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  • Advanced Flip Chip Packaging
    … c) Solder balls caught by liquid droplets; (d, e) Coating flux on the soldering substrate; (f) Align microgripper onto the solder substrate; (g) Solder balls were caught by the flux layer on the soldering substrate; (h) Reflowing solder ball to form bumps.
  • Lead-Free Electronic Solders
    This also gives a reason for the adoption of the low melting temperature alloys, i.e., Sn–Zn, Sn– Ag–Bi, and Sn–Ag–In for reflow soldering .
  • Lead-free Electronics
    105 Summary of alloy selection for reflow soldering ...
  • Solder Joint Reliability Assessment
    These industry-defined research-based problems related to solder joint reliability assessment include solder reflow cooling, temperature cycling, and mechanical fatigue of a test assembly with BGA solder joints, JEDEC board-level drop test, and shear fatigue of reflowed solder specimen.
  • Printed Circuits Handbook, Sixth Edition > SOLDERING TECHNIQUES
    The two most common of these methods are oven reflow soldering and wave soldering.
  • Nanopackaging
    Reflow soldering was performed in a programmable oven.