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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3145 potting & encapsulating compound is compatible with polyurethane materials.
- Form / Function: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3145 potting & encapsulating compound is compatible with polyurethane materials.
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 20-2365 has a convenient
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description UR5545 fast cure polyurethane potting compound is unique when it comes to encapsulation and cable jointing compounds. It extends the standard urethane technology to create specialised properties useful for a host of applications but particularly cable
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Form / Function: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description UR5604 general purpose polyurethane potting compound is a two part, potting and encapsulation resin. It’s a good all round resin suitable for a huge range of electronic applications offering high performance protection from the environment. It
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description UR5048 soft / digoutable polyurethane potting compound is a flexible encapsulation resin with a soft finish. It’s soft ‘digoutable’ properties making it a good choice for potting units that may require rework or repair. In most cases because of the
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Flexible / Dampening: Yes
- Form / Function: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description UR5608 hard polyurethane potting compound is a tough resin ideal for applications where thermal shock or temperature cycling is present. It’s a good all round resin with good thermal conductivity and is flame retardant meeting UL94 V-0. These
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: Epoxies Etc...
Description: The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate components and electronic devices. The 20-2135 has outstanding thermal cycling
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.5
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Supplier: Epoxies Etc...
Description: internal stress and minimal shrinkage. It is an excellent choice for potting and encapsulating electronic modules, coils, and micro electronic networks that require thermal cycling extremes and low pressure on delicate components.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 8000 to 14000 cP
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Encapsulants and Potting Compounds - Filter-bond? Elastomeric Casting and Potting Compound -- E-3503Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Henkel Corporation - Industrial
Description: 2-part, yellowish, polyurethane-based casting resin, NSF approved, formulated especially for spiral wound filters (RO) and application to dry substrates. Two component polyurethane adhesive. Macroplast® UK 178A with 178B is a 100% solids, room temperature curing polyurethane
- Compound Type: Leveling / Filling Compound
- Cure Type / Technology: Two Component System
- Industry: Other
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Supplier: ACCRAbond, Inc.
Description: CONATHANES® EN-2541 and EN-2543 are filled, flame resistant polyurethane resins, specially formulated for general purpose electrical/electroni c potting, casting and encapsulation. When tested in accordance with UL-94, flame resistance ratings of 94V-O are obtained. EN-2541 and EN-2543
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV stabilizers and
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 5544, Potting and Encapsulating LOCTITE® STYCAST US 5544 is a fast gelling, flexible, flame retardant, mineral-filled, polyurethane compound. It is a fast-setting potting compound which is low in viscosity, therefore flows well and adheres well
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 63.33 µin/in-F
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 1320 psi
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 5529, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 5529 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life, and is low viscosity so it flows well and adheres well to
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 540 psi
- Thermal Conductivity: 0.3400 W/m-K
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Supplier: TE Connectivity
Description: Quantity : 1 Potting Resin Product Availability : AMERICAS, ASIA, EMEA, ANZPAC, China Product Type Features Material System : Two-Component Polyurethane Potting Resin Product Type : Potting
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Availability Minimum Order Quantity : 1 Potting Resin Product Availability : China, EMEA, ASIA, ANZPAC, AMERICAS Product Type Features Material System : Two-Component Polyurethane
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: , China, AMERICAS, EMEA, ASIA Product Type Features Component Design : Crosslinking Material System : Two-Part Polyurethane Potting Resin Product Type : Casting Material Potting Resin
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: : Crosslinking Material System : Two-Part Polyurethane Potting Resin Product Type : Casting Material Potting Resin Technology : Resin Self-Repairing : No Usage Conditions Environmental Resistance : Hydrolysis Stable, Water-Repellent Flammability : Non-Flame-Retardant
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONATHANE® UF-3 is a unique polyurethane foam characterized by low vapor pressure. UF-3 is unaffected by grease, oils, and most solvents. Also, it is ozone resistant, has excellent insulation characteristics, is dimensionally stable and will not rot or mildew.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Encapsulants and Potting Compounds - Techsil® PU23930 Pearl Polyurethane Twinpack 250gm -- TEEP14087Supplier: Techsil Limited
Description: Techsil® PU23930 is a two-part, flexible, room temperature curing polyurethane resin designed for the potting and encapsulation of LED arrays and lighting equipment. Product Features Excellent long term UV stability Scratch and mark resistant Non-toxic High mechanical strength Easy to
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: DigiKey
Description: BLACK RIGID POLYURETHANE POTTING
- Form / Function: Encapsulant / Potting Compound
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Supplier: Protavic America, Inc.
Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators,
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Dielectric Strength: 0.0165 kV/in
- Elongation: 155 %
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil PU23955 is a two part component potting compound which cures to an opaque translucent material that is stable in UV light. Once mixed, the system reacts at room temperature to produce a tough abrasion resistant material with good hydrolysis resistance. There are many
- Compound Type: Encapsulating / Potting
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings.
