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Plastic Semiconductor Package

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Polymers and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials. They typically consist of thermoplastic or thermosetting resins in the form of pellets, powders or liquid resins. These materials can then be molded into a variety of shapes for a wide range of uses.
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  • Description: A single component, optically opaque, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, circuit assembly, medical, and scientific/OEM industries. It is a high viscosity epoxy ideal for blocking out light
    • Compound Type: Optical Grade / Material
    • Material Form: Casting Resin
    • Electrical / Electronics Applications: Optoelectronics / Photonics, Semiconductors / IC Packaging
    • Polymer / Chemical Type: Epoxy (EP)
  • Description:
    • Capabilities: Component / Product Testing, Component / Product Comparisons, Test Development, Test Fixtures / Equipment
    • Forms Tested: Components / Parts, Samples / Materials
    • Test Services Offered: Humidity, UV Exposure (Weathering / Solar Radiation)
    • Accelerated (HALT / HASS): Yes
  • Description: Compact opto-semiconductor with excellent photon counting capacity, 100 um pixel pitch, plastic package
    • PN, PIN, or Avalanche: PN Photodiode
    • Photodiode Material: Silicon
  • Description: Furniture Testing Hail Impact Testing HALT/HASS Testing Hose Testing Hydraulics/Pneumatics Package Testing Scaffolding Testing Seismic Testing Space Simulation Surface Treatment Telecommunications Toy Testing Window/Door Testing Whether you build planes, trains, or tricycles
    • Capabilities: Certification / Qualification, Commissioning, Comparisons, Engineering Verification Testing, Evaluation and Analysis, Failure Analysis / Troubleshooting, First Article / Contract QA, In-Process In-Line Testing, Reliability / Robustness, Research and Development, Testing, Test Fixtures / Equipment, Test Panel / Sample Prep
    • Forms Tested: Components / Parts, Samples / Materials, Products (Machines / Devices), Capital Equipment
    • Services Offered: Abrasion / Wear Testing, Acoustic / PIND Testing, Aging / Life Testing, Chemical Compatibility Testing, Condition Monitoring, Color / Appearance, Dimensional Gaging, Electrical Characteristics Testing, Fire Characteristics / Flammability, Flow / Pressure Testing, Leak / Seal Testing, Mechanical / Structural (Static Load / Stress), NDT / Inspection, Oil Analysis / Fluids Testing, Performance Testing, Physical Properties Testing, Product Safety / Liability Testing, Stress Screening / HASS, UV Exposure (Weathering / Solar Radiation), Specialty / Other
    • Combined Environments / Conditions: Yes
  • Description: Features SPDT Switch for mobile communications Insertion Loss: 0.4 dB @ 2.0 GHz Isolation: 20 dB @ 2.0 GHz VSWR: 1.3:1 P0.1dB: +26 dBm RF-frequency range DC – 2.5 GHz No supply voltage Positive control voltage Small SC-70 plastic package RoHS compliant (2002/95/EC
    • Impedance: 50 ohms
    • Actuator Type: SPDT
    • Package Type: Surface Mount, Other
    • Connector: Other
  • Supplier: ANALYZE Inc.
    Description: to entrepreneurs, quality control, research and industrial scientists and engineers in the following industries: Aerospace Electronics Graphic Arts Medical Devices Personal Care Plastics Semiconductors Transportation
    • Capabilities: Certification / Qualification, Comparisons, Consulting / Training, Evaluation and Analysis, Failure Analysis / Troubleshooting, First Article / Contract QA, Research and Development, Testing, Validation, Specialty / Other
    • Forms Tested: Components / Parts, Samples / Materials, Products (Machines / Devices)
    • Services Offered: Chemical Compatibility Testing, Color / Appearance, NDT / Inspection, Oil Analysis / Fluids Testing, Performance Testing, Physical Properties Testing, Specialty / Other
    • Test / Certify To: ASTM, ISO, OEM Specific
  • Description: The Leader in Mechanical, Corrosion, Environmental, Pressure and Electrical Product Testing Services - From Design to Construction. Quality. Service. Satisfaction. Global Testing Services, Inc. provides a complete testing solution to manufacturers in the automotive, medical, aerospace,
