|
|
||
Welcome to GlobalSpec!
Find parts, products, suppliers, datasheets, and more for:
Poly Wafer
Find Suppliers by Category
Industrial brushes are used for metal deburring; removing rust, paint or coatings; welding or surface preparation; painting and coat application; thread cleaning; and surface finishing on a variety of materials.
Search by Specification |
Learn More
-
Supplier: Correct Products, Inc.Description: Ideal for packaging semi-conductor wafer boxes, medical devices, cleanroom gowns, gloves or wipes or any other product requiring similar levels of cleanliness. Class 100 Certified.
-
Supplier: Baldor Electric CompanyDescription: Description Poly-Disc Couplings are a pin type coupling using a molded polyurethane disc. Features/Benefits Simple installation without the use of bolts, design well suited for washdown applications. Technical data Horsepower @ 1800rpms is 310HP, torque capacity up to 10,900 in-lbs., bore
- Coupling Type: Shear Coupling, Wafer / Flexible Disc
-
Supplier: Correct Products, Inc.Description: Ideal for packaging semi-conductor wafer boxes, medical devices, cleanroom gowns, gloves or wipes or any other product requiring similar levels of cleanliness. Individually wrapped and shipped with special plastic core to prevent particulate contamination. Class 100 Certified.
-
Supplier: R. S. Hughes Company, Inc.Description: CleanTeam(R) Class 10 Cleanroom Vinyl Gloves, 9 1/2 in Length, 5 mil., Medium. * Electrostatic Dissipative. * Exceed Standards Required for Use in Class 10 Environment. * Beaded Cuff. * Packed 100 Gloves Double Bagged in ESD Poly Bag, 10 Double Bags per Lined Master Case, Master Case Double Boxed
-
Supplier: Correct Products, Inc.Description: DOD-HDBK-263 and MIL-B-8 1705. For use in handling of Class 2 devices (2000 to <4000, HBM) • Length: 14 inches • Sizes Available: L • Pack: 1 Pair/Poly Bag • Applications: Diffusion furnaces, quartz wafer boats; liquid gas flask handling (ultra cold), hot/dry glassware
Featured Products for Poly Wafer Top
-
Ta2O5, HfSiOx. Metal films: Al-Cu-Si, W, TiW, Co, TiN, TaN, Ta-Al, Ir, Pt, Ru, Au, Ni, etc. Electrode films: doped poly-Si (dopant: B, N, O, P, As), amorphous-Si, WSix, Pt, etc. Other doped films (As, P), trapped inert gas (Ne, Ar, Kr, etc.), C (DLC). Ferroelectric thin films, FRAM, MRAM, GMR, TMR; PCM, GST, GeTe. Solder bump composition: SnAg, SnAgCuNi. MEMS: thickness and composition of ZnO, AlN, PZT. SAW device process: thickness and composition of AlN, ZnO, ZnS, SiO2(piezo film); Al, AlCu... (read more)Browse Spectrometers Datasheets for Rigaku Corporation -
The PCO2-14 ™ Polyimide Cure solution is a clean process oven designed for polyimide baking, curing, and sterilizing applications. Many semiconductor manufacturing environments, front-end machines are adapted for polyimide curing. This costly process results in equipment typically not suitable for polyimide curing in terms of cleanliness, inert atmosphere capabilities, cycle time or data acquisition. The PCO2-14 ™ optimizes the polyimide curing process for semiconductor wafer... (read more)Browse Industrial Ovens Datasheets for Despatch Industries
-
The FK Polypropylene Butterfly Valve Series offers superior strength and chemical resistance in highly corrosive environments. The special trapezoid shape of the liner and a serrated body cavity guarantee a bubble tight seal while keeping break-away torque at an absolute minimum. This versatile industrial valve features double self lubricating seals and direct mount actuator capability. These valves are available in line sizes of 1 1/2 ″ through 12 ″ with Wafer or Lugged flanged end... (read more)Browse Butterfly Valves Datasheets for Assured Automation
-
. High-k and ferro-dielectric films: PZT, BST, SBT, Ta2O5, HfSiOx. Metal films: Al-Cu-Si, W, TiW, Co, TiN, TaN, Ta-Al, Ir, Pt, Ru, Au, Ni, etc. Electrode films: doped poly-Si (dopant: B, N, O, P, As), amorphous-Si, WSix, Pt, etc. Other doped films (As, P), trapped inert gas (Ne, Ar, Kr, etc.), C (DLC). Ferroelectric thin films, FRAM, MRAM, GMR, TMR; PCM, GST, GeTe. Solder bump composition: SnAg, SnAgCuNi. MEMS: thickness and composition of ZnO, AlN, PZT. SAW device process: thickness and composition... (read more)Browse X-Ray Fluorescence Spectrometers Datasheets for Rigaku Corporation
-
