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Cleaning Agents and Surface Treatments - Techspray Techspray Renew Eco-Oven Cleaner - 5 gal - 1 Per Case -- 1573-5GSupplier: R. S. Hughes Company, Inc.
Description: Techspray Techspray Renew Eco-Oven Cleaner - 5 gal - 1 Per Case. Used for periodic preventative maintenance to keep equipment running at top performance levels. Cleans reflow ovens, wave soldering systems, and associated heat exchanger systems by removing all types of flux residues (e.g. waterbased
- Type: Cleaner / Cleaning Agent
- Industry Applications: Electrical / Electronics
Supplier: Linx Technologies
Description: CHP Series Ceramic Chip Antennas Embedded Quarter-Wave Chips The tiny CHP Series is available at 868MHz, 916MHz or 2.45GHz. Its small size and surface-mount package make it easy to hide inside a product case. Ceramic construction lets the antenna withstand reflow oven temperatures up to 260°C
- Applications: Telemetry / Surveillance, Other
- Pattern Type: Omnidirectional
- Polarization Type: Linear
- Primary Frequency Range: 8.68E8 Hz
Supplier: Linx Technologies
Description: small size and surface-mount package make it easy to hide inside a product case. Ceramic construction lets the antenna withstand reflow oven temperatures up to 260°C. Kit Includes 1 fully assembled evaluation board 6 CHP Series antennas CHP Series documentation
- Category: Development Suite / Kit
- Function: Break Out Board
- Supported System: Wireless Systems
- Ports: Wireless
Filler Alloys and Consumables - Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding -- 8799566659585Supplier: Henkel Corporation - Electronics
Description: MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent solderability over a wide
Supplier: Henkel Corporation - Electronics
Description: HYSOL E1159 is designed for high volume assembly operations that require and underfill that flows fast at room temperature and fully cures in one reflow oven cycle. It is specifically formulated to allow easy rework of components post underfill curing operations.
- Form / Function: Gap Filling Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
Electronic Design Automation (EDA) and Electronic Computer-aided Design Software (ECAD) - FloTHERM® PCB Thermal Design ProgramSupplier: Mentor Graphics Corporation
Description: . There are options available for: Card Slots Natural Convection Forced Convection Conduction Cooled Solder Reflow Ovens For more advanced scenarios, pre-solved FloTHERM analyses can be imported to form a complex, 3D description of the surrounding air flow and temperature fields. Solving
Supplier: RiverSide Electronics, Ltd.
Description: wave solder equipment and convection ovens for solder reflow, we are able to simulate an actual production build to the greatest extent possible during the prototype stage. This means that RiverSide and the Customer are able to better manage initial circuit board builds. Quick-turn Option Hand
- Capabilities: Electronic Manufacturing, Electrical and Electromechanical Assembly
- Services: Design / Development, Testing / Inspection, Other
- Industry Served: Electronics / Semiconductors, Other
- Location: North America, United States Only, Midwest US Only
Supplier: OMEGA Engineering, Inc.
Description: machinery, HVAC and R, kilns, packaging equipment, sorting equipment, wave solder and reflow systems, lighting systems, pump controls, incubators, motor-switching, and UPS systems.
- Solid State Relay Type: Optically Isolated Relay
- Application Type: General Application Relay
- Mounting: DIN Rail, Panel
- Input Voltage Type: AC, DC
Description: Here at DEK, our extensive experience in the field of Process Improvement Products means that we continue to develop, manufacture and supply a wide range of speciality cleaning products. Choose from: DEK Reflow Oven Cleaner High performance mix of water, alkaloids and long-chain alcohols removes
Supplier: Allied Electronics, Inc.
