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Polysulphide Composites

 

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Polymer and plastic composites are strengthened with fibers, fillers, particulates, powders and other matrix reinforcements to provide improved strength and/or stiffness. Examples include fiber reinforced plastics (FRPs), sheet molding compounds (SMCs), bulk molding compounds (BMCs), pre-preg materials, and fabricated composite parts.
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  • Description: Master Bond Polymer Adhesive EP21TPLV-3 is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or volume. It
    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Rubber / Elastomer, Wood / Wood Product, Other
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging, Other
    • Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
  • Description: Master Bond Polymer System EP21TPFL-1 is a two component, low viscosity, highly flexible epoxy polysulfide elastomer compound for high performance bonding, sealing and casting offering outstanding resistance to fuels, water, oils and many other aggressive chemicals. It has been formulated to cure
    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging, Other
    • Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
  • Description: Master Bond Polymer Adhesive EP21TPHTQ is a two component thermally conducitve, electrically insulative polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high
    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Other
    • Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
  • Description: Master Bond Polymer Adhesive EP21TPHTAO is a two component thermally conducitve, electrically insulative polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high
    • Material Type: Gap Filling Compound, Specialty / Other
    • Industry: Electronics, Electrical Power / HV, Semiconductors / IC Packaging, Aerospace, Automotive, OEM / Industrial, Other
    • Features: Flexible / Dampening
    • Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
  • Description: Two component medium pot life polysulfide adhesive for bonding & sealing
    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging, Other
    • Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
  • Description: Master Bond Polymer Adhesive EP21TPHTAO is a two component thermally conducitve, electrically insulative polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high
    • Material Type: Gap Filling Compound, Specialty / Other
    • Industry: Electronics, Electrical Power / HV, Semiconductors / IC Packaging, Aerospace, Automotive, OEM / Industrial, Other
    • Features: Flexible / Dampening
    • Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Material Type: Grease / Paste, Gap Filling Compound, Specialty / Other
    • Industry: Electronics, Electrical Power / HV, Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
    • Features: Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, ESD Control / Anti-static, Flexible / Dampening
    • Chemical / Polymer System Type: Polysulfide, Polyurethane (PU, PUR), Epoxy (EP)
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Material Type: Grease / Paste, Gap Filling Compound, Specialty / Other
    • Industry: Electronics, Electrical Power / HV, Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
    • Features: Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, ESD Control / Anti-static, Flexible / Dampening
    • Chemical / Polymer System Type: Polysulfide, Polyurethane (PU, PUR), Epoxy (EP)
  • Description: Master Bond Polymer Adhesive EP21TPLV-3 is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or volume. It
    • Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), Semiconductors / IC Packaging, Other
    • Features: Electrically Insulating / Dielectric
  • Description: Master Bond Polymer Adhesive EP21TPLV-3 is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or volume. It
    • Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
    • Dissimilar Substrates: Yes
    • Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), Semiconductors / IC Packaging, Other
    • Features: Electrically Insulating / Dielectric

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