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Supplier: MKS Instruments, Inc.
Description: (PVD)processes. Process reliability and performance are provided by a variety ofoutput regulation modes, user-adjustable settings and control options.Various impedance ranges are possible. MKS Optima® DC generators meetthe demanding power requirements for a variety of thin filmapplications
- Device Type: Other
- Power Supply Technology: Linear
- Style: Enclosed, Rack Mount
- Phase: Three-Phase
Supplier: IRD Glass
Description: IRD Glass is a World Class Supplier of precision glass, optical and ceramic components. For over twenty five years, IRD Glass has served the aerospace, defense, sensor, machine vision, laser, technical glass, optical, process control and medical industries (to name just a few). Their clients
- Thin Film Processes: Physical Vapor Deposition (PVD)
- Material / Substrate Capabilities: Ceramic, Glass
- Functional / Performance: Antireflective, Reflective
- Industry: OEM / Industrial
Supplier: Tethis S.r.l.
Description: FlameBeam is the Tethis' system for the deposition on nanostructured thin films assembled by nanoparticles produced with the flame spray pyrolysis process. Deposition system is structured in three main stages: the feeding/control stage, the FlameBeam Source (FBS) and the deposition chamber
- Coating System Type: Batch System (Single Chamber / Multiple Wafers), Laboratory / Benchtop
- Technology / Process: Physical Vapor Deposition (PVD)
- CVD Processes: Other
- Applications & Materials Processed: Photovoltaic / Solar, Medical, Nanomaterials, Other
Supplier: Oerlikon Leybold Vacuum USA Inc.
Description: The UNIVEX multi-purpose experimentation systems were developed by LEYBOLD for applications in research and development, as well as for setting up pilot production systems. The range of applications for these systems covers primarily vacuum coating as well as experiments in vacuum process
- Coating System Type: Batch System (Single Chamber / Multiple Wafers), Factory / Free Standing
- Technology / Process: Physical Vapor Deposition (PVD), Plasma Etching / Cleaning, Rapid Thermal Processing (RTP), Vacuum Annealing, Combined / Multiple Processes, Other
- PVD Processes: Evaporation - Electron Beam, Evaporation - Resistance, Sputtering - DC, Sputtering - RF
- Materials Processed (Deposit or Substrate): Metal, Dielectric / Ceramic, Aluminum, Silicon, Polymer / Organic
Description: Sitron's versatile and intelligent line of Thermal Dispersion Flow Switches are compact switches and transmitters, with no moving parts, that can monitor and control the flow of liquid and gas in pipes and ducts. They can also be used for single point level detection for liquids. Sitron's series
- Process Media Type: Gas, Liquid, Steam
- Mounting Type: Insertion Type
- End Fittings: Clamp, Flanged, Threaded
- Electrical Output: Switch
Supplier: Dynisco Plastics
Description: Dynisco's PT4625 Series of amplified transmitters convert process measurement signals into an amplified signal for long distance transmission free of noise interference. Many of the features found in Dynisco's standard PT462E Series have been incorporated into the amplified PT4625 Series, including
- Device Category: Transducer
- Pressure Reading: Gauge
- Sensor Technology: Strain Gauge
- Media: Gas
Vacuum Pumps and Vacuum Generators - Chemical-Resistant Dry Vacuum Pumping System - 1.5 mbar -- PC 620 NTSupplier: VACUUBRAND, Inc.
Description: The PC 620 chemistry vacuum pumping unit is an economic space-saving solution for simultaneous operation of two independent vacuum applications with one single pump. Each vacuum port is equipped with a vacuum controller CVC 3000 with a solenoid valve for electronic vacuum control. The basic pump
- Applications: General Purpose / Industrial, Analytical / Scientific, Chemical / Corrosive Gas, Medical / Laboratory, Pharmaceutical / Sanitary
- Pump Type / Technology: Diaphragm
- Configuration: Individual Vacuum Pump, Vacuum Pump System / Station
- Lubrication: Dry / Oil-less
Supplier: FLEXIM AMERICAS Corp.
