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  • Heating an aluminum-backed circuit board to reflow solder [IH]
    Given the significantly faster heating time, induction improves throughput in this process and is a more efficient heating method than hot plate heating...
  • Heating an aluminum-backed circuit board to reflow solder [PFS]
    Given the significantly faster heating time, induction improves throughput in this process and is a more efficient heating method than hot plate heating...
  • The Reflow Soldering Process (.pdf)
    Pulsed-Heated Hot-Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated to a temperature sufficient to cause the solder to melt, flow, and solidify, forming a permanent electro-mechanical bond between the parts and solder. Pulse heated soldering
  • Recommended Solder Profiles
    This document contains two charts: Recommended Solder Profile – Reflow (SMD Type) and Recommended Solder Profile – Wave Solder (Through Hole Type). The Recommended Solider Profile – Reflow (SMD Type) chart displays data about rising temperature zone, preheating zone, reflow zone, peak temperature
  • Solder Reflow Recommendation
    ), melting and eutectic temperatures also change, requiring modification to the solder reflow profile
  • Part Design Guidelines for Pulse Heated Reflow Soldering (.pdf)
    This report will cover the process definition and components used in the pulse heated reflow soldering process. We will look in depth at the component part design criteria necessary to achieve the optimum quality and consistency of a flex to PCB assembly, concentrating on the most popular joint
  • Solder Reflow Information
    Assembly of a surface mount device depends on many process. material and equipment parameters. Two of the most common. processes used are infrared (IR) and convection reflow. Skyworks. products come in three different termination finishes, depending. on the package.
  • Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability
    In a typical electronic assembly, many of the solder joints undergo multiple reflow cycles during the course of a complete manufacturing process from wafer bumping to the board level assembly. Effect of these reflows on the solder. joint formation and its evolution during these cycles
  • Application Note - Effect of Solder Reflow on Secure(R) Adhesive
    be used in electronic applications to bond printed circuit boards or electronic components to heat sinks and may be exposed to solder reflow processes during assembly manufacture. In this application note Secure TM 1500FG is bonded between a fiberglass reinforced multilayer epoxy laminate
  • Investigation for Use of Pin in Paste Reflow Process with Combination of Solder
    The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several advantages compared to the traditional wave soldering process. One of the primary advantages is lowering

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  • Advanced Flip Chip Packaging
    … c) Solder balls caught by liquid droplets; (d, e) Coating flux on the soldering substrate; (f) Align microgripper onto the solder substrate; (g) Solder balls were caught by the flux layer on the soldering substrate; (h) Reflowing solder ball to form bumps.
  • Lead-Free Electronic Solders
    This also gives a reason for the adoption of the low melting temperature alloys, i.e., Sn–Zn, Sn– Ag–Bi, and Sn–Ag–In for reflow soldering .
  • Lead-free Electronics
    105 Summary of alloy selection for reflow soldering ...
  • Solder Joint Reliability Assessment
    These industry-defined research-based problems related to solder joint reliability assessment include solder reflow cooling, temperature cycling, and mechanical fatigue of a test assembly with BGA solder joints, JEDEC board-level drop test, and shear fatigue of reflowed solder specimen.
  • Printed Circuits Handbook, Sixth Edition > SOLDERING TECHNIQUES
    The two most common of these methods are oven reflow soldering and wave soldering.
  • Nanopackaging
    Reflow soldering was performed in a programmable oven.