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Cleaning Agents and Surface Treatments - Techspray Techspray Renew Eco-Oven Cleaner - 5 gal - 1 Per Case -- 1573-5GSupplier: R. S. Hughes Company, Inc.
Description: Techspray Techspray Renew Eco-Oven Cleaner - 5 gal - 1 Per Case. Used for periodic preventative maintenance to keep equipment running at top performance levels. Cleans reflow ovens, wave soldering systems, and associated heat exchanger systems by removing all types of flux residues (e.g. waterbased
- Type: Cleaner / Cleaning Agent
- Industry Applications: Electrical / Electronics
Supplier: Linx Technologies
Description: CHP Series Ceramic Chip Antennas Embedded Quarter-Wave Chips The tiny CHP Series is available at 868MHz, 916MHz or 2.45GHz. Its small size and surface-mount package make it easy to hide inside a product case. Ceramic construction lets the antenna withstand reflow oven temperatures up to 260°C
Supplier: Linx Technologies
Description: small size and surface-mount package make it easy to hide inside a product case. Ceramic construction lets the antenna withstand reflow oven temperatures up to 260°C. Kit Includes 1 fully assembled evaluation board 6 CHP Series antennas CHP Series documentation
Electronic Design Automation (EDA) and Electronic Computer-aided Design Software (ECAD) - FloTHERM® PCB Thermal Design ProgramSupplier: Mentor Graphics Corporation
Description: . There are options available for: Card Slots Natural Convection Forced Convection Conduction Cooled Solder Reflow Ovens For more advanced scenarios, pre-solved FloTHERM analyses can be imported to form a complex, 3D description of the surrounding air flow and temperature fields. Solving
Supplier: Newark / element14
Description: FLUX REMOVER, SPRAY, 16FL.OZ; Dispensing Method:Spray Bottle; Volume:16fl.oz. (US); Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Trade Name, Chemical:Oven Cleaner
- Type: Cleaner / Cleaning Agent
Supplier: OMEGA Engineering, Inc.
Description: machinery, HVAC and R, kilns, packaging equipment, sorting equipment, wave solder and reflow systems, lighting systems, pump controls, incubators, motor-switching, and UPS systems.
- Solid State Relay Type: Optically Isolated Relay
- Application Type: General Application Relay
- Mounting: DIN Rail, Panel
- Input Voltage Type: AC, DC
Description: Here at DEK, our extensive experience in the field of Process Improvement Products means that we continue to develop, manufacture and supply a wide range of speciality cleaning products. Choose from: DEK Reflow Oven Cleaner High performance mix of water, alkaloids and long-chain alcohols removes
Supplier: KLA-Tencor Corporation
Description: SensArray Process Probe 1630 instrumented wafers enable precise in-situ characterization of wafer temperature profiles in both front-end atmospheric and belt CVD systems, and in back-end wafer solder bumping reflow ovens. Utilizing the patented ThermaBond technique, the embedded thermocouple bond
- Form Factor: Wafer Probing System
- Applications: Semiconductor Wafers, CVD / PVD Films, Etching - Plasma / Wet
- Measurement Capability: Other
- Technology: Other
Supplier: Captor Corporation
Description: to market. We will work with you during the early stage of design to ensure a smooth transition throughout the entire manufacturing process. Equipment List • Quad C Pick & Place • Quad QRC 532C Reflow Oven • Quad 100iS Screen Printer • PVA1000 CNC Programmable Conformal
- Supplier Capability: PCB Design / Layout
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Location: North America, United States Only, Midwest US Only
Supplier: Caladena Group
Description: packages & ultra fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow oven, Electrovert Wave Solder machines; X-ray inspection unit & AOI unit. Through hole assembly capabilities include axial insertion, radial
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services
- Testing Services: Functional Testing, In-circuit Testing, X-Ray Testing, Other
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly, Other
- Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling
Supplier: Caladena Group
Description: assembly & electro-mechanical assembly. SMT capabilities include placing packages as small as 0402; BGA, SOIC, PLCC, QFP packages & ultra fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow oven, Electrovert Wave
- Services: Just-in-Time Delivery, Kitting, Low Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking
- Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
- Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Marine, Telecommunications, Other
- Location: North America, United States Only, Canada Only
Description: cost-effective alternate products STACI’s production facilities and those of its partners are well equipped, featuring advanced production equipment including: SMT equipment from Siemens, Sanyo, Juki, I.Pulse and Fuji Reflow Ovens from Heller, Tamura and Sanyo Chip on Board (COB
- Testing Services: Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Chip On Board, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn
- Material Acquisition: Customer Supplied, Vendor Supplied
Supplier: Yokogawa Corporation of America
Description: . ・ Oxygen concentration control in semiconductor-related diffusion and drying furnaces and in LCD manufacturing processes ・ Oxygen concentration control in solder pot flow and re-flow ovens, and glove boxes used in electronics manufacturing, and in gas production processes ・ Oxygen
- Number of Gases Sensed: Single Gas
- Measurement Type: %Volume, Trace, Leakage
- Specific Gas Types: Oxygen (O2)
- Electrical Outputs: Analog Voltage, Analog Current, Switch
Supplier: Neutronics, Inc.
