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  • Examining purification and certification strategies for high-purity C 2 F 6 process gas
    Charles C. Allgood and Jeremy D. Blanks, As the semiconductor industry shifts to using more-complex devices and finer geometries, the need grows for higher-purity process materials and gases. While manufacturing process improvements have provided the capability to consistently produce higher-purity
  • MICRO:Extreme Silicon Part 1, by Larry W. Shive (Feb 99)
    is preferable. SPC of surface metals on silicon wafer surfaces is typically accomplished by controlling several inputs, such as bath temperature, bath concentration of major components, bath life, and feed chemical purity, as well as by monitoring one output surface metals. This control system has
  • MICRO:Analysis and Metrology (Jan '99)
    process gas purity is the partial-pressure gas analyzer (PPA), also known as a residual gas analyzer (RGA). A PPA reports the partial pressure (in torr) of almost all species present in the gas being sampled and the atomic masses of the detected species. Species identification is then usually
  • Using emission spectroscopy to perform impurity analyses in UHP gases
    ) in the single-digit parts-per-billion range for a number of impurities. As a result, these instruments have applications in the control of the ultra-high-purity (UHP) process gases used in the semiconductor industry. In addition to monitoring the purity of delivered gases, they can be used for point
  • Evolved Gas Analysis
    . This. information is then used to assess the. purity and stability of the material and its. suitability for use. The TGA gives a. quantitative measure of mass lost from. the sample, but it does not provide. information on the nature of the products. that are lost from the sample, and this. information
  • Using VPD ICP-MS to monitor trace metals on unpatterned wafer surfaces
    results in the decomposition of the oxide into HF/H O droplets that contain the metallic contaminants, which are then distributed across the wafer's remaining hydrophobic surface. A small amount of ultra-high-purity scanning collection solution (SCS) is then used to accumulate all the droplets into one
  • Inside USP s New Pharmaceutical Ingredient Verification Program
    or certificate of analysis claims for identification, strength, purity and quality. At least three lots will be tested looking for quality consistency from batch to batch. Recertification is required every three years. In the intervening years, a document review, self audit and lab testing on selected lots take
  • Power: Pure Water and Process Analytics for Power and Steam Applications
    Our fundamental innovations in high purity water measurements since 1964 have brought significant progress into the power industry. Thornton developed the robust coaxial conductivity sensor which completely replaced the traditional fragile glass/platinum cells for process use. Thornton also

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