Sites:
Search Electronics:
 
Page: 1 2 3 Next

Parts by Number for QFN Package Top

Part # Distributor Manufacturer Product Category Description
MCP4432 Microchip Technology, Inc. Microchip Technology, Inc. Not Provided Specified 1.8V to 5.5V - Device Operation. Wide Bandwidth (-3 dB) Operation – 2 MHz typical for 5.0 kohm Device. Extended Temperature Range (-40 °C to +125 °C). Package Types: 4x4 QFN-20, TSSOP-20...
ENC424J600 Microchip Technology, Inc. Microchip Technology, Inc. Not Provided :44-Pin (TQFP and QFN)...
ENC28J60 Microchip Technology, Inc. Microchip Technology, Inc. Not Provided Broadcast, specific packet match or any packetPackaging:- SOIC- SPDIP- SSOP- QFN (6x6 mm)...
PIC16F88-I/ML Allied Electronics, Inc. MICROCHIP TECHNOLOGY INC Not Provided 28-Pin, 7 KB Flash, 368 RAM, 16 I/O, QFN Package
TRF3750IRGP PLC Radwell Texas Instruments Semi Not Provided PLL/FREQUENCY SYNTHESIZER ; PACKAGE/CASE:20-QFN; N
More >>

Conduct Research Top

  • Thermal Pad Design and Process for Voiding Control at QFN Assembly (.pdf)
    Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O
  • Voiding Control for QFN Assembly
    Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O
  • Kelvin Testing
    package is shown in Fig. 2. Microsoft Word - Updated Kelvintest.doc Tel: (800) 404-0204. www.ironwoodelectronics.com. Kelvin Testing Using a GHz socket for MLF/QFN packages. A measurement method called Kelvin probing for measuring resistance allows very accurate. measurement of milliohm
  • Advantages of using LCP based pre-molded leadframe packages for RF & MEMS applications
    plastic ACP packages, such. as QFN, utilizing a range of LCP materials. This presentation will look at some of the stages of the development of MEMS packages, already engineered to. suit robust, high-volume applications. It will detail some of the necessary test processes now required to qualify
  • Designing Ultra Low Noise Amplifiers for Infrastructure Receiver Applications
    ) pHEMT. The SKY67101-396LF, covering 0.7-1.0 GHz, and the SKY67100-396LF, covering 1.7-2.0 GHz, are appropriate for application in GSM, WCDMA, TDSCDMA, and LTE infrastructure receiver chains. For low cost and efficient use of PCB space, the LNAs are housed in a 2 x 2 mm QFN package and share a common
  • Broadcast FM Radio Tuner for Portable Applications
    measurement. Programmable de-emphasis (50/75 µs). Adaptive noise suppression. Volume control. Line-level analog output. 32.768 kHz reference clock. 2-wire and 3-wire control interface. 2.7 to 5.5 V supply voltage. Integrated LDO regulator allows direct connection to battery. 3 x 3 mm 20-pin QFN package
  • How to Reduce Voiding in Components with Large Pads
    voiding because the contacts are. Wisdom Qu, Assistant Technical Manager,. bottom, improves heat transfer out of the. two to three times larger than BGA balls. Eastern China, Indium Corporation. Wisdom provides technical support. chip. QFNs have been increasingly used. Moreover, for LGA and QFN packages
  • Medical Device Link .
    less than 0.3 V. "Before the TPS61200, there was not a dc/dc convertor on the market that could support the low input voltages needed to convert power from a single solar cell or micro fuel cell, " McKinney says. Housed in a 10-pin 3 x 3-mm QFN package, the TPS61200 is suitable for a variety

More Information on: QFN Package Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire