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Parts by Number for Resin Top

Part # Distributor Manufacturer Product Category Description
RESIN National Microchip POLY Not Provided 3M#3796
RESIN8 National Microchip Not Provided Not Provided Not Provided
44RESIN66CORE6337031D ASAP Semiconductor KESTER Not Provided Not Provided
MNR04MOAPJ102 (MOAP=RESIN COATING) National Microchip ROHM Not Provided Electronic Component
CAP CERAMIC RESIN COATED 102 National Microchip UNKNOWN Not Provided Not Provided
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Conduct Research Top

  • Post Curing Thermoset Resins
    Last July, we discussed the importance of temperature control when casting with thermoset resins. In this article, we will focus on the post cure process for molds or parts made of thermoset resins. Post curing is the process of exposing a part or mold to elevated temperatures to speed up
  • Advantages of Uniform Particle Sized Ion Exchange Resins
    The technology for the manufacture of ion exchange resins has changed little since the development of the first synthetic styrene-divinylbenzene resins in the 40's. The production of resins in a stirred reactor results in the formation of resin beads with a polydispersed particle-sized distribution
  • Phenolic Resins
    Phenolic resins are thermosetting molding compounds and adhesives that offer strong bonds and good resistance to high temperatures. Phenolic or phenol formaldehyde, urea formaldehyde, furan and melamine resins fit into this category.  Phenolic resin adhesives made from chemicals of the phenol group
  • Unfilled Resins
    Raw materials or unfilled resins do not contain any additional modifiers such as fillers, colorants, dispersants, plasticizers, wetting agents, levelers or defoamers. Unfilled resins are used as starting components or raw materials for the production of finished plastic resins, elastomers
  • The Advantages of Uniform Particle Sized Ion Exchange Resins (.pdf)
    styrene-divinylbenzene resins in the 40's. The production of resins in a stirred reactor results in the formation of resin beads with a polydispersed particle-sized distribution. Although new resin product development has been limited by this manufacturing process, ion exchange process application
  • PRINTED CIRCUIT BOARD LAMINATING RESIN CURE
    Epoxy-glass laminate constructions are used in the majority of rigid printed circuit boards. The epoxy resin cure and resulting mechanical properties are very dependent upon the accurate formulation of the glass laminate resin coating solution. ANALYZE. (480) 814-8200 | Contact Information. ISO
  • PE Resin / Polyolefins / Bulk Polymer Compounding
    There are a number of well known PE polymerization licenses which are applied in 80% of the world's PE Base Resin production lines. The main licenses are Unipol, Himont and Borstar. Two examples are shown at right. In each case there is a continuous stream of PE powder (fluff) being produced, which
  • Epoxy (EP) Resins
    . Depending on the formulation, epoxy resins are used as casting resins, potting agents, resin binders, or laminating resins in fiberglass or composite construction. Epoxy (EP) resins are also used as encapsulants, electrical conductors in microelectronic packaging, and adhesives in structural bonding

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