Description: ECO-OVEN™ Cleaner Cleans reflow ovens, wave soldering systems, and associated heat exchanger systems by removing all types of flux residues (e.g. water-based, RMA, no-clean, lead-free). Used for periodic preventative maintenance to keep equipment performing at peak levels. It is fast acting
- Type: Cleaner / Cleaning Agent
Supplier: KLA-Tencor Corporation
Description: SensArray Process Probe 1630 instrumented wafers enable precise in-situ characterization of wafer temperature profiles in both front-end atmospheric and belt CVD systems, and in back-end wafer solder bumping reflow ovens. Utilizing the patented ThermaBond technique, the embedded thermocouple bond
- Form Factor: Wafer Probing System
- Applications: Semiconductor Wafers, CVD / PVD Films, Etching - Plasma / Wet
- Measurement Capability: Other
- Technology: Other
Description: cost-effective alternate products STACI’s production facilities and those of its partners are well equipped, featuring advanced production equipment including: SMT equipment from Siemens, Sanyo, Juki, I.Pulse and Fuji Reflow Ovens from Heller, Tamura and Sanyo Chip on Board (COB
- Testing Services: Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Chip On Board, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn
- Material Acquisition: Customer Supplied, Vendor Supplied
Supplier: Caladena Group
Description: packages & ultra fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow oven, Electrovert Wave Solder machines; X-ray inspection unit & AOI unit. Through hole assembly capabilities include axial insertion, radial
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services
- Testing Services: Functional Testing, In-circuit Testing, X-Ray Testing, Other
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly, Other
- Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling
Supplier: Caladena Group
Description: assembly & electro-mechanical assembly. SMT capabilities include placing packages as small as 0402; BGA, SOIC, PLCC, QFP packages & ultra fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow oven, Electrovert Wave
- Services: Just-in-Time Delivery, Kitting, Low Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking
- Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
- Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Marine, Telecommunications, Other
- Location: North America, United States Only, Canada Only
Supplier: Neutronics, Inc.
Description: The Ntron Pure N2 Oxygen Analyzer offers a cost effective solution to rapid and precise oxygen measurement. Ideally suited for spot checking of solder re-flow ovens, nitrogen sources and high purity welding, an oxygen analyzer, like the Pure N2, is the only way to accurately measure low
- Instrument Type: Analyzer
- Mounting Type: Portable
- Application: Confined Space Monitoring, Process Gas
- Measurement Type: %LEL, Trace
Supplier: Yokogawa Corporation of America
Description: . ・ Oxygen concentration control in semiconductor-related diffusion and drying furnaces and in LCD manufacturing processes ・ Oxygen concentration control in solder pot flow and re-flow ovens, and glove boxes used in electronics manufacturing, and in gas production processes ・ Oxygen
- Number of Gases Sensed: Single Gas
- Measurement Type: %Volume, Trace, Leakage
- Specific Gas Types: Oxygen (O2)
- Electrical Outputs: Analog Voltage, Analog Current, Switch
Supplier: Newark / element14
Description: Flux Remover; Dispensing Method:Bottle; Volume:1gallon (US); Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Trade Name, Chemical:Oven Cleaner
- Type: Cleaner / Cleaning Agent
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RS Components, Ltd.
reflow oven process). Other output formats include DXF (import and export) and IDF for interfacing to mechanical CAD software tools. Whether you are a professional designer making money from your designs, an electronics education professional, a student or a hobbyist seeking an easy to use, professional standard, unrestricted schematic capture and PCB layout tool, then DesignSpark PCB is right for you!. DesignSpark PCB is based on community feedback and all software development, enhancements... (read more)
Browse Electronic Development Boards Datasheets for RS Components, Ltd.
Surface Coating and Treatment of PCBs
can design and manufacture a custom conformal coating machine for your application. Typical Custom Features: · Hot Air Drying System. · Single Side Coating Application. · Special Fixtures & Material Handling Equipment. · PLC Based Control System. Automated Machine with Hot Air Drying System. Automated Machine with Single Side Coating Application. Automated Machine with Hot Air Dryer & PLC Based Control System. Infrared Drying System. Infrared Reflow Oven... (read more)
Browse Dip Coaters Datasheets for Glenro Inc.
