metal Lift-Off, Plasma Etch, Wet Etch, Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon... (read more) -
processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 300mm. We offer a variety of processes, including Photolithography, Resist Coat, Metal Lift-Off, Plasma and Wet Etch, Low Stress LPCVD Nitride, PECVD Oxide, PECVD Nitride, PECVD Silicon Carbide, Thermal Oxidation, Chlorinated Oxidation, N2/H2 Annealing, and a variety of Metal films to satisfy our customers' needs. Foundry Services... (read more)
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HyPerformance Plasma delivers HyDefinition® cut quality with greater consistency, faster cut speeds, longer consumable life and half the operating cost of competing technologies. With over ten thousand systems in use worldwide, it is clear that HyPerformance Plasma is the system of choice for customers that demand performance they can count on. HyPerformance HPR400XD. The HPR400XD is the fastest, thickest and most versatile HyPerformance Plasma system available on the market. More... (read more)
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A Powermax plasma system is a versatile tool. Whether in a shop, factory, at home, or in the field, Powermax systems cut and gouge a wide variety of metal types, thicknesses and forms. Hypertherm's Powermax line of products consists of six systems that will help you get your cutting and gouging jobs done faster, easier, more reliably and at lower cost. To read more about the Powermax Advantages and the benefits of investing in plasma, click here. Powermax30. Handheld cut capacity. Recommended... (read more)
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IONIT® is a plasma nitriding and plasma nitrocarburising techno- logy for alloyed steel, cast, sinter, and special materials. The IONIT OX® technology combines conventional technologies such as gas nitriding/gas nitro- carburising with plasma nitriding and oxidation. A particular feature of the treated surfaces is their excellent corrosion and wear protection. Properties and advantages. Plasma heat treatment. High surface hardness. Improved resistance against wear, corrosion, and fatigue... (read more)
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Plasma arc cutting is the most cost effective method of cutting metal sheet stock into two dimensional shapes. Plasma cutting is the process of cutting conductive metals using electrically conductive gas to transfer energy from an electrical power source through a plasma cutting torch to the material being cut. Typical uses of the AXYZ Plasma system are in cutting of steel or stainless steel letters for signs, architectural components from steel, aluminum or stainless steel, and other metal... (read more)
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Custom and Stock shipping cases for Plasma & LCD displays. Our shipping cases are engineered to protect displays and sensitive equipment during transit or storage. Wilson Case's stock plasma shipping cases are designed for the screen to sit upright in the case, cushioned with a specific amount of foam in the right places for ultimate protection. Their middle split lid allows for easy access and removal of the display. The extended casterboard balances height and weight — keeping... (read more)
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and plastics "ultra" clean. Our vacuum plasma processes remove all residual organic contaminants, which leads to a superior bond strength - and we do it all from our in-house lab under the most-stringent processing controls. Plasma can benefit all industries …. Our clients, leaders in the medical, aerospace, and mining industries, have embraced the plasma process after realizing the many manufacturing benefits of bonding dissimilar materials. With plasma, their metal devices undergo a uniform... (read more)
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The simplicity of using the Multiplaz 3500 lets beginners master the skill of plasma welding, cutting and soldering quickly and easily. After just a few minutes of working with Multiplaz, experts realize the value and uniqueness of this tool. The Multiplaz 3500 opperates without a bulky compressor. It is easily transported to do precision work in any location. See Cost Effective. When you use Multiplaz 3500, welding and cutting does not require a dangerous gas bottles, special welding station... (read more)
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effect created in the VacuTEC. The Equipment: Self-contained machine frame for attachment of all listed components. Vacuum chamber - size determined by size of parts and capacity. Chamber equipped with min. two arrays of highly durable ceramic electrodes. Vacuum pump - 3.5ft3 or 10.5ft3/h. Vacuum controls, vacuum meter, valves, etc. Power generator, HV 2010 or HV 2020 (1 or 2 kW). HT-Transformer, HT 10-02SP (2kV-split). Allen-Bradley PLC-unit with Touch Screen Operator Panel. The Plasma treatment... (read more)
Conduct Research Top
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Compatibility of Medical Devices and Materials with low-Temperature Hydrogen Peroxide Gas Plasma (.pdf)
, managed-care hospital and clinical environments, which are forgoing the use of single-use, disposable devices in favor of devices that can be used more than once. Compatibility of Medical Devices and Materials with Low-Temperature Hydrogen Peroxide Gas Plasma Compatibility of Medical. Devices...
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MICRO:
wafer-transport system, plasma impedance monitor, evaporation system, mass-flow controller, film metrology software, wafer treatment systems, heat exchangers, and more Supplier offers advanced CMP slurry characterization; vendor's filter capsule expedites changeouts in photoresist applications; manufacturer...
