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...it is important for a gap to remain and permit solder to fill the hole and "wick" through the board without voids or flux entrapment. When specifying plated-thru-holes that will receive multi-faceted press-fit pins, the PCB fabricator should be given the actual drill size (prior to plating thru) to use as well...

...electronic module designs. Press-Fit technology allows for the insertion of a specially stamped terminal into a plated-through hole (PTH) in a printed circuit board (PCB) in such a way that an electro-mechanical connection is established without using solder. The press-fit joint can be a more...

...a minimum 40,000-cycle life. The low-resistance, high-current contacts are rated at 2 A continuous, 3 A peak. High-temperature thermoplastic insulators are suitable for all surface-mount processes. 190 Pine Hollow Rd., Oyster Bay, NY, 11771. Tactile dome switches feature a hole in the center, which...

...and "wick " through the board without voids or flux entrapment. When specifying plated-thru-holes that will receive multi-faceted press-fit pins, the PCB. for screws. Low power, POL and chip converters. fabricator should be given the actual drill size (prior to plating thru) to use as well as a commercial...

...for the insertion of a. for use in such applications as automotive and. specially stamped terminal into a plated-through. transportation equipments requires the units to. hole (PTH) in a printed circuit board (PCB) in such. operate under quite aggressive conditions and. a way that an electro-mechanical...

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  • Modern Electroplating 5th Edition
    ...applications , and it has be en substituted by puret in deposits in ma ny cases [ 4 6 ] . ...the speci fic ations still demand the use of re fl owe dtin – lead on PCBs . On the corner or knee of the plated through holes the thickness of tin–lead is less than 1 mm.
  • http://www.techbriefs.com/component/docman/doc_download/4046-ntb-1209?Itemid=
    Keystone Electronics Corp., Astoria, NY , offers the SMT and THM 1/3N 3-volt lithi- um battery holders for surface or through - hole mounting. The SMT features gold- plated phosphor bronze contacts, and the THM features tin-plated phosphor bronze contacts... ly on PCBs .
  • Development of conductive adhesive materials for via fill applications
    IBM T. J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY 105% *lBM Microelectronics, 1701North... Specifically,the conventional printed circuit board ( PCB ) with plated - through - hole (PTH) vias is difficult to justify its manufacturing cost as well as the packaging density requirement.
  • Materials and Technologies for Solar Energy
    Markets EDOT-based direct-metallization technology for through - hole plating (part of the PCB fabrication process); licenses technology to Atotech GE Global Research (part of GE Company) Niskayuna, NY , U.S.
  • Development of conductive adhesive materials for via fill applications
    With this trend, the conventional printed circuit board ( PCB ) with mechanically drilled plated through holes (PHTs) is difficult to justify its manufacturing cost as well as connection pad density requirement by the future ultra fine pitch components. ...S. Pu- rushothaman are with the IBM T. J. Watson Research Center, Yorktown Heights, NY 10598 USA.
  • Experimental equivalent-circuit modeling of SMD inductors for printed circuit applications
    These components are soldered onto associated pads on a printed circuit board, sometimes, using plated - through holes or vias for parts with axial leads. At radio frequencies, the combination of component packaging, pad footprint, PCB layout and the substrate interaction causes... The author was with the Philips Broadband Networks, Syracuse, NY 13104 USA.
  • Model-to-hardware correlation of physics based via models with the parallel plate impedance included
    Model-to-Hardware Correlation of Physics Based Via Models with the Parallel Plate Impedance Included ...Research Center in 2005 and 2006 vv **IBM T. J. Watson Research Center, Yorktown Heights, NY 10598 ...employment of microprobes which are previously calibrated with a standard short-open-load- through (SOLT) calibration method. The access to the desired device under test (DUT) is not performed from the PCB surface by means of a through hole via but by recessing the probe launch into the board at the desired layer level.
  • An intra-cerebral drug delivery system for freely moving animals
    A layer of thermally expandable material is deposited on the front side of the PCB . ...material is prepared by mixing PDMS RTV615 (Momentive Performance Materi- als, Inc., Albany, NY , USA) with thermally... ...insert with the liquid reservoirs is based on a 2-mm- thick COP plate (Zeonor 1420R, Zeon... Each structure is connected by a through - hole (diameter of 500 μm) to the averted side and couples there to the holder for the silicon microprobe chip.
  • How detrimental could a via be?
    T.J. Wstson Resear& Center, YorktomHeights, NY 10598 Phone:914-945-2304, FAX: 914-9454134, e-mail... ...of both designersand manufacturers, whenever multi-layer chip-packaging modules andor printed circuitboards ( PCB )are involved [2]. The so-called “via-stub�?, due to the use of plated through holes (PTH) in today’s dominant PCBtechnologies, acts as a notch filterthat introduces deep notches at multiGHz fiequencies.
  • CR4 - Thread: Electronic PCB Intermittent Vias
    Location: Long Island NY Re: Electronic PCB intermittent vias Before new, well plated boards could be obtained the questionable boards went through a modified assembly process. Through hole and vias were first soldered in a wave soldering process.
  • Bandwidth Study of Recessed Probe Launch Variations for Broadband Measurement of Embedded PCB Structures
    Yorktown Heights, NY , USA measurement of embedded (internal) printed circuit board ( PCB structures such as striplines and vias ( plated through holes ) will .
  • Cambridge Journals Online - Abstract
    ...Department of Systems Science and Industrial Engineering, State University of New York at Binghamton, Binghamton, NY 13902 This technology aims to integrate the Printed Circuit board ( PCB ) assembly process for both through hole and surface mount components. ...solder pastes were considered in this study and their rheological characteristics were identified through flow and oscillation... Furthermore, extensive shear thinning of the paste facilitated the filling of the Plated -Through-Hole (PTH) sites.
 



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