Metal-to-Plastic Insertion with Induction Heating
Summary: Induction offers fast, precise, repeatable heating, while avoiding defects such as flashing and burning. . Overview: Metal-to-plastic insertion involves heating a threaded metal insert to a temperature above the plastic reflow point and pressing it into the plastic part. The process requires fast, precise, repeatable heating. Softening of the internal threads is the result of long heating processes. Torches and ovens can present challenges when it comes to speed... (read more)
Browse Furnaces (industrial) Datasheets for Ambrell
MicroSplatch™ Antenna Breaks the Chip Barrier
The MicroSplatch ™ embedded antenna is perfect for remote controls, pagers and compact data transmission devices. It is available in the 403MHz, 418MHz, 433MHz, 868MHz, 916MHz and 2.4GHz bands. The antenna's affordable price and reflow-compatible package makes it an excellent choice for cost-sensitive applications. Benefits. Compact: fits inside remote controls, pagers and other handheld devices. Affordable: priced for cost-sensitive applications. Reflow compatible: withstands oven... (read more)
Browse Antennas Datasheets for Linx Technologies
ALPHA® SBX02 Lowers Assembly Costs
step. Through-hole components requiring low peak temperature can be soldered by Pin-in-Paste low temperature reflow, meaning that wave soldering is eliminated. This in turn leads to substantial process and energy savings. Not only is the process simplified, but the temperature of the oven is greatly reduced allowing greater cost savings. “ALPHA ® SBX02 soldering alloy used in our low temperature solder paste OM-535 can provide substantial cost savings and increased daily throughput... (read more)
Browse Solder Datasheets for Alpha
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Recommended SMD Reflow for PCA Electronics Products
PCA components have been designed and tested to withstand all typical Surface Mount Device (SMD) reflow processes using Infra Red (IR), Convection or a combination IR/Convection inline ovens. However, due to the various materials used in magnetic components, extreme care must be taken
Dispelling 10 Myths About Nitrogen Reflow (.pdf)
In my twenty years in the electronics manufacturing industry, I have heard a lot of claims made about the use of nitrogen in inerted soldering processes: many of them completely wrong. In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain
Surface Mount Technology (.pdf)
One of the key factors of reflow oven is preheating. The preheating of a component and PCB is basically the same in leaded and leadfree soldering. Preheating is the range from room temperature to the melting point of solder.
Intro to Aqueous Cleaning Equipment (.pdf)
In-line equipment is designed to continuously clean large numbers of circuit boards in a short period of time. As the name implies, the washer receives boards by conveyor, from preceding process units (e.g. reflow oven) cleans and dries them in one operation. Spray-in-air indicates
Using Economical SocketPac (R) Removable Terminal Carriers to Mount Power Converters on PCBs Speeds Assembly, Saves Energy, and Simplifies Repair (.pdf)
, conventional approaches to mounting the converters typically involve soldering them to the PCB via wave or convection oven (i.e. reflow) methods. Advanced Interconnections' SocketPac (R) Removable Terminal Carrier, a patented Peel-A-Way (R) socket configuration, overcomes all of the problems relative
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Printed Circuits Handbook, Sixth Edition > SOLDERING TECHNIQUES
Once the exclusive domain of wave soldering, some plated-through hole (PTH) components are being assembled along with surface-mount components in reflow ovens .
Reflow Oven Exporters, Reflow Oven Selling Leads
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reflow oven - offers from reflow oven manufacturers, suppliers, exporters & wholesalers
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zone reflow oven and an enhanced changeover method for SMT pick and place machines.
Numerical investigations on the effects of different cooling periods in reflow-soldering process
A unique thermal profile setting of the reflow oven is in the form of temperature versus time, a form that distrib- utes heat and thermal mass in a controlled manner accord- ing to the appropriate process time.
hot air reflow oven - offers from hot air reflow oven manufacturers, suppliers, exporters & wholesalers
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Micro-BGA package reliability and optimization of reflow soldering profile
So how to quickly adjust the reflow oven to fidfill all these heating factors in an optimal range at the same time is a puzzle.
Area Array Packaging Handbook: Manufacturing and Assembly > OVENS IN ELECTRONICS
Area array packaging manufacturing is even more dependent on ovens because solder balls are attached to ball grid arrays (BGAs) and chip scale packages (CSPs) by running the package through a reflow oven to melt the solder and thereby attach the array …