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  • Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
    the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative
  • Medical Device Link .
    is dispensing microdots or being used for large potting and filling applications. Also from I & J Fisnar is the PPD-119 peristaltic pump dispenser that delivers material directly from a bottle or can. This method reduces the risk of material contamination and operator contact by eliminating the need

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