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST UV 7993, Urethane, Conformal coating LOCTITE STYCAST UV 7993 is a conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Single Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 120 cP
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Supplier: Protavic America, Inc.
Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electroni c casting and encapsulating applications that require a unique
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System
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Supplier: RS Components, Ltd.
Description: Optically clear polyurethane 250g - Adhesives & Glues - Potting Compounds
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.2000 W/m-K
- Use Temperature: -40 to 248 F
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Supplier: Master Bond, Inc.
Description: such as strength, chemical resistance, and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition, EP30D10 has been used successfully in a number of different cryogenic applications. Master Bond Polymer System EP30D-10 is
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 50 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant is a two-component polyether-based system used as an encapsulating, molding, and potting compound. It is recommended for harness breakouts, watertight electrical connectors, cables, and cable end seals. It also offers
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
- Elongation: 400 %
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Supplier: GS Polymers, Inc.
Description: Two part, 1:2 cost-effective general purpose potting system
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: ELANTAS PDG, Inc.
Description: wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 30.56 to 88.89 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
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Featured Products Top
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Potting Materials for Electronic Applications ELANTAS PDG, Inc. offers a broad range of potting and encapsulation materials for electronic protection. State of the art (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS PDG, Inc. -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS PDG, Inc. -
Management With the continued miniaturization and expanding population of components that comprise electronic devices, mitigation of generated heat is an ongoing issue. CHT offers a series of silicone adhesive sealants, encapsulation and potting compounds, silicone gels, gap fillers and non (read more)
Browse Conformal Coatings Datasheets for CHT USA Inc. -
polyvinyl copolymer with stabilizers, plasticizers, cross-linking compounds and blowing agents. PVC foams offer a good combination of strength and weight with densities ranging from 4 to 30 lbs/ft?. Polyurethane Foam: PU foams are available in blocks, sheets or other shapes. They are (read more)
Browse Composites and Composite Materials Datasheets for General Plastics Manufacturing Co. -
cures upon exposure to LED light at 405 nm. It will cure rapidly and fully without any oxygen inhibition. It is a low viscosity system that may be used for small potting and encapsulation applications assuming that there are no shadows or concealed areas. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications.
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Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Casting and Potting materials with lower thermal conductivity are used for applications where thermal management is not paramount, e.g. ... The materials have a low viscosity and can be easily dosed by (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS PDG, Inc. -
“EP21AC withstood over 150 arcs without igniting and therefore was assigned the highest PLC (Performance Level Category) of 0 under the UL746A High Amp Arc Ignition test,” says Rohit Ramnath, Senior Product Engineer. “The compound is also flame retardant, as per the UL94 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion.
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Browse Encapsulants and Potting Compounds Datasheets for MacDermid Alpha Electronics Solutions -
Free flowing EP4EN-80 is suitable for bonding, small potting and encapsulations up to about a ¼ inch thick in some applications.
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Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
Conduct Research Top
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What Makes Polyurethane Potting Compound For Electronics Thick
Potting compounds are flooding the electronic assembly market, and sometimes this can make it hard for newbies to make the right choice. In case you are not aware, Polyurethane potting compounds are perfect for electronics. They are considered that way due to their incredible features.
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The Importance of Using High-Quality Polyurethane Potting Compound for Electronics
electronics is by using potting compound, a material that encapsulates electronic components to protect them from moisture, heat, and vibration. In this article, we will discuss the benefits of using high-quality polyurethane potting compound for electronics.
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Polyurethane Potting Compound for Electronics from China Polyurethane Potting Compound Manufacturers
Polyurethane encapsulating and potting compounds have many advantages, especially when a quick cure is needed at low temperatures. This solution is better compared to epoxy systems. With polyurethanes, there is better crack resistance and flexibility. There is also better adhesion to some
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How to Achieve Several Efficiencies by Using Polyurethane Potting Compound for Electronics
and vibrations. This is where electronic potting comes in. The enclosure of the miniature electronic component will have to be filled up with suitable materials to protect them from shocks, vibrations, water, high temperature, chemicals, and other external factors.
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How to Apply Polyurethane Potting Compound for Electronics: Tips and Tricks
UV-curing adhesives are a type of adhesive that cures or hardens whenever exposed to ultraviolet light. They have become increasingly popular in various industries due to their fast-curing time, high bond strength, and versatility. In harsh environments where traditional adhesives may fail,
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Polyurethane: "Customized Plastic"
PU Potting Compounds: Vacuum Processing Provides Optimum Results - Polyurethanes have an extremely wide and flexibly modifiable range of properties. This makes them a popular and frequently used group of materials in industrial production. PU potting compounds can be processed easily and feature
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New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
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SAFETY ANALYSIS OF THE EBR-II HIGH-TEMPERATURE NUCLEAR INSTRUMENT TEST FACILITY (NITF).
A polyurethane potting compound was poured on top of the shot to form a seal for argon g&s.