    • Capabilities: Component / Product Testing, Component / Product Comparisons, Certification / Qualification, Consulting / Training, Engineering Verification Testing, Evaluation and Analysis, In-Process In-Line Testing, Performance Testing, Reliability / Robustness, Test Development, Test Fixtures / Equipment, Test Panel / Sample Prep, Specialty / Other
    • Forms Tested: Components / Parts, Products (Equipment / Devices), Samples / Materials
    • Test Services Offered: Erosion (Blowing Sand), Corrosion Testing / Chemical Exposure, Flow / Pressure Testing, Humidity, Thermal Cycling / Shock, UV Exposure (Weathering / Solar Radiation), Wind & Rain / Icing Simulation, Specialty / Other
    • Accelerated (HALT / HASS): Yes
  • Supplier: E-Labs, Inc.
    Description: E-Labs, Inc. is a Full Service Testing Laboratory, offering customers access to state of the art facilities and personnel. E-Labs personnel have over 40 years of hands on testing experience within all testing disciplines for the Aerospace, Automotive, Military, Commercial and the IT industries.
    • Capabilities: Component / Product Testing, Component / Product Comparisons, Certification / Qualification, Consulting / Training, Engineering Verification Testing, Evaluation and Analysis, In-Process In-Line Testing, Performance Testing, Reliability / Robustness, Test Development, Test Fixtures / Equipment, Test Panel / Sample Prep, Specialty / Other
    • Forms Tested: Components / Parts, Products (Equipment / Devices), Samples / Materials
    • Test Services Offered: Accidents / LOCA, Erosion (Blowing Sand), Chemical Compatibility Testing, Corrosion Testing / Chemical Exposure, Fungus / Biofouling, Humidity, Seismic / NEBS Testing, Stress Screening / HASS, Thermal Cycling / Shock, Transportation Test, UV Exposure (Weathering / Solar Radiation), Vacuum / Decompression (Altitude Simulation), Wind & Rain / Icing Simulation, Specialty / Other
    • Combined Environments / Conditions: Yes
  • Supplier: M+P Labs
    Description: The M&P Lab is a full-service materials testing laboratory, offering our clients a full range of analytical and consulting services such as acceptance testing, quality control, service evaluation, failure analysis and product development. We analyze materials such as metals, composites,
    • Capabilities: Certification / Qualification, Commissioning, Consulting / Training, Evaluation and Analysis, Failure Analysis / Troubleshooting, First Article / Contract QA, Proficiency Testing, Research and Development, Testing, Test Fixtures / Equipment, Test Panel / Sample Prep, Witness / Review, Specialty / Other
    • Forms Tested: Components / Parts, Samples / Materials, Products (Machines / Devices)
    • Services Offered: Aging / Life Testing, Chemical Compatibility Testing, Electrical Characteristics Testing, Leak / Seal Testing, Mechanical / Structural (Static Load / Stress), Oil Analysis / Fluids Testing, Physical Properties Testing, Specialty / Other
    • Test / Certify To: ASTM, ISO, MIL-SPEC, NEMA LI 1, NRC, OEM Specific, Other
  • Description: Thanks to the pressure from the industry on global trade and efforts within international standardization, manufacturers can now reduce their costs by testing and certifying their product once for a relatively large market and get acceptance in many countries. A key player for you can be DNV. DNV
    • Capabilities: Auditing / Assessment, Certification, Consulting / Training, Pre-assessment / Gap Analysis, Registration
    • Certification Level: Components / Parts, Products (Equipment / Devices), Quality / Management Systems, Services, Other
    • Certify / Evaluate To: CE Mark (Europe), ISO, ISO 9001:2000, ISO 13485/8, ISO 14001, ISO/TS 16949:2002 , OHSAS 18001, RC 14001, RoHS, TL 9000, Other
    • Industry Applications: Appliances, Aerospace / Avionics, Automotive, Building Products, Battery / Energy Products, Combustion Equipment, Coatings / Paint, Food / Drugs, Electrical Distribution, Electronics, Food & Beverage, Hazardous Location Equipment, Health Care / Medical, HVAC, Industrial / Machinery, Instruments / Sensors, Marine, Materials, Nuclear / Utility, Motor Controllers / Control Systems, Paper / Plastic Packaging, Piping / Pressure Vessels, RF / Wireless Products, Rubber / Latex, Semiconductors / IC Packages, Valves / Pumps, Welding & Fabrication
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Parts by Number for Plastic Semiconductor Package Top

