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Part # Distributor Manufacturer Product Category Description
5.6 OHM 2W 5% POWER CHIP ASAP Semiconductor KOA Not Provided Not Provided
DS1231-20 POWER MONITOR CHIP 8PIN DIP National Microchip Not Provided Not Provided Not Provided

Conduct Research Top

  • Heat Sinking Relative to Alumina Chips and Aluminum Nitride Chips
    Frequently, one needs more power in a chip of a given size. The question regarding IMS chip resistors then becomes whether or not to choose aluminum nitride (ALN) chips, or alumina (Al2O3) chips in the Super RCX family. In most cases, the answer depends on whether or not the power requirement
  • Thermal Design Considerations for High-Power Single-Chip LEDs
    With advanced high-power packaging technology, large-area chips offer a number of advantages over arrays, according to Bob Karlicek, John Graff and Dave Sciabica.For general illumination, conventional LEDs are desirable for their high efficacy and color-changing capability, but low-lumen output per
  • Secure Attachment in Pulsed Power Applications
    . Figure 1 ­ Power Chip mounted on High Conductivity Heat Sing. There are however a class of applications where this approach may not be adequate. These are. low frequency cycling and pulsed power applications. In these applications the relationship. between the heating frequency and the thermal time
  • Low Power Design Using PICmicroTM Microcontrollers
    . The latch-. ing circuit uses a low-power 4000 series CMOS quad. Many techniques are used to reduce power. chip which consumes a typical of 10 µA of current. The. consumption in the PICmicro devices. The most. measured value of current consumption for the com-. commonly used methods are SLEEP Mode
  • IC Chip Inspection System
    . Communication. Bus Expansion. Remote I/O. Industrial LAN & Wireless. Inductive Power Distribution. Solutions. System Integration. Digital Signage Solutions. Medical Solutions. Security Solutions. Smart Grid & Energy. Test & Measurement. Manufacturing Automation. Download. Case Studies. Support/FAQ. Where
  • Flip Chip Bonder (Embedded)
    Software & Utilities. Communication. Bus Expansion. Remote I/O. Industrial LAN & Wireless. Inductive Power Distribution. Solutions. System Integration. Digital Signage Solutions. Medical Solutions. Security Solutions. Smart Grid & Energy. Test & Measurement. Manufacturing Automation. Download. Case Studies
  • Computer Power User Article - Under Development
    ( ) proved nanotubes could outperform silicon. In traditional silicon and metal chip technology, individual wires are subject to many resistive forces that interfere with electron movement, thus requiring more power and generating more heat. Because nanotubes are so thin, interfering forces can't bump
  • Helping chips keep their cool
    Two-phase flow cooling comes to high-power electronics. Ron Hoover and Fred Phillips Thermacore International Inc. A Div. of Modine Packing more transistors into ICs and running them faster boosts computing power but it also generates more heat. And, systems using these denser chips are being

Engineering Web Search: Power Chip Top