Description: The Ntron Pure N2 Oxygen Analyzer offers a cost effective solution to rapid and precise oxygen measurement. Ideally suited for spot checking of solder re-flow ovens, nitrogen sources and high purity welding, an oxygen analyzer, like the Pure N2, is the only way to accurately measure low
- Instrument Type: Analyzer
- Mounting Type: Portable
- Application: Confined Space Monitoring, Process Gas
- Measurement Type: %LEL, Trace
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Featured Products for Reflow Oven Top
Surface Coating and Treatment of PCBs
can design and manufacture a custom conformal coating machine for your application. Typical Custom Features: · Hot Air Drying System. · Single Side Coating Application. · Special Fixtures & Material Handling Equipment. · PLC Based Control System. Automated Machine with Hot Air Drying System. Automated Machine with Single Side Coating Application. Automated Machine with Hot Air Dryer & PLC Based Control System. Infrared Drying System. Infrared Reflow Oven... (read more)
Browse Dip Coaters Datasheets for Glenro Inc.
Metal-to-Plastic Insertion with Induction Heating
Summary: Induction offers fast, precise, repeatable heating, while avoiding defects such as flashing and burning. . Overview: Metal-to-plastic insertion involves heating a threaded metal insert to a temperature above the plastic reflow point and pressing it into the plastic part. The process requires fast, precise, repeatable heating. Softening of the internal threads is the result of long heating processes. Torches and ovens can present challenges when it comes to speed... (read more)
Browse Furnaces (industrial) Datasheets for Ambrell
Metcal / OK International, Inc.
MFX-2200 Particle and Gas Fume Filtration Systems
Setting a New Benchmark In Performance. Metcal's multi-user MFX-2200 Series Fume Extraction Systems set a new benchmark in performance, delivering a maximum airflow of 900 m3/h and a maximum suction force of 1,075Pa. Capable of providing filtration for up to eight manual assembly workstations, the MFX-2200 Series Fume Extraction Systems' power can also be harnessed to remove particulates and gases from exhaust cabinets and even small bench-top wave and reflow soldering ovens. For general... (read more)
Browse Mist Collectors and Fume Collectors Datasheets for Metcal / OK International, Inc.
Conduct Research Top
Dispelling 10 Myths About Nitrogen Reflow (.pdf)
In my twenty years in the electronics manufacturing industry, I have heard a lot of claims made about the use of nitrogen in inerted soldering processes: many of them completely wrong. In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain
Recommended SMD Reflow for PCA Electronics Products
PCA components have been designed and tested to withstand all typical Surface Mount Device (SMD) reflow processes using Infra Red (IR), Convection or a combination IR/Convection inline ovens. However, due to the various materials used in magnetic components, extreme care must be taken
Laser Reflow Soldering - A Process Solution Part I
: A Process Solution. Page 3 of 8 ©2007. Convection Oven. No. • Reflow cycle too long due to cable locating fixture requirements. Silver ink. dissolves into solder during oven reflow. Focused Hot Air. No. • Rapid, uneven heating over moderate size area. Area heated is surrounded. by unheated glass. Glass
Surface Mount Technology (.pdf)
One of the key factors of reflow oven is preheating. The preheating of a component and PCB is basically the same in leaded and leadfree soldering. Preheating is the range from room temperature to the melting point of solder. ept_H1H4.eps Surface Mount Technology (SMT). Failure Analysis
Intro to Aqueous Cleaning Equipment (.pdf)
In-line equipment is designed to continuously clean large numbers of circuit boards in a short period of time. As the name implies, the washer receives boards by conveyor, from preceding process units (e.g. reflow oven) cleans and dries them in one operation. Spray-in-air indicates
Thermal Profiling Optimizes Printed Circuit Board Assembly
to. using ‘tribal knowledge,’ experience and. problems when assemblies are thermally. microelectronics environment. intuition. The added time in the production. profiled for reflow. Layout, component. cycle reduced availability of the reflow oven. Reflow challenges include. size, package styles
Moisture Control Specifications
All SMD packed in Tape and Reel is Dry Packed. This method helps to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation from a combination of rapid moisture expansion and material mismatch. PCA Electronics, Inc. Dry
Discrete Receptacles with Organic Fibre Plug (R) Solder Barrier
board in an SMT conveyor oven. 6. Install leaded component into receptacles. 7. The component leads will push out the organic fibre plugs. OFP Application.qxp Application of Discrete Receptacles. R. with Organic Fibre Plug® Solder Barrier. ASSEMBLY SEQUENCE FOR. INTRUSIVE REFLOW. SOLDERING
More Information on: Reflow Oven Top
Printed Circuits Handbook, Sixth Edition > SOLDERING TECHNIQUES
Once the exclusive domain of wave soldering, some plated-through hole (PTH) components are being assembled along with surface-mount components in reflow ovens .
Reflow Oven, Reflow Oven Exporters, Reflow Oven Selling Leads from Reflow Oven Exporters, Manufacturers & Suppliers on EC21.com
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Test and assessment of the heating system of reflow ovens
Test and assessment of the heating system of reflow ovens .
Micro-BGA package reliability and optimization of reflow soldering profile
So how to quickly adjust the reflow oven to fidfill all these heating factors in an optimal range at the same time is a puzzle.
Conveyor Reflow Soldering, Conveyor Reflow Soldering Manufacturers, Conveyor Reflow Soldering Products from Conveyor Reflow Soldering Suppliers & Exporters on ...
Reflow Oven with Nitrogen System .
Area Array Packaging Handbook: Manufacturing and Assembly > OVENS IN ELECTRONICS
Area array packaging manufacturing is even more dependent on ovens because solder balls are attached to ball grid arrays (BGAs) and chip scale packages (CSPs) by running the package through a reflow oven to melt the solder and thereby attach the array...
On reflow soldering process and reflow profile
Wang Yuming et al.  reported their work on testing, assessment and research of the heating system of reflow ovens .
Investigation of reflow soldering under nitrogen atmosphere
The nitrogen reflow soldering equipment included the small bench-top reflow oven , plastic hose and nitrogen bottles.