Part # Distributor Manufacturer Product Category Description
MSA-0486-TR1 ASAP Semiconductor AGILENT Not Provided IC AMP 86 Plastic Package T&R MMIC Amp

Conduct Research Top

  • Plastic Packaging and the Effects of Surface Mount Soldering Techniques
    temperatures can reach. PURPOSE. levels sufficient to cause failure of the package. integrity. A plastic semiconductor package forms a rigid. This application note is intended to inform and assist. system where the various components are locked. the customers of Microchip Technology Inc. with. together...
  • Mounting and Handling of Semiconductor Devices (.pdf)
    over the plastic case to a. essential to fill the air pockets between the semiconductor. grounded heat sink. and the mounting surface. This decreases the thermal. resistance by 20%. For example, a typical TO-220 with R. TO-218. JC. The mounting hole for the TO-218 device should not. grease...
  • Shedding New Light On Tiny Packages
    Library. eBooks. Audio / Videos. Training Center. Whitepapers. Reference Centers. Shedding New Light On Tiny Packages. October 4, 2000. Lawrence Kren. Welds 0.1 mm wide? No problem. Recent laser transmission welders join plastic components with unprecedented precision. Printer-friendly version...
  • Smart Packages for CPV Cell Devices
    . technologies for the electronics industry. A. of mW is well developed for high power. comparison to hB-leD technology. chip package is just a box with connectors,. LEDs, the CPV devices do need good. Typically there are 4 main parts required. and plastic molded connectors are in. thermal management built...
  • Dual In-Line Package (DIP)
    package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP)....
  • TA002: Backside Mounting Procedures for Semiconductor Wafer Processing
    . ./3e259c48-dd55-4009-a005-14fcf8461795 Costas Varmazis,. Gerald S. D'Urso,. Henry Hendriks. Process Engineering Group,. M/A-COM Inc.,. How to Process the. Lowell, Mass. Backside of GaAs. At a Glance. The wafers are mounted onto flat carriers with a thermo-. The background details of backside GaAs process steps for. plastic...
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Inc. plans to cut more costs. Plastic memory close to commercialization Printing memory onto flexible plastic substrates has been demonstrated by partners Thin Film Electronics and InkTec Co. Ltd. Europe slumps in February global chip sales The three-month moving average of sales of semiconductors...
  • Packaging microscopic machines
    are molded plastic surface-mount packages with leads on two sides only. They are available with 8 to 44 leads and body widths from 150 to 525 mils. SOICs have "gull-wing" metal leads; a variation called the SOJ package has inward-turning J-shaped leads that permit a smaller footprint. Ceramic dual-inline...
  • No Elbow Room - Ultra-Miniature Pneumatic Elbow Fitting Fits Critical Medical Product to a Tee
    medical company. The design engineer explained that a regulatory agency had halted the production of their surgical stapler due to the failure of a plastic pneumatic fitting. He had noticed a Beswick press release describing a metal 10-32 threaded elbow fitting and wondered if Beswick could make...
  • Tough Enough
    engineering plastic used in semiconductor processing equipment. Carbon fibers (CF) improve dimensional stability, especially in crystalline polymers suck as PEEK. Dimensional change at saturation for various back-end test-socket materials. Celazole PBI will work continuously to 600 F and even...

Engineering Web Search: Plastic Semiconductor Package Top

LM117/LM317A/LM317 3-Terminal Adjustable Regulator
906354 Scale 1:1 ?? 2011 National Semiconductor Corporation 9063 www.national.com Error : Bad color Error : Bad color Connection Diagrams TO-3 (K)
See Newark Information
LM4562 - Dual High Performance, High Fidelity Audio...
National Semiconductor | High-performance Analog The LM4562 is available in 8?lead narrow body SOIC, 8?lead Plastic DIP, and 8?lead Metal Can TO-99.
See National Semiconductor Information
Vishay - manufacturer of discrete semiconductors and passive...
High power density in small package saves space Rectifiers in New SMPC Package High-current-density performance up to 100 V and 12 A
See Vishay Intertechnology, Inc. Information
Vishay - Vishay Introduces First Devices in Leadless LLP75...
and GMF05LC-HS3 are packaged in the new LLP75-6HS, a leadless plastic package with an integrated heat sink and compact dimensions measuring just 1.6
See Vishay Intertechnology, Inc. Information
Package Outline Diagram Page Layout Package code Index: Name...
Package Outline Diagram Page Layout Package code Index: Name of package and number of pin FUJITSU SEMICONDUCTOR LOW PROFILE QUAD FLAT PACKAGE DATA
Packages Overview : Fujitsu Global
Package Overview Package type Package structure Pin count I/O frequency (GHz) Heat resistance ja(oC/W) (0m/s) Application
See Fujitsu Limited Information
Xilinx UG112 Device Package User Guide
Device Package User Guide [Guide Subtitle [optional UG112 ( UG1 v3.
See Xilinx, Inc. Information
DS005294 MM74HC02.fm
Ordering Information Package Order Number Number Package Description MM74HC02M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012,
See Fairchild Semiconductor Corporation Information
Cognex Brand Protection
Package Inspection Pharmaceuticals Medical Devices Brand Protection with Package Inspection
See Cognex Corp. Profile & Catalog
Dual in-line package - Wikipedia, the free encyclopedia
The original dual-in-line package was invented by Bryant "Buck" Rogers in 1964 while working for Fairchild Semiconductor.

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