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Plating Bath Characterization

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  • MICRO:Building Copperopolis, by Bruce Maeda, p.39 (Sept '99)
    and reduce batch process time. Results of Treating Spent Plating Baths A typical electrowinning profile, including in-line copper sensor readings, is shown in Figure 6. Several samples of plating bath waste were taken from the electrowinning cell during the batch process period. These data were...
  • MICRO:Building Copperopolis (Jan '99)
    as well as electroless and electrolytic plating each with different grain sizes and fill characteristics. There are still many important issues to be resolved, however, before dual-damascene copper technology can be successfully implemented. Tantalum (Ta)- and tungsten (W)-based diffusion barriers...
  • MICRO: Products
    , analytical standards (system calibration and process control materials) enable precise control of the plating bath. The chemistry meets the technical requirements of 300-mm manufacturing at the 65-nm node and has a long bath life. (Semicon Europa, Booth B1.450). Cleanroom Ionizing Gun. NRD. Grand...
  • MICRO:Semicon Southwest p.2 (Oct '99)
    Feedback for Continuous Mode Materials Jetting M. Lovelady and J. D. Watts, Nortel Technology Low-Temperature Gold Wire Bonding Yiu Ming "Ken" Cheung, Siu Wing "Derek" Or, and Stephen Ching, ASM Assembly Automation Analysis of Copper Plating Baths New Developments Beverly Newton, Dionex...
  • MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
    , Harris Semiconductor Methodology for Optimization of Zone Control for Multiple-Lamp Wafer-Heating Systems A. Janos and A. Cardoso, Eaton Analysis of Copper Plating Baths Beverly Newton, Dionex WEDNESDAY, OCTOBER 21 8:00 a.m. noon Interconnect Chairs: Tom Goodman, TechSearch International...
  • MICRO: Products
    Electroplating Tool. Applied Materials. Santa Clara, CA. An electrochemical plating system for use at the 65-nm node and beyond, the 300-mm SlimCell relies on an individual-cell chemistry that enables multistep electroplating. Rather than employing a common chemical bath for multiple plating cells...
  • MICRO:Outlook 2000 (Nov '99)
    usage in the creation of the slurry is an issue. On the positive side, there is a lot of work being done in looking to evaluate the copper plating bath itself so that we are working to minimize the use of chemicals. We're looking to develop techniques for copper bath recycling. People are looking...
  • MICRO:Product Technology News (June '99)
    is supplied by 9-V alkaline batteries, which are included. Information: 215/822-2171. (Semicon West, San Francisco, Esplanade, Booth 4310) Semitool says its LT-210c tool successfully completed marathon performance testing for copper interconnect plating. The system demonstrated a throughput of 70...
  • MICRO:Archive:Back Issue TOC
    for copper interconnect plating; manufacturer offers CPVC piping; chipmaker to use universal system tools and data capture upgrades; photochemical dispensing unit incorporates safety upgrades and overfill protection; litho firm offers alignment system with large overlay window MOVIN' ON Movin...

Engineering Web Search: Plating Bath Characterization

Copper - Wikipedia, the free encyclopedia

Stress characterization of electroplated gold layers for low...
Stress characterization of electroplated gold layers for low temperature surface micromachining
Factors affecting copper filling process within high aspect...
This study found that the plating bath requires a high metal concentration and a strong super-conformal capability.
VR37 www.vishay.com Vishay BCcomponents High Ohmic/High...

See Vishay Intertechnology, Inc. Information
Development of a novel alkaline zinc?iron plating bath...
a novel alkaline zinc?iron plating bath containing sorbitol and the chemical, physical and morphological characterization of the Zn?Fe films
Pure nickel coating on a mesoporous alumina membrane:...
Pure nickel coating on a mesoporous alumina membrane: Preparation by electroless plating and characterization
Abs. 403, 205th Meeting, ? 2004 The Electrochemical Society,...
403, 205th Meeting, ? 2004 The Electrochemical Society, Inc. Characterization and Nanoscale Analysis of Electrodeposited CuInSe2 on Flexible Polymer
See Electrochemical Society (The) Information
Chapter 2 Profile of the Making Holes Conductive Use Cluster
The electroless copper bath is an alkaline solution containing a source of copper ions, a chelator to keep the copper ions solubilized, a stabilizer
Chapter 3 RISK
I Bath chemicals used. This includes chemical formulations used for initial bath make-up, 1 bath additions, and bath replacement.
Salts of Ethylenediaminetetraacetic Acid (EDTA)
Risk Characterization Risk Management Industry Standards
See Dow Chemical Company (The) Information

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