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Parts by Number for Plating Tape Top

Part # Distributor Manufacturer Product Category Description
12-5-1280 Digi-Key 3M (TC) Tapes, Adhesives TAPE CIRCUIT PLATING 12"X5YD
6-5-1280 Digi-Key 3M (TC) Tapes, Adhesives TAPE CIRCUIT PLATING 6"X5YD
4-5-1280 Digi-Key 3M (TC) Tapes, Adhesives TAPE CIRCUIT PLATING 4"X5YD
851 GREEN, 1 1/2 IN X 72 Digi-Key 3M Tapes, Adhesives TAPE CIRCUIT PLATING 1.5"X 72YD
851 GREEN, 1 1/2 IN X 144 Digi-Key 3M Tapes, Adhesives TAPE CIRCUIT PLATING 1.5"X 144YD
851 GREEN, 3/4 IN X 144 Y Digi-Key 3M Tapes, Adhesives TAPE CIRCUIT PLATING 3/4"X 144YD
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Conduct Research Top

  • Adhesion Tests (Bond / Peel)
    two surfaces are held together by interfacial forces, which may consist of valence forces, interlocking action, or both. Adhesion is one of the most important properties of a coating (thin film, paint, plating, or other systems). ASTM C-313 standards provide a method to measure of the adherence
  • Care and Handling of LCDs - AN821
    , for example, may be appropriate if the LCD. will be exposed to high temperatures for long periods. Direct Current. For optimum LCD operation, DC components of an LCD's drive signal must be. within the specifications for the LCD. Operation outside of the specifications--DC. offset--can cause plating, fluid
  • AN0016 Micro-sectioning of Multilayer Ceramic Capacitors
    . Unfortunately, fracture sections are generally unsuitable for looking at chip / termination / plating. boundaries, as there are definite stresses applied to the termination interfaces during fracturing,. and the edges of the termination bands are particularly vulnerable. Fracture section showing some
  • Precious Metals
    , electrodes, cathodes, crucibles, catalysts, and salts or solutions for plating and coating. All precious metals are nearly completely corrosion resistant; platinum metals withstand service up to 3,200 F without any evidence of erosion or corrosion. An extremely soft, ductile metal, gold undergoes very
  • UV Curable Masking Technical Article
    milling, plasma spray or plating, masks act as a self-sacrificing barrier for surface preparation. The more complex and intricate a component, the longer it takes to apply and remove traditional masks such as tapes, waxes and solvent based lacquers. The costs associated with masking may not be readily
  • Ceramic Electronic and IC Packaging Design Guide
    particle sizes with fluxes. tape with refractory metal pastes. or electrolytic gold. Electrolytic plating. lids, leads, seal rings) in Kovar, Al oy 42,. and smal amounts of organic binders. using precision screen printing. requires that al exposed circuits be. Custom Pin Grid Arrays. Spring Steel
  • Giga-snaP BGA SMT Adapters
    signals. 1. Design-Description. Materials. Ironwood Electronics has the tooling,. Terminals: software, and equipment in place to deliver. Material: Brass Alloy. quickly any array, custom or standard 1 mm. Plating : 10µ" Gold over 100µ" Nickel (min.). Giga-snaP. Our speed of delivery for BGA
  • TA022: Benefits and Challenges in Decreasing GaAs through Substrate via Size and Die Thickness
    area die. Some manufacturers. Most plastic packaged GaAs die are attached with thermal. met this challenge by plating a very thick layer of gold on. conductive epoxy in order to mitigate thermal mismatch. the wafer back-side to serve as a grounded heat sink and. issues and lower costs. Some PA die

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