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  • Stack-up and the Basics of Multi-Layer Construction (.pdf)
    build the PCB to. work as designed. Circuit board material available for multi-layer construction are primarily of two types: Core material. that has copper laminated to both sides (cured laminate) and is usually 0.031 or less thick and pre-preg. material (uncured resin treated glass) is used
  • BBG Tech Tip #12: Stack-Ups & the Basics of Multi-Layer Circuit Board Construction
    are primarily of two types: Core material that has copper. laminated to both sides (cured laminate) and is usually 0.031 or less thick and pre-preg material (uncured resin. treated glass) is used to fill the spacing between cores and out-layer foils and is used to bond all layers together. Copper foil
  • PTFE Microwave Substrates For Automotive Applications
    V-0. x Hardness (Rockwell M Scale): 34. Product Offering. x 0.0100” (0.25mm). x 0.0200” (0.51 mm). x 0.0300” (0.76 mm). x 0.0600” (1.52 mm). x Cladding: 0.5, 1.0, 2.0 oz ED copper. Multilayer Constructions. Example of a four-layer PTFE/FR4 hybrid. 4 Layer (PTFE/FR-4 using FR-4 Prepreg). 0.020” 3.5
  • How PTFE Can Compete With The Best In Thermosets
    V-0. x Hardness (Rockwell M Scale): 34. Product Offering. x 0.0100” (0.25mm). x 0.0200” (0.51 mm). x 0.0300” (0.76 mm). x 0.0600” (1.52 mm). x Cladding: 0.5, 1.0, 2.0 oz ED copper. Multilayer Constructions. Example of a four-layer PTFE/FR4 hybrid. 4 Layer (PTFE/FR-4 using FR-4 Prepreg). 0.020” 3.5
  • Lighting Strike Test Results
    in that it won't unravel or have loose strands that become problematic during processing into a pre-preg material or when conducting a dry lay-up. The homogenous design also ensures uncompromised conductivity between strands when forming the material to a variety of shapes and contours and provides a smooth
  • Multilayer Lamination Methods for PTFE-Based PCBs
    . TLC-30, circular, coplanar waveguide (CPW), elliptical, microstrip, slot, ultrawideband (UWB). Read Abstract Download PDF. ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials. fastRiseTM, ATE PCBs, low loss, high frequency, mmWave applications, fiberglass free prepreg. Read Abstract
  • The Anisotropy of Dielectric Constant in TLY-5A Material
    frequency, mmWave applications, fiberglass free prepreg. Read Abstract Download Article PDF Download Presentation PDF. Effect of Laminate Properties on Passive Intermodulation Generation. Passive intermodulation (PIM), forward PIM, reverse PIM. Read Abstract Download PDF. Passive Intermodulation
  • The Impact of Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip and Stripline
    . fastRiseTM, ATE PCBs, low loss, high frequency, mmWave applications, fiberglass free prepreg. Read Abstract Download Article PDF Download Presentation PDF. Effect of Laminate Properties on Passive Intermodulation Generation. Passive intermodulation (PIM), forward PIM, reverse PIM. Read Abstract
  • Lightning Strike Protection for Carbon Fiber Aircraft
    mesh. were included, and two splicing configurations rounded. out the test coupon configurations. Several configurations. Two isolation materials were explored; E-glass and S-2 glass, having no protection were also tested to illustrate the effect. in fabric pre-preg forms, were combined

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