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EETimes.com | Electronics Industry News for EEs & Engineering Managers
NAND flash wafer fab. MEMS transistor integrated on CMOS. Product. Intel, Micron offer 128-Gbit NAND flash memory. Qualcomm announces powerline chip. Headlines for Monday, December 5, 2011. Technology. AMD Fusion APUs: Another accelerator for supercomputing?. Do machines dream of IoT?. Heliatek...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
efficient than x86. IEDM: UCB reports printed MEMS switches. EE Times' 20 hot technologies for 2012. Samsung plans China NAND flash wafer fab. MEMS transistor integrated on CMOS. Product. Intel, Micron offer 128-Gbit NAND flash memory. Qualcomm announces powerline chip. Headlines for Monday, December...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
research out of Yamagata University, two groups in Japan are developing plastic substrates that could be used as the basis of flexible organic light emitting displays (OLEDs). Fixed wireless ready for wide rollout Bolstered by hints that the Federal Communications Commission is unlikely to take away...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
will pony up $25 million, including $7.5 million to acquire a 2.5 percent equity stake in iFire, which claims the only flat-panel display technology that can provide CRT-like performance in large sizes. Suppliers respond to rising demand for plastic LCDs The expanding portable phone market, with its...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. Taiwanese lab applies new plastic as substrate A Taiwanese chemical lab is in the early stages of commercializing a new class of plastic material aimed at making high-quality, yet lower-cost substrates for next generation high-density DVDs. Protocol pair strives for smarter networks A recently...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Inc. plans to cut more costs. Plastic memory close to commercialization Printing memory onto flexible plastic substrates has been demonstrated by partners Thin Film Electronics and InkTec Co. Ltd. Europe slumps in February global chip sales The three-month moving average of sales of semiconductors...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
: UCB reports printed MEMS switches. EE Times' 20 hot technologies for 2012. Samsung plans China NAND flash wafer fab. MEMS transistor integrated on CMOS. Product. Intel, Micron offer 128-Gbit NAND flash memory. Qualcomm announces powerline chip. Headlines for Monday, December 5, 2011. Technology. AMD...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
industry. Plastic, not glass, to spawn new breed of thin, flexible displays There is a Jetsons-like world coming, not too far in the future, where digital displays line clothing, deliver robust content in mobile devices and even offer video cooking tips on the sides of soup cans. The enabler? Many...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
technologies for 2012. Samsung plans China NAND flash wafer fab. MEMS transistor integrated on CMOS. Product. Intel, Micron offer 128-Gbit NAND flash memory. Qualcomm announces powerline chip. Headlines for Monday, December 5, 2011. Technology. AMD Fusion APUs: Another accelerator for supercomputing...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Plastic field emitter could simplify display development Electronic devices made from polymers could be used as broad-area emitters for a field-emission display and as an active matrix for driving it, said Liverpool University researchers. Their work is based on a polymer class called...