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  • Description: Method for Quantifying Percentage Wood Failure in Block-Shear Specimens by a Laser Scanning Profilometer Volume 2, Issue 8 (September 2005) A new method for quantifying percentage wood failure of an adhesively bonded block-shear specimen has been developed. This method incorporates a laser

  • Supplier: Micro-Epsilon

    Description: the sensors to each other and the amount of signals. In combination with highly-efficient signal processing algorithms of the analysis and visualisation software, accura- cies in the micrometer range are ensured. Robust A fully-automatic in-situ calibration ensures the measurement to be independent from

    • Technology: Non-contact - Optical / Laser
    • Measurement Capability: Defects / ADC, Thickness
    • Part Diameter / Width: 17.72 inch
    • Industrial Applications: Automotive

  • Description: products, integration of new technologies, and improved performance. 30 mm scan length Z sensor range up to 1.2 mm 140mm manual sample positioning stage Force control 0.03mg – 10mg Windows XP, Vista, and Windows 7 compatible The AlphaStep® D-100 profilometer rapidly and quantitatively

    • Technology: Contact / Stylus Based
    • Surface Metrology: 2D / Line Profile
    • Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.)
    • Vertical (Z) Range: 31.5 inch

  • Description: 0.1 degrees • Fully automatic Critical Angle Measurement acquisition and analysis software High Throughput Inline Automation • Allowable sample size: 200/300mm wafers • Automatic data acquisition and analysis of critical angles, roughness and trench measurements • Automatic tip

    • Form Factor: Monitor / Instrument
    • Mounting / Loading: Floor Mounted / Stand-alone
    • Applications: Semiconductor Wafers
    • Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness

  • Description: No Description Provided

    • Technology: Non-contact - Optical / Laser
    • Surface Metrology: 2D / Line Profile, 3D / Areal Topography
    • Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Spacing Parameters (PC, Sm), Waviness Parameters (Wa,Wt ), Hybrid Parameters, Defects / ADC, Flatness, Lay / Pattern, Step Height, Thickness, Warp / Bow, Specialty / Custom
    • Common Specific Parameters: Roughness Average (Ra), Roughness - RMS (Rq), Mean Peak to Valley Height (Rtm, Rz), Base Roughness Depth (R3Z), Maximum Peak Height (RP), Average Peak Profile Height (Rpm), Maximum Valley Depth (RV), Total Roughness Height (Rt, PV), Profile Depth (Pt), Maximum Roughness Depth (Rmax, Ry), Ten Point

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