drying capability with vacuum drying in an inert environment. MEI's solution for Poly Silicon chunk etching, cleaning and drying has significant advantages inherent in the carefully thought out design that considers not only operation, but resource use, safety, maintainability, control and flexibility. (read more)Browse Semiconductor Wet Process Equipment Datasheets for MEI, LLC
Conduct Research Top
-
Wafer-Scale Scientific CCDs at Fairchild Imaging
the proper. configuration of the process equipment is essential. Each fabrication process step must also be fully optimized to. achieve the level of performance expected of scientific grade CCDs. The devices are fabricated using a triple poly,. single metal process. An oxide-nitride gate dielectric
-
MICRO: Defect/Yield Analysis
in-line cover 14 cm2 of each wafer. Process Step. Inspection Step. Start lot. Laser scribe. Clean 1. Deposit 2000 A oxide. Window 0 lithography. Window 0 etch. Photoresist strip. Prepoly HF dip. Clean 2. Deposition of poly. Implant. Gate activation. Megasonic clean (Lots 7-10). Pre-WSi HF dip
-
MICRO: Industry News: 'Round the Circuit (June 2000)
, and other oxide films; the SiNgen single-wafer LPCVD nitride chamber for spacer and pad nitride uses; and the integrated poly and gate oxidation process chambers for polysilicon deposition of the transistor gate. The vendor says its SiNgen system can improve yields by reducing thermal exposure
-
MICRO: Product Extra!
postvia etch, postmetal etch, shallow-trench isolation, and poly etch. The addition of H2O vapor improves polymer removal selectivity, reducing undesirable oxide or nitride loss. Information: 301/284-5841. A new catalog from Bosch Rexroth's Linear Motion and Assembly Technologies division highlights
-
MICRO: Brave New Materials
(Hayward, CA) has developed several such formulations that have proven effective in the postetch cleaning of such conventional interconnect structures as aluminum lines and pads, oxide vias and contacts, and poly gates, with minimal metal corrosion. The formulations also are effective in oxide
-
CNC Router Helps Reduce Time to Produce Automated Wet Process Machines from 1900 to 1000 Hours
filled with CD-ROMs or semiconductor wafers by 25% to $275,000 while increasing its profit margin. Poly Design, Inc. | Techno CNC Routers | CNC Application Articles. Home > CNC Application Articles > Poly Design, Inc. Shop Online | Support | Site Map. CNC Machines. Our Customers. Events. Services
-
MICRO:Product Technology News (Oct. '98, p.110)
and a pressure-relief valve. Clamped to the base with a large O-ring, the chamber has two quick-disconnect fittings for filling and purging. The chamber is made of low-outgassing transparent molded poly- urethane which blocks UV light at a rate of 2% below 250 nm. The filter in the nitrogen input line is rated
-
MICRO:May 98:Product Technology News
, Lam Research's TCP 9400PTX high-density poly etch system processes devices with linewidths 3/40.25 um. The third-generation tool is suitable for advanced polysilicon, polycide, and shallow trench isolation applications. The system, which builds on technology provided by the company's 9400SE model
Engineering Web Search: Poly Wafer Top
-
CMOS Logic Technologies : Fujitsu Global
ASICs/Wafer Foundry Services > CMOS Logic Technologies ASICs/Wafer Foundry Services Products CMOS Logic Technologies
-
CMOS Logic Technologies : Fujitsu Canada
Wafer Prototyping Test Fab Information System "FF-eSERVE" Diffusion Poly Non-silicide Poly Silicide Poly
-
SVM | Silicon Valley Microelectronics, Inc.
Semiconductor Wafer Non-Silicon Wafers Wafer Services Annealing Dicing Epitaxial Services
-
Microelectromechanical systems - Wikipedia, the free...
by the technique of thermal oxidation, in which the (typically silicon) wafer is exposed to oxygen and/or steam, to grow a thin surface layer of
-
Solar cell - Wikipedia, the free encyclopedia
A solar cell made from a monocrystalline silicon wafer
-
Instructions for Drytek2 Poly Etch Process Qualifications
of the poly program including etch rates of poly and photoresist, selectivity of those materials, and wafer-to-wafer and within-a-wafer uniformity of
-
Plasma Etch: Polysilicon Etch Overview
The undercut during the C2ClF5/SF6 poly-Si and Si etch processes depend on the by-products from resist erosion.
-
I N V I T E D P A P E R High-Density Through Silicon Vias for...
After filling the Si developed a new wafer aligner having an alignment trenches with poly-Si, the wafer is bonded to the supporting accuracy of 1 m
