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Supplier: Eagle Eye Power Solutions, LLC
Description: into an existing PLC (Programmable Logger Controller). Optional 4-20 mA analog output board or dual 5 amp relays for process control are also available. Cabling is either Teflon or PVC depending on the measuring sample. The SG-100M is easy to use and versatile. Simply submerge the measuring probe up to 500m
- Instrument Type: Density Instruments, Hydrometer
- Pressure Range: 0.0 to 73.48 psi
- Temperature Range: -40 to 220 F
- Density Range: 0.5500 to 2 g/cm³
Supplier: Sandvik Coromant Co.
Description: coating. Benefits Reliability and process security Predictable tool life Excellent repeatability An industry accredited product with high quality reconditioning service Features Unique geometry for ISO S giving secure chip control Fine-grain substrate and thin PVD coating deli
- Product: Individual Drill
- Size Units: English / Fractional, Metric
- Cutting Diameter: 0.1180 to 0.6300 inch
- Drill Type: Standard / Twist Drill
Supplier: Hitachi Metals America, Ltd.
Description: With industry-leading flow control technology, Aera PI-980 Series pressure- insensitive MFCs (mass flow controllers) anticipate the increasing demands of next-generation semiconductor manufacturing processes, including etch, CVD, PVD, and diffusion. This innovative technology platform provides
- Process Media Type: Gas
- Media Temperature Range: 41 to 140 F
- Gas Volumetric Flow Rate: 1.8 to 3.53 SCFM
- Operating Pressure: 100 psi
Supplier: Oerlikon Leybold Vacuum USA Inc.
Description: The UNIVEX multi-purpose experimentation systems were developed by LEYBOLD for applications in research and development, as well as for setting up pilot production systems. The range of applications for these systems covers primarily vacuum coating as well as experiments in vacuum process
- Coating System Type: Batch System (Single Chamber / Multiple Wafers), Factory / Free Standing
- Technology / Process: Physical Vapor Deposition (PVD), Plasma Etching / Cleaning, Rapid Thermal Processing (RTP), Vacuum Annealing, Combined / Multiple Processes, Other
- PVD Processes: Evaporation - Electron Beam, Evaporation - Resistance, Sputtering - DC, Sputtering - RF
- Materials Processed (Deposit or Substrate): Metal, Dielectric / Ceramic, Aluminum, Silicon, Polymer / Organic
Description: Optic Lenses Pharmaceutical PVD Sintering Vapor Recovery VIM-VAR SynSysCo brings decades experience and proven performance to your application. Is your vacuum process vaporizing off a lot of water, or have heavy by-product outgassing? If it does, then the SDS Series and GHD Series pumps
- Ultimate Operating Vacuum: 0.0800 torr
- Pumping Speed: 176 CFM
- Configuration: Individual Vacuum Pump
- Mechanical Pump Type: Rotary Screw
Supplier: IRD Glass
Description: IRD Glass is a World Class Supplier of precision glass, optical and ceramic components. For over twenty five years, IRD Glass has served the aerospace, defense, sensor, machine vision, laser, technical glass, optical, process control and medical industries (to name just a few). Their clients
- Thin Film Processes: Physical Vapor Deposition (PVD)
- Material / Substrate Capabilities: Ceramic, Glass
- Functional / Performance: Antireflective, Reflective
- Industry: OEM / Industrial
Supplier: StellarNet, Inc.
Description: as anti-reflection coatings can all be measures with StellarNet Thin Film Measurement systems. Semiconductors StellarNet systems can measure thickness of non-metallic semiconductor process films. Also, StellarNet Thin Film Measurement systems can be used to locate and identify the cause of failure in integrated
- Form Factor: Monitor / Instrument
- Applications: Semiconductor Wafers, CVD / PVD Films, Polishing / CMP, Polymers / Photoresists, Other
- Measurement Capability: Thickness - Film / Layer, Thickness - Wafer / Disc (TTV)
- Technology: Reflectometer
Supplier: MKS Instruments, Inc.
