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TA038: High Performance Wideband Amplifiers For Radar And Satcomm Applications
/µm current. functionality. The amplifiers have been created. handling. This permits the creation of higher. using M/A-COM's MSAG multi-level plating. current structures, such as spiral inductors for. (MLP) process that utilizes multiple low di-. compact designs. electric constant polyimide layers
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New Grind
Many cutting tool manufacturers already use CBN grinding wheels to grind small, round, HSS cutting tools from hardened blanks. However, recent field trials demonstrate that the latest superabrasive hybrid metal/polyimide-bond wheels, when automatically profiled on the machine, not only outperform
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Liver On A Chip? Maybe Someday, Say Researchers
A project designed to culture liver tissue, pioneered by the Massachusetts Institute of Technology (MIT), may help to one day soon save lives. Cell-holding scaffolds for the project are made of laser-machined polymers (polycarbonate, polyethylene terephthalate, and polyimide). Extremely small
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Down-to-earth role for imidized polymers
specified for thermal insulators, high-performance bearings, electrical connectors, and ablative structures. The family of imidized polymers include polyimide (PI), polyamideimide (PAI), polybenzimidazole (PBI), and polyetherimide (PEI). Chemically, all contain at least one imide linkage (carbonyl
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Medical Device Link .
The origins of polyimide tubing As a class of organic resins, polyimides exhibit outstanding engineering properties, especially thermal stability, dielectric strength, mechanical strength, temperature stability and chemical resistance, see . Although polyimide resin structures were known about
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The "no-cog" motor
design for an air-bearing application in a servo writer. The coil in this cutaway of a ThinGap motor is made from precision-milled sheet copper in a fiberglass and polyimide material composite, rather than from conventional copper wires. The magnetic path for the permanent magnets is shortened
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MICRO:Semicon Southwest p.2 (Oct '99)
, and Raj Nair, Motorola Evaluation of Eutectic Solder Bump Interconnect Technology Craig Beddingfield, Addi Mistry, and Qing Tan, Motorola Eutectic Bump Evaluation with Various Passivation and Polyimide Structures Addi Mistry, Kartik Ananthanarayan, Craig Beddingfield, Dianne Mitchell, Qing Tan
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U.S. and International Fuel Cell Patents | January 2006 | FCT | 7MS.com
Inc. U.S. 6,960,403 (20051101), Bonded polyimide fuel cell package and method thereof, Jeffrey D. Morse, Alan Jankowski, Robert T. Graff, and Kerry Bettencourt, The Regents of the University of California. U.S. 6,960,404 (20051101), Evaporative cooled fuel cell, Steven G. Goebel, General Motors