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| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| MSA-0486-TR1 | ASAP Semiconductor | AGILENT | Not Provided | IC AMP 86 Plastic Package T&R MMIC Amp |
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LM117/LM317A/LM317 3-Terminal Adjustable Regulator 906354 Scale 1:1 ?? 2011 National Semiconductor Corporation 9063 www.national.com Error : Bad color Error : Bad color Connection Diagrams TO-3 (K) See Newark Information |
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LM4562 - Dual High Performance, High Fidelity Audio... National Semiconductor | High-performance Analog The LM4562 is available in 8?lead narrow body SOIC, 8?lead Plastic DIP, and 8?lead Metal Can TO-99. See National Semiconductor Information |
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Vishay - manufacturer of discrete semiconductors and passive... High power density in small package saves space Rectifiers in New SMPC Package High-current-density performance up to 100 V and 12 A See Vishay Intertechnology, Inc. Information |
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Vishay - Vishay Introduces First Devices in Leadless LLP75... and GMF05LC-HS3 are packaged in the new LLP75-6HS, a leadless plastic package with an integrated heat sink and compact dimensions measuring just 1.6 See Vishay Intertechnology, Inc. Information |
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Package Outline Diagram Page Layout Package code Index: Name... Package Outline Diagram Page Layout Package code Index: Name of package and number of pin FUJITSU SEMICONDUCTOR LOW PROFILE QUAD FLAT PACKAGE DATA |
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Packages Overview : Fujitsu Global Package Overview Package type Package structure Pin count I/O frequency (GHz) Heat resistance ja(oC/W) (0m/s) Application See Fujitsu Limited Information |
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Xilinx UG112 Device Package User Guide Device Package User Guide [Guide Subtitle [optional UG112 ( UG1 v3. See Xilinx, Inc. Information |
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DS005294 MM74HC02.fm Ordering Information Package Order Number Number Package Description MM74HC02M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, See Fairchild Semiconductor Corporation Information |
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Cognex Brand Protection Package Inspection Pharmaceuticals Medical Devices Brand Protection with Package Inspection See Cognex Corp. Profile & Catalog |
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Dual in-line package - Wikipedia, the free encyclopedia The original dual-in-line package was invented by Bryant "Buck" Rogers in 1964 while working for Fairchild Semiconductor. |