Description: (PVD)processes. Process reliability and performance are provided by a variety ofoutput regulation modes, user-adjustable settings and control options.Various impedance ranges are possible. MKS Optima® DC generators meetthe demanding power requirements for a variety of thin filmapplications
- Technology: Linear
- Style / Mounting: Enclosed, Rack Mount
- Output Power: 6.7 HP
- Line Regulation: 10 %
Supplier: KLA-Tencor Corporation
Description: The Aleris 8350 is a high-performance film metrology tool that meets the tighter process tolerances required for thickness, refractive index and stress measurements on critical films. The Aleris 8350 film metrology tool is used for advanced film development, characterization and process control
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: CVD / PVD Films
- Measurement Capability: Composition, Thickness - Film / Layer, Other
- Technology: Reflectometer
Supplier: MKS Instruments, Inc.
Description: in more sophisticated pressure control environments, making itespecially attractive to OEM equipment manufacturers. The Series 903 is suitable for industrial, process, andanalytical applications such as high energy physics, laser production,ion implantation, mass spectrometry, or PVD.
- Working Pressure Range: 5.80E-12 to 9.67E-5 psi
- Device Category: Sensor, Transducer
- Pressure Reading: Gauge, Vacuum
- Sensor Technology: Other
Supplier: Tethis S.r.l.
Description: FlameBeam is the Tethis' system for the deposition on nanostructured thin films assembled by nanoparticles produced with the flame spray pyrolysis process. Deposition system is structured in three main stages: the feeding/control stage, the FlameBeam Source (FBS) and the deposition chamber
- Coating System Type: Batch System (Single Chamber / Multiple Wafers), Laboratory / Benchtop
- Technology / Process: Physical Vapor Deposition (PVD)
- CVD Processes: Other
- Applications & Materials Processed: Photovoltaic / Solar, Medical, Nanomaterials, Other
Supplier: Invotec Solutions Ltd.
Description: 'Whirling Technology' with Siemens control. We produce optimized wear and corrosion resistant high performance screws in diameters between 14 mm to 200 mm and in lengths up to 6 m. CAD/CAM applications in the design of our plasticizing units. The screw flights can be armoured with high grade
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Featured Products for PVD Process Control Top
Molybdenum Sputtering Targets
the materials must meet the highest quality criteria. You can rely on our molybdenum sputtering targets: There's none cleaner. No targets are cleaner than ours. The most important benefits: your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Because: Metallic and gaseous impurities in the sputtering target are reproduced almost 1:1 in the sputtered functional layer and result in particle formation during the PVD process (arcing... (read more)
Browse Thin Film Materials Datasheets for PLANSEE SE
Ultrasonic Lead Soldering & Bus Bars
than using a more costly multi-step conventional etch and print process. . Abrisa Technologies ’ vertical integration of processes from glass fabrication, thin film PVD optical coating, through to bus bar/wire soldering helps to reduce the occurrence of material handling damage and reduce logistical costs all while delivering a complete, performance guaranteed turnkey display solution. . Abrisa Technologies specializes in both standard and custom optimized index-matched indium... (read more)
Browse Display Filters and Films Datasheets for Abrisa Technologies
H.C. Starck Inc. - Fabricated Products Group
Semiconductor Materials for Thermal Management
by optimizing our current products or developing new products in a timely manner. Additional products under development provide enhanced thermal conductivity along the z-axis (through-thickness) and the unique capability to tailor excessive heat dissipation along localized hot spots, using a special, patent pending process developed by H.C. Starck. Many technology advancements in recent years require materials with characteristics that are not attainable as a monolithic system. In response, H.C. Starck... (read more)
Browse Semiconducting Materials Datasheets for H.C. Starck Inc. - Fabricated Products Group
Conduct Research Top
Options for Semiconductor Process Tool Temperature Control (.pdf)
and electricity. Thus, the supply pressure at the. While chillers are typically the. Tool Requirements. chiller or heat exchanger typically. recommended choice for process. The PVD tool features two. has to be higher than 65 psi(g). cooling applications, they may not. identical left and right halves. Each
HPR30 Series Orifice Sampling Process Gas Analysers (.pdf)
Grease: Silicone based vacuum grease used for ‘O’. ring lubricant have similar characteristic peaks as pump oils. RGA Spectrum of IPA. www.HidenAnalytical.com. TiN Deposition: A Wafer Cycle Profile. • TiN Process Endura PVD. • Reagent Gas Levels Monitored. • 8mTorr process pressure. • Ultrapure Ti
A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly (.pdf)
deposition (PVD) process, and the target assembly's ability to withstand this stress has a large effect on the resulting deposition rates, yields, and film properties. One of the major sources of stress is the coefficient of thermal expansion (CTE) mismatch between metal targets in semiconductor processes
MICRO: Taking Control
A control system attached to a PVD tool can be used to customize recipes during process development, perform process monitoring to detect misprocessed wafers, and optimize PM cycles. he increasing demand for fewer defects, higher throughput, and cost reductions in semiconductor processing has
Medical Device Link .
manufactures the system with high- and low-RF generators, computer and manual control systems, process temperature control, multiple gas flows, mass-gas-flow controllers, and automated vacuum chamber doors. Plasma Etch Inc., 3522 Arrowhead Dr., Carson City, NV 89706. Plasma treatment system A plasma
Time-Resolved Ionisation Studies of the High Power Impulse Magnetron Discharge in Mixed Argon and Nitrogen Atmosphere (.pdf)
High power impulse magnetron sputtering (HIPIMS) is a new method for physical vapour deposition (PVD) based on magnetron sputtering. It utilises transient impulse (short pulse) glow discharges with very high power and current density (up to 3 kWcm-2 and 4 Acm-2 respectively at a duty cycle of <5%
MICRO: Controlling particles in sputter deposition modules
Focusing on external and internal sources of contaminants has led to continuing improvements in the particle performance of PVD tools. As IC geometries continue to shrink because of market demands for high-speed products, control of process-related particles that can cause catastrophic device
MICRO:Rosenberg (March 2001)
. Equally important, in the face of an inexorable trend toward smaller geometries, is the need to reduce and control process-generated particles that can cause product defects. The industry has focused on particles generated by physical vapor deposition (PVD) refractory metal processes involving titanium
More Information on: PVD Process Control Top
Program and Abstracts: DOE Solar Program Review Meeting 2004, 25--28 October 2004, Denver, Colorado
Enhanced CIS Production Using XRF for PVD Process Control Dale Tarrant et al. ...................................................................................................................65 P036 .
PV Manufacturing R&D -- Integrated CIS Thin-Film Manufacturing Infrastructure: Final Technical Report, 2 August 2002--30 April 2004
A no cost increase extension through October 31, 2004 was granted to present a paper, serving as a Final Review, titled "Enhanced CIS Production Using XRF for PVD Process Control " at the Solar Energy Technologies Program Review Meeting, October 25-28...
Group velocity delay spectroscopy technique for industrial monitoring of electron beam induced vapors
It will be shown that while both methods have a place in the industrial process control of EB-PVD applications, the group velocity delay (GVDS) method shows promise as a more widely adaptable EB- PVD process control sensor.
Test and Demonstration Assets of New Mexico
The staff also can provide modeling of plasma/material interactions, particle transport in physical vapor deposition plumes and assist in the development of new PVD process control techniques.
Thermal barrier coatings for industrial gas turbine applications: An industrial note
The advances in EB- PVD processing controls and parts manipulation could facilitate the uniform deposition of TBCs on curved airfoils and between adjacent and partially overlapping airfoils.
SBIR Phase II: Fiber-Optic Magnetic-Field Sensor System Employing Highly-Efficient Photonic Signal Processing
Improving PVD industrial process control , will yield higher sensitivity and reliability.
BPSG boron spike generation investigated by chamber pressure monitoring
He currently belongs to the volume engineering division of Aizu factory of Spansion Japan and is in charge of CVD/ PVD film process control on 130 and 110 nm products on 200mm wafer process. .
Since the hardware temperature is important to the quality of the TBCs being manufactured, an understanding of this heat transfer is vital to properly controlling the PVD process .