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  • The Reflow Soldering Process (.pdf)
    Pulsed-Heated Hot-Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated to a temperature sufficient to cause the solder to melt, flow, and solidify, forming a permanent electro-mechanical bond between the parts and solder. Pulse heated soldering
  • Part Design Guidelines for Pulse Heated Reflow Soldering (.pdf)
    This report will cover the process definition and components used in the pulse heated reflow soldering process. We will look in depth at the component part design criteria necessary to achieve the optimum quality and consistency of a flex to PCB assembly, concentrating on the most popular joint
  • M2032: Reflow Soldering Conditions for VCO and Synthesizer Products
    M/A Com is committed to full compliance with the RoHS (Restriction of the use of certain Hazardous Substances) and WEEE (Waste from Electrical and Electronic Equipment) directives. M/A Com began the transition to lead free back in 2001. As a result all of M/A Com's Synthesizer and VCO (MVS) products
  • Teccor Thyristor Surface Mount Soldering Recommendations (.pdf)
    economic method of soldering is a process in which all different components are soldered simultaneously, such as DO-214, Compak, TO-252 devices, capacitors, and resistors. The preferred technique for mounting microminiature components on hybrid thick- and thin-film is reflow soldering. The DO-214
  • Recommendations for Soldering Terminal Leads to MOV Varistor Discs (.pdf)
    soldering terminal leads to the disc. Where varistor discs are custom assembled and packaged, fixturing is normally employed to maintain disc and terminal alignment during solder reflow. Soldering fixtures should be of lightweight design to reduce their thermal mass and, hence, the time necessary
  • Solder Reflow Recommendation
    Lead-free soldering techniques have been available for some years. However, they do not always meet the same physical criteria for attachments as alloys containing lead. In the past, the most common alloy for joining electronic components was the mixture of 63% tin and 37% lead. This composition
  • Dispelling 10 Myths About Nitrogen Reflow (.pdf)
    In my twenty years in the electronics manufacturing industry, I have heard a lot of claims made about the use of nitrogen in inerted soldering processes: many of them completely wrong. In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain
  • Investigation for Use of Pin in Paste Reflow Process with Combination of Solder
    The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several advantages compared to the traditional wave soldering process. One of the primary advantages is lowering
  • What is the Soldering Profile for Lead Free Solder?
    MOTIEN's converter is suitable for the PCB mountable operation and not suitable for Reflow / Vapor phase soldering like SMD products, the recommend is wave flow soldering.
  • Soldering three fuse caps simultaneously [IH]
    Soldering three fuse caps simultaneously to reflow lead free solder and make a joint between the fuse cap and fuse wire guide...

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  • Advanced Flip Chip Packaging
    … c) Solder balls caught by liquid droplets; (d, e) Coating flux on the soldering substrate; (f) Align microgripper onto the solder substrate; (g) Solder balls were caught by the flux layer on the soldering substrate; (h) Reflowing solder ball to form bumps.
  • Lead-Free Electronic Solders
    This also gives a reason for the adoption of the low melting temperature alloys, i.e., Sn–Zn, Sn– Ag–Bi, and Sn–Ag–In for reflow soldering .
  • Lead-free Electronics
    105 Summary of alloy selection for reflow soldering ...
  • Solder Joint Reliability Assessment
    These industry-defined research-based problems related to solder joint reliability assessment include solder reflow cooling, temperature cycling, and mechanical fatigue of a test assembly with BGA solder joints, JEDEC board-level drop test, and shear fatigue of reflowed solder specimen.
  • Printed Circuits Handbook, Sixth Edition > SOLDERING TECHNIQUES
    The two most common of these methods are oven reflow soldering and wave soldering.
  • Nanopackaging
    Reflow soldering was performed in a programmable oven.