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  • High-Temperature Tooling Board for Advanced Composites
    The advent of higher-temperature resins and carbon-fiber composites such as Hexcel's HexTOOL (R)*, created the need for polyurethane foam that can withstand much higher process temperatures. It needed to stand up to high-heat prepreg and autoclave curing while delivering substantial cost
  • Dielectric Materials for Use in Radomes
    to eliminate dielectric framework scattering and wall insertion loss. [5]. Fabrication of such radomes generally involves layup or prepreg methods where a resin reinforced laminate material is bound to low or medium density polyurethane foam. Choice of layup or prepreg materials can vary depending

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