Quality Defect Report

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• MICROFacility Report (March 2001)
  24-hour-a-day production cycle will not have a negative effect on productivity and quality has led it to implement certain procedures, according to Kaeppeler. For example, almost all of the fab's bays perform a mix of lithography and etch processes. That's not the case in every fab, he stresses...
• The Effect of Process Characteristics on Metal Fill and Defect Formation in Aluminum Lost Foam castings
  . InfraMation 2006 Proceedings. ITC 115 A 2006-05-22. This study was designed to examine the effects of a variety of process parameters on metal fill and casting. quality. Our overall goal is to acquire a system performance view of defect formation in the aluminum lost. foam-casting process...
• Special Report
  up the critical loads in case of a hit on the electrical grids. Cypress organizes its teams by process, Vilchuck says, with a major initiative on defect reduction. "I'd have to say we're somewhat outside of the norm, especially this facility. We've reinvented layouts, changed our tool sets numerous...
• Materials Could Make For Super LEDs, Solar Cells, Computer Chips
  with presentation at the COLUMBUS, Ohio - Engineers at Ohio State University have overcome a major barrier in the manufacture of high quality light emitting devices and solar cell materials. , and his colleagues have created special hybrid materials that are virtually defect-free -- an important first...
• MICRO: Tech Emergent
  flatness-monitoring tools that report errors when topographical distortions are encountered.4 To establish a correlation between frontside lithography focus spots and flatness- monitoring-tool errors caused by backside wafer defects, defect scans were performed on wafers with lithography focus spots. Figure...
• INDUSTRY NEWS
  and device yield. The program's emphasis is on chemicals used in SC-1 cleaning and their effect on the quality of gate oxides down to 5 nm. As part of the extended program, Ashland and IMEC will develop new products and look into chemical requirements for HF and IPA vapor drying. One hundred and five...
• Implementing a yield management program to improve die yield
  included not only decreasing the defect densities of existing technologies within 6 months and bringing the foundry's die yield to a worldwide level based on an entitlement database, but also setting a yield improvement infrastructure in place for all future technologies. The following sections outline...
• MICRO: Liquid Lithography
  Liquid lithography technology waits for defect data to surface What's the only thing that can slow down the fastest technological development the semiconductor industry has seen in the past 20 years? "Defect sources are really the key thing here," asserts Andrew Grenville. "Everybody's concerned...
• MICRO: Tool/Fab Automation
  Ron Bruns and Dave Zuck, QuantumClean; and A study begins to address the issues involved in quantifying tool-part cleanliness, which has not kept pace with process material purity. rom the day the first semiconductor device was manufactured, increasingly stringent defect reduction goals...
• Static and Static Controls in Printing (.pdf)
  are used. In this case, the ink fans out from the impression. in the form of tiny feathers or crows feet. This is of course a major quality defect. The problem is more common. in the gravure field, but it also occurs in letter press printing. Another problem on gravure presses is the fire or. explosion...

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