Description: into the pipe or process interruption is required for installation. With an IP65 / NEMA 4X housing in a robust watertight transport case, it is the perfect ultrasonic clamp-on flowmeter for mobile measurement campaigns, such as service works or even the temporary replacement of stationary meters
- Application: General Purpose
- Mounting Type: Non-Invasive
- End Fittings: Clamp
- Process Media Type: Gas
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Featured Products for PVD Process Control Top
Molybdenum Sputtering Targets
the materials must meet the highest quality criteria. You can rely on our molybdenum sputtering targets: There's none cleaner. No targets are cleaner than ours. The most important benefits: your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Because: Metallic and gaseous impurities in the sputtering target are reproduced almost 1:1 in the sputtered functional layer and result in particle formation during the PVD process (arcing... (read more)
Browse Thin Film Materials Datasheets for PLANSEE SE
Sulzer:Thin Film Equipment for In-House Coating
development for core areas such as: Power supply, pulse technology, evaporator technology,control technology and software. Individual instruction and training courses. Extensive technical service: Advice,Technology Centre/R &D, after-sales. Technology used in own coating centres. All market relevant PVD/PACVD technologies available, also in combination with nitriding. Engineering of cutting-edge PVD/PACVD technologies. For more information, please click here. (read more)
Browse Thin Film Coating Services Datasheets for Sulzer Metco
Conduct Research Top
Options for Semiconductor Process Tool Temperature Control (.pdf)
and electricity. Thus, the supply pressure at the. While chillers are typically the. Tool Requirements. chiller or heat exchanger typically. recommended choice for process. The PVD tool features two. has to be higher than 65 psi(g). cooling applications, they may not. identical left and right halves. Each
HPR30 Series Orifice Sampling Process Gas Analysers (.pdf)
Grease: Silicone based vacuum grease used for ‘O’. ring lubricant have similar characteristic peaks as pump oils. RGA Spectrum of IPA. www.HidenAnalytical.com. TiN Deposition: A Wafer Cycle Profile. • TiN Process Endura PVD. • Reagent Gas Levels Monitored. • 8mTorr process pressure. • Ultrapure Ti
A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly (.pdf)
deposition (PVD) process, and the target assembly's ability to withstand this stress has a large effect on the resulting deposition rates, yields, and film properties. One of the major sources of stress is the coefficient of thermal expansion (CTE) mismatch between metal targets in semiconductor processes
MICRO: Taking Control
A control system attached to a PVD tool can be used to customize recipes during process development, perform process monitoring to detect misprocessed wafers, and optimize PM cycles. he increasing demand for fewer defects, higher throughput, and cost reductions in semiconductor processing has
Medical Device Link .
manufactures the system with high- and low-RF generators, computer and manual control systems, process temperature control, multiple gas flows, mass-gas-flow controllers, and automated vacuum chamber doors. Plasma Etch Inc., 3522 Arrowhead Dr., Carson City, NV 89706. Plasma treatment system A plasma
Time-Resolved Ionisation Studies of the High Power Impulse Magnetron Discharge in Mixed Argon and Nitrogen Atmosphere (.pdf)
High power impulse magnetron sputtering (HIPIMS) is a new method for physical vapour deposition (PVD) based on magnetron sputtering. It utilises transient impulse (short pulse) glow discharges with very high power and current density (up to 3 kWcm-2 and 4 Acm-2 respectively at a duty cycle of <5%
MICRO: Controlling particles in sputter deposition modules
Focusing on external and internal sources of contaminants has led to continuing improvements in the particle performance of PVD tools. As IC geometries continue to shrink because of market demands for high-speed products, control of process-related particles that can cause catastrophic device
MICRO:Rosenberg (March 2001)
. Equally important, in the face of an inexorable trend toward smaller geometries, is the need to reduce and control process-generated particles that can cause product defects. The industry has focused on particles generated by physical vapor deposition (PVD) refractory metal processes involving titanium
Engineering Web Search: PVD Process Control Top
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Gas & Vapor Delivery Control Systems MBE Technologies
Physical vapor deposition - Wikipedia, the free encyclopedia
â?¢ PVD coatings are sometimes harder and more corrosion resistant than coatings applied by the electroplating process.
Microelectromechanical systems - Wikipedia, the free...
[edit Physical vapor deposition (PVD) Physical vapor deposition consists of a process in 188.8.131.52 Physical vapor deposition (PVD)
PVD Sputtering Equipment with AJA International, Inc.
Computer control is standard and auto-loading is optional.
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PROCESS ZONES RESOURCES Research/White Papers
Next Generation Regulatory Controller for Chemical Processes
results of the first phase (namely: the actual development of a 4-mode control scheme; and the development of easy-to-apply tuning rules) and
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