Polysilicon Manufacturing Process

Conduct Research

• Characterizing effluents from PECVD, plasma etch processes
  semiconductor manufacturing facility to identify and quantify process by- products, quantify unreacted process gases, and determine utilization efficiencies of these gases. These processes included plasma-enhanced chemical vapor deposition (PECVD) of silicon oxide and plasma etching of polysilicon...
• Cleaning silicon wafers with an argon/nitrogen cryogenic aerosol process
  no degradation of sensitive structures, suggesting that the process can be readily inserted in a variety of steps in the semiconductor manufacturing process. Acknowledgments The authors want to thank the researchers at IBM's Advanced Semiconductor Technology Center in Hopewell Junction, NY, for providing much...
• Characterizing a rapid thermal annealing process to improve sensor yield
  . In the acceleration sensor manufactured by Motorola's MEMS-1 die manufacturing group, three polysilicon plates are fabricated parallel to one another to form a dual, differential capacitive element (see Figure 1). The top and bottom plates are stationary, while the middle plate can move in the direction...
• MICRO: Transistorama
  Min-Soo Kim, William Cooper, Brian Simonson, David Ricks, Eric McDaniel, Roderick Miller, Richard Chapman, Thomas Taylor, Modern CMOS manufacturing processes, including those used to fabricate DRAM devices, generally use doped polysilicon as a conducting material. Another process that uses...
• MICRO: Fab Support Strategies
  Over the past decade, the general attitude toward chemical-mechanical polishing (CMP) has evolved. Once reluctantly accepted as a niche planarization process for only the most advanced devices, it has come to be embraced as a mainstream process for high-volume CMOS manufacturing across multiple...
• Wired 8.09: Bright Switch
  and engineering, and Yoel Fink, a postdoctoral associate, are developing a different form of band-gap device that - while not quite serving the purposes Joannopoulos envisions - avoids the manufacturing challenges Kolodziejski faces. Instead of structural subtraction or addition, Thomas and Fink...
• Product Technology News
  By integrating processes, a combination rubbing/dry-cleaning module for LCD manufacturing reduces substrate handling and conserves cleanroom space. The noncontact cleaning process uses high-frequency waves from an ultrasonic head to eliminate 95% of particles greater-than or equal-to 1 um...
• MICRO: Facility Report
  for electronics began there. Initial production of polysilicon for semiconductor applications in float zone (FZ) silicon started in 1958, with 1961 marking the first manufacturing of crucible-pulled (or CZ, short for Czochralski) crystals, as well as the first epitaxial wafers. The company founded...
• MICRO: TechEmergent
  Jon Owyang and Larry Bartholomew The drive toward sub-100-nm feature sizes places extreme performance demands on semiconductor manufacturing processes and equipment. Chemistry and hardware challenges are being addressed through the development and implementation of novel processing techniques...
• MICRO: Sandia teams with business incubator to commercialize advanced MEMS technologies
  products using the advanced design, manufacturing, and characterization technologies developed originally for national lab uses. Information: http://www.sandia.gov; http://www.ardesta.com. MicroHome | Search | Current Issue | MicroArchives. Buyers Guide | Subscribe to MICRO. Questions/comments about...

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