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Polyurethane Encapsulating Resin
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Supplier: Epoxies Etc...Description: 70-2170 is a liquid, low viscosity, urethane resin formulated for casting dimensionally stable parts. Parts cast with 70-2170 have an ABS feel and appearance. 70-2170 is mercury free and does not contain TDI or MbOCA. It’s low shrinkage and low viscosity allow for the production of precision
- Material Form: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
- Polymer / Chemical Type: Polyurethane (PU, PUR)
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Supplier: Ellsworth AdhesivesDescription: CONATHANE EN-1554 is a polyether based polyurethane resin system primarily intended for use as a molding, encapsulating and potting compound for harness breakouts, watertight electrical connectors, cables, cable end seals, printed circuitry and other electrical components.
- Applications: Electronics / Semiconductors, Other
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Supplier: Epoxies Etc...Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good choice
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Industry Applications: OEM / Industrial
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Supplier: ELANTAS PDG, Inc.Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing
- Compound Type: Encapsulating / Potting
- Dissimilar Substrates: Yes
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Features: Electrical Insulation / Dielectric Material, Filled, Flexible / Dampening, Non-corrosive Cure
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Supplier: Dow PolyurethanesDescription: Dow provides a wide variety of VORANOL* polyether polyols with an extensive selection of performance and processing attrib- utes. Designed to meet your needs, this large family of polyols is sure to provide the balance of properties needed within rigid and molded foam and isocyanate product
- Material Form: Encapsulant / Potting Compound
- Industry Applications: Other
- Polymer / Chemical Type: Polyurethane (PU, PUR), Specialty / Other
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Description: INSULTHANE 450
- Compound Type: Electrical Insulation / Dielectric Material
- Material Form: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
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Supplier: GS Polymers, Inc.Description: Two part, 1:2, 1-2 hours working time, water resistant, excellent adhesion
- Material Form: Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
- Polymer / Chemical Type: Polyurethane (PU, PUR)
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Supplier: Epoxies Etc...Description: Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries.
- Polymer / Chemical System: Polyurethane
- Foam Type: Closed Cellular, Rigid
- Form / Shape: Casting Resin / Two-part (A+B Liquids)
- Material / Composition: Plastic / Polymer, Elastomer / Rubber
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Supplier: Epoxies Etc...Description: 20-2028 is a light weight, two component, closed cell, liquid urethane foaming resin system designed for potting and encapsulating.
- Material Form: Polymer (Plastic / Elastomer), Potting Compound, Specialty / Other
- Features: Electronics / Semiconductors
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Supplier: Ellsworth AdhesivesDescription: CONATHANE EN-20 is a two-component, liquid, low viscosity, low toxicity, room temperature curing polyurethane resin system. Gallon kit.
- Material Form: Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors, UL Approved
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Supplier: Ellsworth AdhesivesDescription: Urethane 51606LV is a room temperature curing, 2 part polyurethane system. This one to two mix ratio product cures at room temperature in 2 hours to a tough flexible polymer. Sold as a pack (50/pk).
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Industry Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
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Supplier: Henkel Corporation - ElectronicsDescription: Superior environmental protection, extreme thermal cycling resistance
- Compound Type: Thermal / Heat Insulating
- Material Form: Conformal Coating, Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Polymer / Chemical Type: Polyurethane (PU, PUR)
Featured Products for Polyurethane Encapsulating Resin Top
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Epoxies, Etc's new electronic grade 20-2620 is a two component Polyurethane compound designed for applications requiring "water like" clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time. 20-2620 is semi-flexible and will not place excess stress on electronic components. It also has a low viscosity, which facilitates easy flow and penetration into difficult areas. This product has a convenient one to one mix ratio... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
Conduct Research Top
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New Urethane Technology for Potting & Encapsulation in Electronics
. Measuring moisture vapor transmission rates (MTVR) is one method of determining the. permeability of a material. The graph below is representative of the MVTR of common potting. and encapsulating materials. Moisture Vapor Transmission Rate. 20-2350. Conventional. Polyurethane. Bis-A Epoxy. Silicone
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RIM goes bumper to bumper
and body panels. Placing long-glass fibers in RIM parts such as this truck's cargo box make them suitable for structural components. Encapsulating long-fiber inserts in RIM parts make them suitable for structural applications such as this tailgate. RIM parts can have highquality surface finishes
Engineering Web Search: Polyurethane Encapsulating Resin Top
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Epoxy Resin | Electronics Potting Compounds | Custom Epoxy...
Epic Resins is a custom formulator of epoxy resin and polyurethane compounds for original equipment manufacturers (OEM) in business since 1958.
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Polyurethane Industrial Coatings Datasheets
Chemistry: Polyurethane; Resin Form: Film Chemistry: Polyurethane; Resin Substrate: Concrete
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Clear Flexible Epoxy Doming Resin from Epoxies Etc...
Home > Company Directory > Epoxies Etc... > Clear Flexible Epoxy Doming Resin Epoxies Etc... - Clear Flexible Epoxy Doming Resin
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doming resins, potting and encapsulating compound, thermal...
include epoxy, Polyurethane, silicone¡K. Suitablel for epoxy coating, polyurethane coating, clear epoxy doming, doming, polyurethane doming resin,
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Electrolube polyurethane potting resin UR5097
Polyurethane UR5097 Electrolube - UR5097 high performance thermally conductive 2 part polyurethane resin.
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Current and reliable Resin Coatings news stories
to cure at room temperature, 2-component 20-2125 Potting, Encapsulating, and Casting Resin cushions and protects sensitive electronic components
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Current and reliable Chemicals & Chemical Processing news...
Polyurethane Potting Compound allows user to
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Loctite 3173 Hysol Polyurethane Resin, G... from Amazon.com
Title: Loctite 3173 Hysol Polyurethane Resin, General Purpose [PRICE is per PAIL Brand: Loctite Manufacturer: Loctite Merchant: R. S. Hughes Co.,
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Loctite(R) 3173â"¢ Hysol(R) Polyurethane... from Amazon.com
Title: Loctite(R) 3173â"¢ Hysol(R) Polyurethane Resin, General Purpose; 1QT [PRICE is per CAN Brand: Loctite Manufacturer: Loctite Merchant: R. S.
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Insert/Overmolding Molding | Society of Plastics Engineers
Molecular bonding can occur when the insert material is the same as or similar to the encapsulating resin.
