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Parts by Number

Part # Distributor Manufacturer Product Category Description
RCA ASAP Semiconductor RCA Not Provided Not Provided
RCA ASAP Semiconductor OSEL Not Provided Not Provided
RCA3055 ASAP Semiconductor HARRYS Not Provided TO-220
RCA6 ASAP Semiconductor RAYTHEON AIRCRAFT Not Provided Not Provided
RCA32 ASAP Semiconductor RCA Not Provided Not Provided
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Conduct Research the process chemical most commonly used in wet cleaning systems, the most prevalent cleaning method, the hydrogen peroxide based RCA standard clean, will continue to be the state of the art. While there is much information about the impact of cationic impurities on yield, little is known about the effect... the cleaning sequence. The fact that the RCA cleaning sequence, improved with the introduction of megasonics and dilute chemistry, is still in use in front-end processing after 30 years implies that it adheres to these cleaning parameters. The peroxide-based RCA technique uses two standard clean...

...and surface haze from silicon wafer substrates. The experiments were conducted at M/A-Com (Burlington, MA), which manufactures radio-frequency (RF) microwave devices using silicon and gallium arsenide processes. The chemistry in question was ultradilute RCA-SC-1 followed by RCA-SC-2...

...and contractions at industrial R &D organizations such as Bell Labs and RCA Laboratories have left more research to universities, which have less expertise in commercializing generally usable ideas. Rick Hazard, president...

To lower chemical consumption and disposal costs as well as to improve cleaning efficiency, ozone has been studied during the past decade as an alternative to traditional sulfuric acid -peroxide and RCA cleans using basic (SC-1) and acidic (SC-2) hydrogen peroxide mixtures. It is effective because...

...for chemicals used in such critical cleaning operations as the RCA process and processes using solutions of hydrofluoric acid. Metallic impurities can adversely affect oxide integrity, reduce minority carrier lifetimes, provide nucleation sites for stacking faults during film growth, and cause surface...

...are preferable for cost and environmental reasons. Seeking a cost-efficient and ecologically sound cleaning method, scientists at RCA in the 1970s thought that by adding the physical action of ultrasound waves to a cleaning solution, they could reduce...

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