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MICRO:Product Technology News (March 2001)
heated lines to the scrubber, lowering the cost of ownership. A deep-UV laser ablation system improves the ablation of all inductively coupled plasma optical emission spectroscopy (ICP-OES) and inductively coupled plasma mass spectroscopy (ICP-MS) materials. The UP-213 produces a fine-particle...
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Measuring and removing dissolved and colloidal silica in ultrapure water
gravimetry, colorimetry, graphite furnace atomic absorption spectroscopy (GFAAS), scanning electron microscopy (SEM), ion chromatography (IC), inductively coupled plasma mass spectroscopy (ICP-MS), and inductively coupled plasma atomic emission spectroscopy (ICP-AES). MICRO:May 97:Ultrapure Fluids...
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MICRO: Critical Materials Delivery
with a closed, double-walled chemical-delivery system that does not provide access ports for taking chemical samples. For quality assurance purposes, a compromise protocol has been established in which inductively coupled plasma�Vmass spectrometry (ICP-MS) is used to analyze as-received...
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MICRO: Product Technology News (October 2000)
capabilities. Plasma Doping System. Varian Semiconductor Equipment. Gloucester, MA. The single-wafer VIISta 10 P2LAD ultra-low-energy pulsed-plasma doping system delivers as-implanted profiles shallower than are possible with conventional beam-line architectures, at throughputs limited only by gas flow...
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NASA's Hubble Space Telescope Explores the Volcanic Moon Io
, evaporation of surface frost in sunlit areas, or material knocked out of the surface ("sputtered") into the atmosphere. Sulfur from the volcanic plumes cannot escape directly into space to fuel the plasma torus. Instead, sulfur and oxygen might be stripped from Ios atmosphere in a complicated interaction...
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Surfaces That Make a Difference (.pdf)
to the design of ef-. has developed a dedicated plasma. ficient, advanced gas turbines that. gun, the iProTM-90 (Fig. 2). The advanced design of this plas-. Fuel Cell Components. ma spray gun sets new standards. Due to its expertise in thermal-. 2 The iProTM-90 advanced internal plasma-spray gun is very. It can...
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History of Carbon Nanotubes -CNTs
other types of tubes. The first method for producing Carbon Nanotubes (CNTs) and C60 Fullerenes in reasonable quantities – was by applying an electric current across two carbonaceous electrodes in an inert gas atmosphere. This method is called plasma arcing. It involves the evaporation of one electrode...
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Soluble Narrow Band Gap and Blue Propylenedioxythiophene-Cyanovinylene Polymers
in an ultrasonic bath for 15 min with. aqueous sodium dodecyl sulfate (SDS, Fisher scientific), deionized water (Milli-Q),. acetone, and isopropanol. The substrates were then treated with oxygen plasma for 15. minutes in a Plasma Cleaner (HARRICK PDC-32G). Aqueous PEDOT-PSS (Bayer. Baytron P VP Al 4083...
Engineering Web Search: Plasma Evaporation Top
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Plasma (physics) - Wikipedia, the free encyclopedia For other uses, see Plasma. Plasma lamp, illustrating some of the more complex phenomena of a plasma, including filamentation. |
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Quark?gluon plasma - Wikipedia, the free encyclopedia Quark?gluon plasma From Wikipedia, the free encyclopedia |
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NanoStructures Laboratory x-ray), etching (chemical, plasma and reactive-ion), liftoff, electroplating, sputter deposition, and e-beam evaporation. |
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Max-Planck-Institut für Physik komplexer Systeme Electron evaporation from an ultracold plasma in a uniform electric field |
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Energy Deposition The energy lost by the injected electrons goes into heating the thermal plasma in the loop. |
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Characteristics of multi GUN MgO physical vapor deposition... Pub Acronym: PLASMA Pub Year: 2006 Pub Date: 2006 Meeting Dates: 2006 Journal Title: The 33rd IEEE International Conference on Plasma Science, 2006. |
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Fabrication of Fe-N Thin Films by the Plasma Evaporation... Fabrication of Fe-N Thin Films by the Plasma Evaporation Method and Analysis of N 2 Plasma |
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The Society of Vacuum Coaters They can be used for all kinds of industrial coatings from the plasma processed layers ... source Google | Published on February 29, 2012 See Society of Vacuum Coaters Information |
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Plasma Reactions | Society of Plastics Engineers Poly(ethylene oxide)-like Plasma Polymers Produced by Plasma-Assisted Vacuum Evaporation (pages 445?458)Plasma Processes and Polymers 7 #6 (2010) See Society of Plastics Engineers Information |
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Thèse EPFL 3564 (2006) Jong-Won Shin of process parameters on powder evaporation and nanoparticle formation shows the usefulness of the in-situ plasma process monitoring, and the large |
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